JPS5854716A - Dip type piezoelectric oscillator - Google Patents

Dip type piezoelectric oscillator

Info

Publication number
JPS5854716A
JPS5854716A JP15290581A JP15290581A JPS5854716A JP S5854716 A JPS5854716 A JP S5854716A JP 15290581 A JP15290581 A JP 15290581A JP 15290581 A JP15290581 A JP 15290581A JP S5854716 A JPS5854716 A JP S5854716A
Authority
JP
Japan
Prior art keywords
spacers
window
spacer
dip type
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15290581A
Other languages
Japanese (ja)
Inventor
Sumio Yamada
澄夫 山田
Yoshiaki Fujiwara
嘉朗 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15290581A priority Critical patent/JPS5854716A/en
Publication of JPS5854716A publication Critical patent/JPS5854716A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Abstract

PURPOSE:To improve the vibration-resistance and to obtain DIP type arrangement of lead terminals, by insert-holding a lead frame of a piezoelectric oscillation element with spacers, and coupling the frame with a glass of low melting point. CONSTITUTION:A piezoelectric oscillation element 7 is supported with lead frames 8, 8', which are inserted and held with two ceramic-made spacers 9, 9' having a larger window than the element 7 and located so that the oscillator 7 can be positioned at the center of the window of the spacers 9 and 9'. The lead frames 8, 8' and the spacer 9, 9' are bonded with a low melting point glass 10. The outside of the window of the spacers 9, 9' is sealed with resin and ceramic plates 11 and 11'.

Description

【発明の詳細な説明】 不発明はD I P型(デュアル・インライン・パッケ
ージ)圧電振動子に関する。
DETAILED DESCRIPTION OF THE INVENTION The invention relates to a DIP type (dual in-line package) piezoelectric vibrator.

従来より通信用電子機器等に用いられているフィルタ、
共振回路等には圧電振動素子を応用した圧電振動子が用
いられている。この圧電振動子は従来第1図に示す如く
、1モ電材料で形成した基板1の両面に電極2.2′を
形成し、この電極の引出し部をペース3に設けられた成
句ビン4.4′にて支持し、外部をケース5にて覆いペ
ース3と接合して封止している。このJ:うに構成され
た圧電振動子は、回路に組込むときは高さを低くするた
め、リード端子6.6′を90°曲げケース5が横にな
るようにしてプリント板に(ハ載している。このように
搭載すると基板を支える取付ピン4.4′が水平と々る
ため耐振性が悪く々り故障発生の原因となる。−まだI
Cとし)っしょに使用する場合にはリード端子の取付ピ
ッチ寸法が異なるという欠点もある。本発明はこれらの
欠点を除き、耐振性がiしり、且つ端子をIC化した圧
電振動子を提供することを目的とするものでiちる。
Filters traditionally used in communication electronic equipment, etc.
A piezoelectric vibrator, which is an application of a piezoelectric vibrating element, is used in a resonant circuit or the like. As shown in FIG. 1, this piezoelectric vibrator conventionally has electrodes 2 and 2' formed on both sides of a substrate 1 made of a monoelectric material, and a lead-out portion of the electrode 4. 4', and the outside is covered with a case 5, which is joined to the paste 3 and sealed. In order to reduce the height of this piezoelectric vibrator configured as J: when it is assembled into a circuit, the lead terminals 6 and 6' are bent by 90 degrees and the case 5 is placed on a printed board (H). If mounted in this way, the mounting pins 4 and 4' that support the board will be horizontal, resulting in poor vibration resistance and causing damage.
When used together with C), there is also the drawback that the mounting pitch dimensions of the lead terminals are different. It is an object of the present invention to eliminate these drawbacks and provide a piezoelectric vibrator which has excellent vibration resistance and whose terminals are integrated circuits.

このため本発明のI) I P型圧電振動子Vこb・い
ては、リードフレームに支持された圧電振動素子を、該
振動素子より犬なる窓をイイする2枚のスペーサにてリ
ードフレームの画商より1央み低融点ガラスにて接合し
、さらにスペーサの窓部外面を樹脂又はセラミック板に
て封止してガること全特徴とするものである。
For this reason, in the I) I P type piezoelectric vibrator of the present invention, the piezoelectric vibrating element supported by the lead frame is separated from the lead frame by two spacers that have a smaller window than the vibrating element. The main feature is that the spacer is bonded in the center with low-melting glass from an art dealer, and the outer surface of the window portion of the spacer is sealed with a resin or ceramic plate.

以下、添付図面に基づいて本発明の′丸施例につき詳細
に説明する。
Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings.

