JPH07231237A - Multiple mode crystal vibrator and crystal vibrator - Google Patents

Abstract

PURPOSE:To obtain a multiple mode crystal vibrator and the crystal vibrator with excellent shock resistance in which wire bonding is implemented safely. CONSTITUTION:The multiple mode vibrator is formed by sealing a crystal chip 1 into an enclosed package 2. Split input output electrodes are formed to one side of the crystal chip 1 and a common electrode is formed to the other side. The enclosed package 2 is formed by applying seam welding of a metallic cover 10 to a package main body 9 of a recessed lamination structure. The package main body 9 is made up of a base 11, a frame 12 and a welding ring 13. Support sections 14, 15 are provided to both ends of the base 11 and conductive paths 16, 17 for input output are led out to an outer side face as external terminals. Furthermore, a shield electrode 18 is provided to the center. The support sections 14, 15 are formed to be a multi-layer structure and the metallic over 10 connects to ground. A major side of the crystal chip 1 is fixed to the support sections 14,15 at two points by using a conductive adhesives 20 in opposition to the base 11. A gap between the crystal chip 1 and the base 11 is kept by the thickness of the conductive adhesives 20 and excitation is not hindered and the shock resistance is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field of application of a crystal resonator, and more particularly to improvement in deriving an electrode by wire bonding of a multimode crystal resonator (hereinafter referred to as "multimode resonator").

[0002]

BACKGROUND OF THE INVENTION A multimode oscillator obtains a predetermined filter characteristic by utilizing acoustic coupling between, for example, two pairs of electrodes formed on a crystal element, a so-called MCF (Monolithic Crystal).
Filter) is used for communication equipment. In recent years, multimode oscillators for surface mounting have been sought, as represented by resistors and capacitors (see Japanese Patent Application Nos. 1-83007 and 4-46008, etc.).

[0003]

2. Description of the Related Art FIGS. 7 to 9 are views for explaining such a multimode oscillator. FIG. 7 is a sectional view of the same and FIG.
b) is a front and back view of the crystal piece, and FIG. 9 is a plan view of an insulating substrate (hereinafter referred to as a substrate). The multimode oscillator is formed by enclosing the crystal blank 1 in the closed container 2. The crystal piece 1 is, for example, AT-cut in a thickness-shear vibration mode. Separated input / output excitation electrodes (input / output electrodes) 3 and 4 are formed on one main surface 1a, and a common excitation electrode (common electrode) 5 is formed on the other main surface 1b. From the input / output electrodes 3, 4 and the common electrode 5, the extraction electrodes 6, 7, 8 (a
Extend b). The closed container 2 is formed by seam welding a metal lid 10 to a container body 9 having a concave laminated structure. The container body 9 includes a substrate 11, a frame 12, and a welding ring 13. On both surfaces of both end portions of the substrate 11, holding portions 14 and 15 made of a metal film layer are provided in the width direction, and conductive paths 16 and 17 for input and output extend from one diagonal direction to the outer surface. Further, a shield electrode (common electrode) 18 having a reference potential is provided in the central portion, and a conductive path 19 (ab) for shield electrode is provided.
Extend from the other diagonal direction to the outer surface. The conductive paths 16, 17, 19 (ab) extending to these outer surfaces serve as external terminals for surface mounting. The holding portions 14 and 15 are formed as a multi-layered structure by printing, for example, and the thickness thereof is set large. The metal lid 10 is grounded. Then, one main surface 1 a of the crystal blank 1 is held so as to face the substrate 11. That is, the diagonal portion where the input / output extraction electrodes 6 and 7 are formed is held by the holding portion 1 with the conductive adhesive 20.
It is fixed on Nos. 4 and 15 to hold two points at both ends. Also,
One end of the thin metal wire 22 is connected by wire bonding to the common lead-out electrode on the other main surface 1b, for example, the electrode lead-out point 21 of 8a, and the other end is connected to the electrode lead-in point 23 of the shield electrode 18 (conductive path 19a). In such a case, since the holding portions 14, 15 and the thickness of the conductive adhesive 20 cause a gap between the crystal blank 1 and the substrate 11 (shield electrode 18) to a degree that does not hinder the excitation, the excitation is performed. Promotes miniaturization without the use of other retainers. In addition, since the holding positions are diagonally opposite to each other at both ends, impact resistance is improved, and the path is lengthened, so that stress generation during contraction or extension of the conductive adhesive 20 is reduced.

