JP2009111124A - Electronic device and package for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device for widening allowable range in fluctuation of each welding condition in seam welding, and to provide a package for the same. <P>SOLUTION: The package for the electronic device includes a package 2 in which an aperture 2f is formed at the one surface, a seam ring 8 arranged to surround the aperture 2f of package 2, a crystal vibration piece 3 stored within the package 2, and a rid 7 that is seam-welded to the seam ring 8 to seal the aperture 2f of package 2. A shape of a corner in the plan view of the seam ring 8 is formed at least of any one of arcs 8a, 8b or a straight line extended along the direction crossing the adjacent two sides, and the shortest distance W2 between the internal shape and the external shape of the corner in the plan view of the seam ring 8 is longer than the shortest distance W1 between the internal shape and the external shape of the part other than the corner of the seam ring 8. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device and a package for an electronic device that are sealed by seam welding.

Conventionally, a structure of an electronic device in which an electronic component element (hereinafter referred to as an electronic element) such as a crystal vibrating piece, a surface acoustic wave element piece, or an IC chip is accommodated in a ceramic package (hereinafter referred to as a package) is known ( For example, see Patent Document 1).
In this structure, the inside of the package is sealed by seam welding the metal lid to the package to which the metal seam ring is joined.

Japanese Unexamined Patent Publication No. 2000-22013

Incidentally, in recent years, the electronic devices used in various electronic devices such as information devices and mobile communication devices are required to be further reduced in size and thickness as the electronic devices become smaller.
In order to meet this demand, each component constituting the electronic device has been reduced in size and thickness. As a result, the seam ring, which is a part to be seam welded to the metal lid (hereinafter referred to as lid), is also reduced in size and thickness, and the seam ring is a factor that affects the welding conditions in seam welding. The heat capacity is small.
In the seam welding, since the contact portion between the lid and the seam ring is heated by welding through the roller electrode, the seam ring may be excessively heated.
In particular, the corner portion of the package is a crossing portion between the vertical seam welding and the horizontal seam welding in a plan view, and is seam-welded twice and easily heated excessively.

When seam welding is performed in a state where the seam ring is excessively heated, defects such as poor sealing of the package due to the weld being excessively thin and deterioration of the characteristics of the electronic device due to exposure to high temperatures within the package. appear.
For this reason, the electronic device has a narrow tolerance range of variations in welding conditions such as an applied current and an applied voltage that do not cause the above-described problems during seam welding.
Thereby, the electronic device has a problem that the yield at the time of seam welding is deteriorated and the productivity is lowered.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electronic device according to this application example is accommodated in a package in which an opening is formed on one surface, a frame-shaped seam ring disposed so as to surround the opening of the package, and the package. An electronic element and a lid that is seam welded to the seam ring and seals the opening of the package, and has a corner portion of the seam ring at a certain length along a contour in plan view of the seam ring. The heat capacity is larger than the heat capacity in the portion other than the corner portion.

According to such a configuration, in the electronic device, the heat capacity of the corner portion of the seam ring is larger than the heat capacity of the portion other than the corner portion at a certain length along the outline of the seam ring in plan view.
Therefore, the electronic device has a large heat capacity at the corner portion of the seam ring and can widen the tolerance of variations in welding conditions during seam welding, so that the yield during seam welding is improved and productivity is improved.

  Application Example 2 In the electronic device according to the application example described above, the shape of the corner portion in the plan view of the seam ring is formed by at least one of an arc or a straight line along a direction intersecting two adjacent sides. It is preferable that the shortest distance between the inner shape and the outer shape of the corner portion is longer than the shortest distance between the inner shape and the outer shape other than the corner portion of the seam ring.

According to such a configuration, the electronic device is formed by any one of the shape of the corner portion in the plan view of the seam ring, at least one of a circular arc or a straight line that intersects two adjacent sides. In the electronic device, the shortest distance between the inner shape and the outer shape of the corner portion in plan view of the seam ring is longer than the shortest distance between the inner shape and the outer shape other than the corner portion of the seam ring.
As a result, since the corner portion of the seam ring is wider than that other than the corner portion in the electronic device, the heat capacity of the corner portion of the seam ring is constant at a certain length along the outline in plan view of the seam ring. It becomes larger than the heat capacity in the part other than the part.

