JPS5858338U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5858338U JPS5858338U JP8462682U JP8462682U JPS5858338U JP S5858338 U JPS5858338 U JP S5858338U JP 8462682 U JP8462682 U JP 8462682U JP 8462682 U JP8462682 U JP 8462682U JP S5858338 U JPS5858338 U JP S5858338U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- semiconductor
- semiconductor equipment
- metal
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図は従来のインターナルバッファー電極の
固定構造図、第３図は、本考案によるイ 。
ンターナルバツファー電極の固定構造図、第４図、第５
図は、本考案によるインターナルバッファー電極の固定
構造の変形例を示す図面である。
１・・・銅カバー、２・・・インターナルバッファー電
極、３・・・接合表面安定材、４・・・銅ベース、５・
・・半田層、６・・・接合支持板、７・・・セラミック
シール、８・・・半導体接合基板、９・・・銅カバー凸
部、１０・・・固定用小穴、１１・・・インターナルバ
ッファー電極凸部、１２・・・銅カバー凹部、１３・・
・リード線。Figures 1 and 2 are diagrams of the fixed structure of a conventional internal buffer electrode, and Figure 3 is a diagram of the fixed structure of the internal buffer electrode according to the present invention. Fixed structure diagram of internal buffer electrode, Figures 4 and 5
The figure is a diagram showing a modification of the internal buffer electrode fixing structure according to the present invention. DESCRIPTION OF SYMBOLS 1... Copper cover, 2... Internal buffer electrode, 3... Joint surface stabilizer, 4... Copper base, 5...
... Solder layer, 6... Bonding support plate, 7... Ceramic seal, 8... Semiconductor bonding board, 9... Copper cover convex portion, 10... Small hole for fixing, 11... Inter Null buffer electrode convex part, 12... Copper cover concave part, 13...
·Lead.
Claims (1)
属製ベースに固着し、半導体接合基板と金属製カバーは
間に固着することなく両者に対して金属製中間緩衝物を
低抵抗接触させ、半導体接合基板に接合表面安定材が設
けられている半導体装置において、上記中間緩衝物と金
属製カバーの一部に互に嵌りあう部分を設けたことを特
徴とする半導体装置。A semiconductor bonding substrate is fixed to a bonding support plate, the bonding support plate is fixed to a metal base, and a metal intermediate buffer is brought into low-resistance contact with the semiconductor bonding substrate and the metal cover without sticking between them. 1. A semiconductor device in which a semiconductor bonding substrate is provided with a bonding surface stabilizer, characterized in that a portion of the intermediate buffer and the metal cover are provided with portions that fit into each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8462682U JPS5858338U (en) | 1982-06-09 | 1982-06-09 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8462682U JPS5858338U (en) | 1982-06-09 | 1982-06-09 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5858338U true JPS5858338U (en) | 1983-04-20 |
Family
ID=29879969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8462682U Pending JPS5858338U (en) | 1982-06-09 | 1982-06-09 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5858338U (en) |
-
1982
- 1982-06-09 JP JP8462682U patent/JPS5858338U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5858338U (en) | semiconductor equipment | |
| JPS5918488U (en) | Board holding structure for electronic equipment | |
| JPS60167347U (en) | semiconductor equipment | |
| JPS58120662U (en) | Chippukiyariya | |
| JPS602841U (en) | semiconductor mounting board | |
| JPS5916147U (en) | semiconductor equipment | |
| JPS5889946U (en) | semiconductor equipment | |
| JPS6037240U (en) | hybrid integrated circuit | |
| JPS5853147U (en) | semiconductor equipment | |
| JPS6133464U (en) | Aluminum base board | |
| JPS6054330U (en) | semiconductor equipment | |
| JPS5926262U (en) | electronic equipment | |
| JPS5964249U (en) | thermal head | |
| JPS5883148U (en) | semiconductor equipment | |
| JPS60129141U (en) | semiconductor equipment | |
| JPS58147278U (en) | Hybrid integrated circuit device | |
| JPS6096831U (en) | semiconductor chip | |
| JPS58159741U (en) | semiconductor equipment | |
| JPS59151450U (en) | semiconductor equipment | |
| JPS5899841U (en) | semiconductor equipment | |
| JPS609226U (en) | Package for semiconductor mounting | |
| JPS5972729U (en) | semiconductor equipment | |
| JPS6013744U (en) | Hybrid integrated circuit device | |
| JPS58120649U (en) | semiconductor equipment | |
| JPS5897837U (en) | semiconductor equipment |