[0004]

However, in the structure described above, as shown in FIG. 10, one diagonal part of the crystal blank 1 is fixed at one side in the width direction of the holding portions 14 and 15. Then, a gap G corresponding to the thickness of the conductive adhesive 20 is formed between the other diagonal portion and the other ends of the holding portions 14 and 15. Therefore, the holding stability (balance) of the crystal blank 1 is poor. Then, the electrode lead-out point 2 by wire bonding
1 is the other end side having the gap G of the holding portion 15. Therefore, at the time of wire bonding, there is a problem that the pressing force causes rattling, which hinders the connection of the fine metal wires 22 and damages the crystal piece 1. Further, not only during wire bonding, but also when there is an external impact or the like, there is a possibility that it will swing, and the fixing strength of the conductive adhesive 20 will be reduced, and the impact resistance will be deteriorated. In particular, these problems become more serious as the thickness of the crystal blank 1 becomes smaller as the frequency becomes higher.

[0005]

SUMMARY OF THE INVENTION It is a first object of the present invention to provide a multimode oscillator which prevents breakage of a crystal piece during wire bonding. A second object is to provide a crystal unit having good impact resistance.

[0006]

The basic solution of the present invention is to fill a gap between a substrate and a crystal piece with a conductive adhesive by providing a protrusion. Hereinafter, one embodiment of the present invention will be described together with its operation.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 and 2 are views for explaining one embodiment of the present invention. FIG. 1 is a sectional view of a multimode oscillator and FIG. 2 is a plan view of a substrate. The same parts as those of the previous conventional example are given the same numbers, and the description thereof will be simplified. As described above, the multi-mode oscillator is a crystal piece having the input / output electrodes 3, 4 and the extraction electrodes 6, 7 on one main surface 1a and the common electrode 5 and the extraction electrode 8 (ab) on the other main surface 1b. 1 is enclosed and formed in a closed container 2 including a container body 9 and a metal lid 10. Then, one main surface 1a of the crystal piece 1 is opposed to the substrate 11, and the diagonal portions of the outer peripheral portions of both ends are placed on the holding portions 14 and 15.
The conductive adhesive 20 is fixed in spots to hold two points at both ends. A metal thin wire 22 is formed by wire bonding on the electrode lead-out point 21 of the common extraction electrode 8 on the other main surface 1b.
Is connected to one end and the other end is connected to the electrode introduction point 23 of the shield electrode conductive path 19a (see FIGS. 7 to 9 above).
Then, in this embodiment, the protrusion 24 is provided at a portion of the shield electrode conductive path 19 (ab) extending in the other diagonal direction of the substrate 11 opposite to the other diagonal portion of the crystal blank 1. The protrusion 24 is set to have the same thickness as the conductive adhesive 20. For example, similar to the formation of the holding portions 13 and 14, it is formed by stacking electrode films.

With such a structure, even if one diagonal portion of the crystal blank 1 is fixed to the holding portions 14 and 15 in a point manner, the other diagonal portion abuts on the projecting portion, so that the two The gap can be eliminated. Therefore, this can prevent the quartz piece 1 from rattling, and wire bonding to the electrode lead-out point 21 can be reliably performed without damaging the quartz piece 1. Further, in this embodiment, since the protrusions 24 (ab) are provided on both of the other diagonal portions, it is possible to improve the holding stability and improve the impact resistance.