第2図に第1の実施例を示す。図において符号7は圧電
振動素子、8.8’は端子を兼ねたリードフレーム、9
.9’はスペーサ、10は低融点ガラス、11.11’
は樹脂又はセラミック板である。
FIG. 2 shows a first embodiment. In the figure, numeral 7 is a piezoelectric vibrating element, 8.8' is a lead frame that also serves as a terminal, and 9
.. 9' is a spacer, 10 is a low melting point glass, 11.11'
is a resin or ceramic plate.

第3図は第2図のIll −Ill線における1新面図
であり、圧電振動素子7けり−ドフレーム8.8′に支
持されており、そのリードフレーム8.8′は圧電撮動
素子7よりも太々る窓を有する2枚のセラミック製のス
ペーサ9.9′で挾持され、圧電振動子7がスペーサ9
.9′の窓部の中央に位置するよう((シてリードフレ
ーム8.8′とスペーサ9.9′は低融点ガラス1(l
こより接合されている。さらにスペーサ9.9′の窓部
外側は樹脂又はセラミック板11.11’で封止されて
いる。
FIG. 3 is a new view taken along the Ill--Ill line in FIG. The piezoelectric vibrator 7 is sandwiched between two ceramic spacers 9 and 9' having a window thicker than the spacer 9.
.. The lead frame 8.8' and the spacer 9.9' are placed in the center of the window section 9'.
It is joined by this. Further, the outside of the window portion of the spacer 9.9' is sealed with a resin or ceramic plate 11.11'.

このように構成された本実施例は、スペーサから圧電振
動素子址でのリードフレームの長さを短かくすることが
できるので耐振性に有利であり、また端子がスペーサの
両側に設けることができるのでDIP型とすることが可
能となる。
This embodiment configured in this manner is advantageous in terms of vibration resistance because the length of the lead frame from the spacer to the piezoelectric vibrating element can be shortened, and terminals can be provided on both sides of the spacer. Therefore, it is possible to use a DIP type.

次に第2の実施例の斜視図を第4図に、第4図のV−■
線における断面図を第5図に示す。本実施例は、Rfコ
ンバーク々どのような1回路内に振動子を2個便月1す
るものに適したもので、ちり、2個の圧電振動素子7.
7′はり一ドフ1/−ム8゜8′及び8a、8’aによ
シそれぞれ支IQ+されており、そのリードフレーム8
 、8’&jスペー型(l 、 I)/(1こより、ま
たリードフレーム8a、8’al、スペーサ9′及び9
“によりそれぞれ支持され、2個の)北電振動累子7.
7′が一部を重ねて(但し素子間のすき間はスペーサ9
′のlさ分がある。)スペーサの窓F’;B内にイ立1
谷するようにしてリードフレーム8 、8’ 。
Next, a perspective view of the second embodiment is shown in FIG.
A cross-sectional view along the line is shown in FIG. This embodiment is suitable for an Rf converter that uses two vibrators in one circuit, and is suitable for any Rf converter that uses two piezoelectric vibrators in one circuit.
7' beam 1/-m 8° 8' and 8a, 8'a are each supported by IQ+, and the lead frame 8
, 8'&j space type (l, I)/(1 strand, lead frame 8a, 8'al, spacer 9' and 9
"Hokuden vibrator 7.
7' are partially overlapped (however, the gap between the elements is filled with spacer 9)
There is a length of '. ) Spacer window F'; 1 in B
Lead frames 8 and 8' are formed into valleys.

8a、8’aとスペーサ9.9’、9“とが低融点ガラ
ス1.0.10’によや接合されている。そしてスペー
サ9及び9”の窓部l(側は41111t’r 4fM
又はセラミック板11.11’で封止され−Cいる3、
このように構成された本実#fj例fL−」:、Ai+
実施例と同様な効果を有する一部に、+”+ii実施例
より(ffiかに大きい体積内に2個の圧電振動素子の
実装を酊1氾としたオリ点を有する。
8a, 8'a and spacers 9.9', 9'' are bonded to the low melting point glass 1.0.10'.
or sealed with a ceramic plate 11.11' -C3,
The real #fj example fL−” configured in this way:, Ai+
In addition to having the same effects as those of the embodiment, the present invention has an advantage of mounting two piezoelectric vibrating elements in a much larger volume than the +''+ii embodiment.

