JPS5857767A - レ−ザ装置 - Google Patents

レ−ザ装置

Info

Publication number
JPS5857767A
JPS5857767A JP56157243A JP15724381A JPS5857767A JP S5857767 A JPS5857767 A JP S5857767A JP 56157243 A JP56157243 A JP 56157243A JP 15724381 A JP15724381 A JP 15724381A JP S5857767 A JPS5857767 A JP S5857767A
Authority
JP
Japan
Prior art keywords
light
laser
optical fiber
light source
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56157243A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6259918B2 (zh
Inventor
Hiromasa Ishiwatari
石渡　裕政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56157243A priority Critical patent/JPS5857767A/ja
Publication of JPS5857767A publication Critical patent/JPS5857767A/ja
Publication of JPS6259918B2 publication Critical patent/JPS6259918B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/0014—Monitoring arrangements not otherwise provided for

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Lasers (AREA)
  • Laser Surgery Devices (AREA)
  • Surgical Instruments (AREA)
  • Laser Beam Processing (AREA)
JP56157243A 1981-10-01 1981-10-01 レ−ザ装置 Granted JPS5857767A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56157243A JPS5857767A (ja) 1981-10-01 1981-10-01 レ−ザ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56157243A JPS5857767A (ja) 1981-10-01 1981-10-01 レ−ザ装置

Publications (2)

Publication Number Publication Date
JPS5857767A true JPS5857767A (ja) 1983-04-06
JPS6259918B2 JPS6259918B2 (zh) 1987-12-14

Family

ID=15645370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56157243A Granted JPS5857767A (ja) 1981-10-01 1981-10-01 レ−ザ装置

Country Status (1)

Country Link
JP (1) JPS5857767A (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232866A (ja) * 1985-04-05 1986-10-17 松下電器産業株式会社 レ−ザ−照射装置
JPS62268550A (ja) * 1986-05-12 1987-11-21 ジ−ブイ　メデイカル，インコ−ポレ−テツド レーザ付透視用血管成形カテーテル装置
JPH02258185A (ja) * 1989-03-31 1990-10-18 Hoya Corp レーザ装置
JP2008077003A (ja) * 2006-09-25 2008-04-03 Sony Corp 光モジュール
US7396742B2 (en) 2000-09-13 2008-07-08 Hamamatsu Photonics K.K. Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US8865566B2 (en) 2002-12-03 2014-10-21 Hamamatsu Photonics K.K. Method of cutting semiconductor substrate
CN106862760A (zh) * 2015-12-11 2017-06-20 中国航空工业集团公司北京航空制造工程研究所 一种可自动切换光路的激光传输系统

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61232866A (ja) * 1985-04-05 1986-10-17 松下電器産業株式会社 レ−ザ−照射装置
JPS62268550A (ja) * 1986-05-12 1987-11-21 ジ−ブイ　メデイカル，インコ−ポレ−テツド レーザ付透視用血管成形カテーテル装置
JPH0467979B2 (zh) * 1986-05-12 1992-10-30 Jii Bui Medeikaru Inc
JPH02258185A (ja) * 1989-03-31 1990-10-18 Hoya Corp レーザ装置
US7547613B2 (en) 2000-09-13 2009-06-16 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US7396742B2 (en) 2000-09-13 2008-07-08 Hamamatsu Photonics K.K. Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object
US8946591B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of manufacturing a semiconductor device formed using a substrate cutting method
US10796959B2 (en) 2000-09-13 2020-10-06 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US7592238B2 (en) 2000-09-13 2009-09-22 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US7615721B2 (en) * 2000-09-13 2009-11-10 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US7626137B2 (en) 2000-09-13 2009-12-01 Hamamatsu Photonics K.K. Laser cutting by forming a modified region within an object and generating fractures
US9837315B2 (en) 2000-09-13 2017-12-05 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8946592B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8937264B2 (en) 2000-09-13 2015-01-20 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US9553023B2 (en) 2002-03-12 2017-01-24 Hamamatsu Photonics K.K. Substrate dividing method
US9142458B2 (en) 2002-03-12 2015-09-22 Hamamatsu Photonics K.K. Substrate dividing method
US9287177B2 (en) 2002-03-12 2016-03-15 Hamamatsu Photonics K.K. Substrate dividing method
US9543256B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9543207B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9548246B2 (en) 2002-03-12 2017-01-17 Hamamatsu Photonics K.K. Substrate dividing method
US8889525B2 (en) 2002-03-12 2014-11-18 Hamamatsu Photonics K.K. Substrate dividing method
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method
US9711405B2 (en) 2002-03-12 2017-07-18 Hamamatsu Photonics K.K. Substrate dividing method
US10622255B2 (en) 2002-03-12 2020-04-14 Hamamatsu Photonics K.K. Substrate dividing method
US10068801B2 (en) 2002-03-12 2018-09-04 Hamamatsu Photonics K.K. Substrate dividing method
US8865566B2 (en) 2002-12-03 2014-10-21 Hamamatsu Photonics K.K. Method of cutting semiconductor substrate
JP2008077003A (ja) * 2006-09-25 2008-04-03 Sony Corp 光モジュール
CN106862760A (zh) * 2015-12-11 2017-06-20 中国航空工业集团公司北京航空制造工程研究所 一种可自动切换光路的激光传输系统

Also Published As

Publication number Publication date
JPS6259918B2 (zh) 1987-12-14

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