[0009]

[Other Matters] In the above embodiment, the holding portion 15 on the substrate 11
Has a length equal to the width direction of the crystal piece 1,
As shown in FIG. 7A, the divided second layers 15b ₁ and 15b ₂ are formed on the _first layer 15a of the holding portion 15, and the protrusion 24 is provided on the second layer 15b ₂ on the other end side. Good. Alternatively, any of the first layer 15a and second layer 15b of the holding portion 15 is formed by dividing, it may be pre similarly the protruded portion 24 provided on the second layer 15b ₂ at the other end. In these cases, the holding unit 1
By defining the area of 5b ₁ , the surplus can flow into the gap to control the amount of the conductive adhesive 20, and
The application position can be made clear. The other divided holding portion 15a ₂ in FIG. 3 (b) may be connected to the shield electrode conductive path 19 as shown in FIG. Further, the case where the input / output extraction electrode 8 (ab) extends to one diagonal portion of the crystal blank 1 and the wire bonding is applied to one side of the other diagonal portion has been described. The extended end of 8 (ab) may be located at the outer circumference of both ends, and the position of wire bonding may be located at the outer circumference of both ends. For example, when the four corners of the crystal piece are held and the outer periphery of the central portion in the length direction is used as the electrode lead-out point, the same effect is obtained. Further, the protruding portion 24 is formed by laminating a metal film by printing in view of the current technical trend, but in the future, for example, the substrate 11 may be directly projected. Further, although the crystal piece 1 is provided with a gap with respect to the substrate 11 depending on the thickness of the conductive adhesive 20, it is also possible to apply the one in which the substrate is provided with a recess so as to have a gap as shown in FIG. 5, for example. In short, in order to ensure the wire bonding, the protrusion 24 provided so as to fill the gap with respect to the substrate 11 basically belongs to the technical scope of the present invention. In addition, although the effects during wire bonding have been particularly described using a multimode oscillator as an example, from the viewpoint of increasing the holding stability and improving the impact resistance, it can be applied to crystal oscillators regardless of the multimode oscillator. Applicable. For example, as shown in FIG. 6, when a conductive adhesive is applied to the centers of the outer peripheral portions of both ends to hold two points at both end portions, it is sufficient to provide protrusions on both sides of the outer peripheral portions of both ends. become. And, by this, the holding stability can be enhanced and the impact resistance can be expected to be improved. Reference numerals 25 and 26 in the figure are excitation electrodes, 27 and 2,
Reference numeral 8 is an extraction electrode.

[0010]

As described above, according to the present invention, the gap between the electrode lead-out point where the wire bonding of the crystal element is performed and the substrate, which is made of the conductive adhesive, is filled with the protrusion so that the crystal element is not damaged during wire bonding. It is possible to provide a multi-mode oscillator that prevents it. Further, since the protrusion is provided to fill the gap formed by the conductive adhesive by holding the two end portions at two points, it is possible to provide a crystal unit having improved holding stability and good impact resistance.

[Brief description of drawings]

FIG. 1 is a side sectional view of a multi-mode vibrator for explaining an embodiment of the present invention.

FIG. 2 is a plan view of a substrate for explaining an embodiment of the present invention.

FIG. 3 is a diagram for explaining another embodiment of the present invention, and FIGS. 3 (a) and 3 (b) are cross-sectional views of a multimode oscillator.

FIG. 4 is a partial plan view of a substrate for explaining another embodiment of the present invention.

FIG. 5 is a cross-sectional view of a crystal resonator explaining another application example of the present invention.

FIG. 6 is a diagram for explaining another application example of the present invention, FIG. 6A is a plan view of a crystal piece, and FIG. 6B is a sectional view of a crystal resonator.

FIG. 7 is a sectional view of a multimode oscillator for explaining a conventional example.

FIG. 8 is a diagram for explaining a conventional example, FIG. 8A is a front surface (one main surface) view of a crystal piece, and FIG. 8B is a back surface (other main surface) view.

FIG. 9 is a diagram of a substrate for explaining a conventional example.

