JPS5855652Y2 - 光半導体装置 - Google Patents

光半導体装置

Info

Publication number
JPS5855652Y2
JPS5855652Y2 JP1977029602U JP2960277U JPS5855652Y2 JP S5855652 Y2 JPS5855652 Y2 JP S5855652Y2 JP 1977029602 U JP1977029602 U JP 1977029602U JP 2960277 U JP2960277 U JP 2960277U JP S5855652 Y2 JPS5855652 Y2 JP S5855652Y2
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
envelope
light
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977029602U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53124654U (cg-RX-API-DMAC10.html
Inventor
裕 永沢
俊博 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1977029602U priority Critical patent/JPS5855652Y2/ja
Publication of JPS53124654U publication Critical patent/JPS53124654U/ja
Application granted granted Critical
Publication of JPS5855652Y2 publication Critical patent/JPS5855652Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1977029602U 1977-03-14 1977-03-14 光半導体装置 Expired JPS5855652Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977029602U JPS5855652Y2 (ja) 1977-03-14 1977-03-14 光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977029602U JPS5855652Y2 (ja) 1977-03-14 1977-03-14 光半導体装置

Publications (2)

Publication Number Publication Date
JPS53124654U JPS53124654U (cg-RX-API-DMAC10.html) 1978-10-04
JPS5855652Y2 true JPS5855652Y2 (ja) 1983-12-20

Family

ID=28877679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977029602U Expired JPS5855652Y2 (ja) 1977-03-14 1977-03-14 光半導体装置

Country Status (1)

Country Link
JP (1) JPS5855652Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2553342Y2 (ja) * 1989-12-08 1997-11-05 シャープ株式会社 発光ダイオードランプ

Also Published As

Publication number Publication date
JPS53124654U (cg-RX-API-DMAC10.html) 1978-10-04

Similar Documents

Publication Publication Date Title
US8541871B2 (en) Multilayered lead frame for a semiconductor light-emitting device
US6593598B2 (en) Chip-type light-emitting device with case
US6906459B2 (en) Light emitting diode
JPH0249021B2 (cg-RX-API-DMAC10.html)
US5608260A (en) Leadframe having contact pads defined by a polymer insulating film
JP3940124B2 (ja) 装置
US6519845B1 (en) Wire bonding to dual metal covered pad surfaces
US4590672A (en) Package for electronic device and method for producing same
JPS5855652Y2 (ja) 光半導体装置
US4595603A (en) Method of making diamond heatsink assemblies
JP2989703B2 (ja) チップ部品型発光ダイオード
JPS6118185A (ja) 光半導体装置用リ−ドフレ−ム
US5006143A (en) Method of producing a joined article through bonding with low melting point glass
JPH09135040A (ja) 発光ダイオード
US6228669B1 (en) Planar mount LED element and method for manufacturing the same
JP2506452Y2 (ja) 側面発光表示装置
JPH03198368A (ja) 半導体装置
JPS62154658A (ja) 半導体装置用リ−ドフレ−ムの製造方法
JP2002324912A (ja) 発光ダイオードチップ及びこれを用いた発光ダイオードランプ
JPS57139949A (en) Resin sealing type semiconductor device
JPS60136382A (ja) 光半導体装置
JPS63142661A (ja) 半導体装置
JPS5967663A (ja) 半導体装置
JPS58123744A (ja) リ−ドフレ−ム及び半導体装置の製造方法
JPH01276749A (ja) 半導体素子の突起電極