次に第3の実施例を第6図の斜視図及び第7図の断面図
により示す。本実施例は第2の実施例と同様に2個の圧
電振動素子を実装したものであるが、異なるととろけ一
方の振動素子7に対して他方の振動素子7′ヲ裏返しに
したものである。このように構成すると2組のリードフ
レーム8,8′と8 a 、 8’aとは同一平面でス
ペーサ9.9′により挾持しても振動素子間にはリード
フレームの厚さ分のすき丑ができるため第2の実施例よ
りもスペーサが1枚少々くてもよく構造が簡単となる。
Next, a third embodiment will be shown with a perspective view in FIG. 6 and a sectional view in FIG. 7. This embodiment has two piezoelectric vibrating elements mounted in the same way as the second embodiment, but if it is different, one vibrating element 7 is turned over compared to the other vibrating element 7'. . With this configuration, even if the two sets of lead frames 8, 8' and 8a, 8'a are on the same plane and are sandwiched between the spacers 9 and 9', there is a gap equal to the thickness of the lead frames between the vibrating elements. Therefore, the structure is simpler than the second embodiment since it requires one less spacer.

なお効果の点については第2の実施例と全く同様である
Note that the effect is exactly the same as the second embodiment.

以上説明した如く本発明のDIP型圧電振動子は圧電振
動素子のリードフレームをスペーサにより挾持して低融
点ガラスにて結合することにより、耐振性が大きく、且
つそのリード端子の配tをDIP型とすることを可能と
したものである。
As explained above, the DIP type piezoelectric vibrator of the present invention has high vibration resistance by sandwiching the lead frame of the piezoelectric vibrating element with spacers and bonding with low melting point glass, and has a DIP type piezoelectric vibrator with a lead terminal arrangement. This makes it possible to do this.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の圧電振動子の1例の斜視図、第2図は本
発明にかかる第1の実施例のDIP型圧電振動子の斜視
図、第3図は第2図の■−■線における断面図、第4図
は第2の実施例の斜視図、第5図は第4図のV−v線に
おける断面図、第6図は第3の実施例の斜視図、第7図
Q−1、第6図の)111−■線Vこおける断面図であ
る。 7.7′・・・圧電振動素子、8.8’、8a、8’a
・・・リードフレーム、9.9’、9’・・スペーサ、
10゜10’・・・低融点ガラス、11.11’・・]
☆↑脂板又はセラミック板、。 特許出願人 富士通株式会社 特許出願代理人 弁理士 青 木   朗 弁理士西舘和之 弁理士 内 11」  幸 男 弁理士 山 口 昭 之 第6図 第7図
FIG. 1 is a perspective view of an example of a conventional piezoelectric vibrator, FIG. 2 is a perspective view of a DIP type piezoelectric vibrator according to the first embodiment of the present invention, and FIG. 4 is a perspective view of the second embodiment, FIG. 5 is a sectional view taken along line V-v in FIG. 4, FIG. 6 is a perspective view of the third embodiment, and FIG. Q-1 is a sectional view taken along line V)111--■ in FIG. 6. 7.7'...piezoelectric vibration element, 8.8', 8a, 8'a
...Lead frame, 9.9', 9'...Spacer,
10°10'...Low melting point glass, 11.11'...]
☆↑ Grease board or ceramic board. Patent applicant Fujitsu Limited Patent agent Akira Aoki Patent attorney Kazuyuki Nishidate Patent attorney Yukio Akira Yamaguchi (11) Figure 6 Figure 7

Claims (1)

【特許請求の範囲】[Claims] 1、リードフレームに支持された圧電振動素子を、該振
動素子より犬なる窓を有する2枚のスペーサにてリード
フレームの両面より挾み、低融点ガラスにて接合し、ス
ペーサの窓部外面を樹脂又はセラミック板にて封止して
なることを特徴とするDIP型圧電振動子。
1. A piezoelectric vibrating element supported by a lead frame is sandwiched between two spacers each having a window extending from the vibrating element from both sides of the lead frame, and the outer surface of the window of the spacer is bonded with low melting glass. A DIP type piezoelectric vibrator characterized by being sealed with a resin or ceramic plate.
JP15290581A 1981-09-29 1981-09-29 Dip type piezoelectric oscillator Pending JPS5854716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15290581A JPS5854716A (en) 1981-09-29 1981-09-29 Dip type piezoelectric oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15290581A JPS5854716A (en) 1981-09-29 1981-09-29 Dip type piezoelectric oscillator

Publications (1)

Publication Number Publication Date
JPS5854716A true JPS5854716A (en) 1983-03-31

Family

ID=15550693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15290581A Pending JPS5854716A (en) 1981-09-29 1981-09-29 Dip type piezoelectric oscillator

Country Status (1)

Country Link
JP (1) JPS5854716A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0222272A2 (en) * 1985-11-07 1987-05-20 Schott Glaswerke Flat housing for hermetically enclosing piezo-electric components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0222272A2 (en) * 1985-11-07 1987-05-20 Schott Glaswerke Flat housing for hermetically enclosing piezo-electric components

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