FIG. 10 is a side sectional view of a multi-mode oscillator for explaining the problems of the conventional example. 1 crystal piece, 2 container, 3 input electrodes, 4 output electrodes,
5 common electrode, 6, 7 and 8 extraction electrode, 9 container body,
10 metal lid, 11 substrate, 12 frame, 13 welding ring, 14, 15 holding part, 16, 17 conductive path, 1
8 shield electrode, 19 conductive path, 20 conductive adhesive, 21 electrode lead-out point, 22 metal thin wire, 23 electrode lead-in point, 24 protruding part, 25, 26 excitation electrode, 27, 2
8 Extraction electrode.

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[Procedure amendment]

[Submission date] February 7, 1995

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

[Figure 6]

[Figure 7]

FIG. 11

[Figure 8]

[Figure 9]

[Figure 10]

[Procedure 3]

[Document name to be amended] Statement

[Name of item to be corrected] Brief description of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a side cross-sectional view of a multimode oscillator illustrating an embodiment of the present invention.

FIG. 2 is a plan view of a substrate illustrating an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a multimode oscillator for explaining another embodiment of the present invention.

FIG. 4 is a cross-sectional view of a multimode oscillator for explaining another embodiment of the present invention.

FIG. 5 is a partial plan view of a substrate for explaining another embodiment of the present invention.

FIG. 6 is a cross-sectional view of a crystal resonator explaining another application example of the present invention.

7A and 7B are diagrams illustrating another application example of the present invention, FIG. 7A is a plan view of a crystal piece, and FIG. 7B is a sectional view of a crystal resonator.

FIG. 8 is a sectional view of a multimode oscillator for explaining a conventional example.

9A and 9B are views for explaining a conventional example, FIG. 9A is a front surface (one main surface) view of a crystal blank, and FIG. 9B is a back surface (other main surface) view.

FIG. 10 is a diagram of a substrate illustrating a conventional example.

FIG. 11 is a side cross-sectional view of a multimode oscillator for explaining the problems of the conventional example.

[Explanation of symbols] 1 crystal piece, 2 container, 3 input electrode, 4 output electrode,
5 common electrode, 6, 7, 8 extraction electrode, 9 container body, 10 metal lid body, 11 substrate, 12 frame body, 13
Welding ring, 14, 15 Holding part, 16, 17 Conductive path, 18 Shield electrode, 19 Conductive path, 20 Conductive adhesive, 21 Electrode leading point, 22 Metal fine wire, 23 Electrode introducing point, 24 Protruding part, 25, 26 Excitation electrode, 2
7, 28 Extraction electrode

Claims (2)

[Claims] 1. An input / output excitation electrode having extended input / output extraction electrodes is provided on one main surface at both outer peripheral portions, and a common excitation electrode extended with a common extraction electrode is provided on the other main surface at an outer peripheral portion. A quartz piece, an insulating substrate formed with a holding portion formed of a metal film facing the one main surface of the quartz piece and connected to the input / output lead electrode, the input / output lead electrode portion and the holding portion. Point-wise joined,
A multi-mode crystal resonator comprising a conductive adhesive that holds the crystal piece on the insulating substrate, and a fine metal wire wire-bonded to a predetermined position that is an electrode lead-out point of the common extraction electrode, wherein the electrode A multi-mode crystal resonator, wherein a protrusion corresponding to the thickness of the conductive adhesive is provided on the insulating substrate facing the lead-out point. 2. A crystal piece having excitation electrodes on both main surfaces and extending extraction electrodes on the outer circumferences of the ends in opposite directions from the respective excitation electrodes, and one extraction surface facing one main surface of the crystal piece. An insulating substrate formed with a holding part made of a metal film connected to an electrode, and the lead electrode part and the holding part are point-joined to each other, and the conductive adhesive holds the crystal piece on the insulating substrate. A crystal resonator comprising a chemical agent, wherein a protrusion that fills a gap formed by the conductive adhesive is provided on the insulating substrate facing both outer peripheral portions of the crystal piece.