JPS5858593B2 - ホウネツソウチ - Google Patents

ホウネツソウチ

Info

Publication number
JPS5858593B2
JPS5858593B2 JP50019718A JP1971875A JPS5858593B2 JP S5858593 B2 JPS5858593 B2 JP S5858593B2 JP 50019718 A JP50019718 A JP 50019718A JP 1971875 A JP1971875 A JP 1971875A JP S5858593 B2 JPS5858593 B2 JP S5858593B2
Authority
JP
Japan
Prior art keywords
sealed
heat
heating element
pipe
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50019718A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5195652A (enrdf_load_stackoverflow
Inventor
幹和 内田
美智雄 梁取
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50019718A priority Critical patent/JPS5858593B2/ja
Publication of JPS5195652A publication Critical patent/JPS5195652A/ja
Publication of JPS5858593B2 publication Critical patent/JPS5858593B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP50019718A 1975-02-19 1975-02-19 ホウネツソウチ Expired JPS5858593B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50019718A JPS5858593B2 (ja) 1975-02-19 1975-02-19 ホウネツソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50019718A JPS5858593B2 (ja) 1975-02-19 1975-02-19 ホウネツソウチ

Publications (2)

Publication Number Publication Date
JPS5195652A JPS5195652A (enrdf_load_stackoverflow) 1976-08-21
JPS5858593B2 true JPS5858593B2 (ja) 1983-12-26

Family

ID=12007068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50019718A Expired JPS5858593B2 (ja) 1975-02-19 1975-02-19 ホウネツソウチ

Country Status (1)

Country Link
JP (1) JPS5858593B2 (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7206063A (nl) * 1972-05-04 1973-11-06 N.V. Philips Gloeilampenfabrieken Verwarmingsinrichting
US3831664A (en) * 1973-11-07 1974-08-27 Boeing Co Heat pipe interfaces

Also Published As

Publication number Publication date
JPS5195652A (enrdf_load_stackoverflow) 1976-08-21

Similar Documents

Publication Publication Date Title
US5508884A (en) System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind
US20080202729A1 (en) Heat sink
US3673306A (en) Fluid heat transfer method and apparatus for semi-conducting devices
JPS5858593B2 (ja) ホウネツソウチ
JP3403307B2 (ja) ヒートスプレッダとそれを用いた冷却器
CN203537724U (zh) 散热装置
JP2557812B2 (ja) 放熱用壁構造
CN212132715U (zh) 空调室外机和空调器
CN104427824B (zh) 散热装置
TWI507653B (zh) 散熱單元
JPS5855338Y2 (ja) 熱伝搬装置
TWM477602U (zh) 散熱單元
JPS6125570Y2 (enrdf_load_stackoverflow)
JPH04196154A (ja) 半導体冷却装置
JPS5932852Y2 (ja) 放熱装置
CN220139999U (zh) 一种散热器
JP2000018853A (ja) 板型ヒートパイプを用いた冷却構造
JPH0645172Y2 (ja) 膜式ヒートパイプ熱交換器
JPS5826453Y2 (ja) 真空装置内の発熱体冷却装置
JPS6028914Y2 (ja) 太陽熱集熱器
JPH0476995A (ja) 電子機器等発熱物冷却装置
JPH07176661A (ja) ヒートシンク
JPS5869361A (ja) 太陽熱集熱器
JPH08178559A (ja) 熱交換装置
JP2002357393A (ja) 液冷型半導体モジュール