Accordingly, the electronic device can widen the allowable range of variation in each welding condition during seam welding by increasing the heat capacity of the corner portion of the seam ring, thereby improving the yield during seam welding and improving productivity.
In addition, since the shape of the corner portion of the seam ring is formed by at least one of a straight line along the direction intersecting with the arc or two adjacent sides, the corner portion can be easily processed. The seam ring can be easily manufactured.
In addition, since the shape of the corner portion of the seam ring is formed by at least one of an arc or a straight line along a direction intersecting two adjacent sides, an external force is applied to the seam ring. The stress generated at the corners is dispersed and the stress concentration can be suppressed.

  Application Example 3 In the electronic device according to the application example, the outer shape of the corner portion in the plan view of the seam ring is formed by the arc, and the radius of the arc is an inner shape other than the corner portion of the seam ring. Preferably less than the shortest distance between the outer shape and the outer shape.

According to such a configuration, in the electronic device, the radius of the arc that forms the outside of the corner portion in plan view of the seam ring is smaller than the shortest distance between the inner shape and the outer shape other than the corner portion of the seam ring. .
For this reason, the electronic device has a constant width along the contour in plan view of the seam ring because the corner part of the seam ring is wider than the corner part regardless of the shape inside the corner part of the seam ring. In length, the heat capacity of the corner portion of the seam ring is larger than the heat capacity of the portion other than the corner portion.

  Application Example 4 In the electronic device according to the application example, the shape of the corner portion in the plan view of the seam ring is formed by the arc, and the radius of the outer arc is set to the radius of the inner arc. It is preferably smaller than the value obtained by adding the shortest distance between the inner shape and the outer shape other than the corner portion.

According to such a configuration, in the electronic device, the radius of the arc outside the corner portion in the plan view of the seam ring is between the inner shape and the outer shape other than the corner portion of the seam ring to the radius of the inner arc. It is smaller than the value obtained by adding the shortest distance.
From this, since the corner portion of the seam ring is wider than that other than the corner portion, the heat capacity of the corner portion of the seam ring is constant along the contour in plan view of the seam ring. It becomes larger than the heat capacity in the part other than the corner part.
Further, since the shape of the corner portion of the seam ring is formed by an arc in the electronic device, the corner portion stress generated when an external force is applied to the seam ring is formed in a straight line. Compared with the case, it is further dispersed and stress concentration can be further suppressed.

  Application Example 5 In the electronic device according to the application example described above, the shape of the corner portion in the plan view of the seam ring is formed by a straight line along a direction intersecting two adjacent sides, and the straight line is the adjacent 2 It is preferably formed in a C chamfered shape with respect to the side.

According to such a configuration, in the electronic device, the shape of the corner portion in the plan view of the seam ring is formed in a C-chamfered shape with respect to two adjacent sides by a straight line.
For this reason, the electronic device can easily process the corner portion of the seam ring, and the seam ring can be easily manufactured.
Further, in the electronic device, the stress at the corner portion generated when an external force is applied to the seam ring is easily distributed evenly to each connection portion with two adjacent sides, and the stress concentration can be suppressed.

  Application Example 6 In the electronic device according to the application example, a convex portion is formed on the arrangement surface side of the package in a corner portion of the seam ring in a plan view, and the convex portion is formed on the arrangement surface of the package. It is preferable to be inserted into a concave portion or a through hole formed at a position facing the convex portion.

According to such a configuration, in the electronic device, the convex portion is formed at the corner portion of the seam ring, and the convex portion is inserted into the concave portion or the through hole of the package.
Therefore, the volume of the electronic device is increased at the corner portion of the seam ring, and the heat capacity of the corner portion of the seam ring is larger than the heat capacity of the portion other than the corner portion at a certain length along the outline in the plan view of the seam ring. growing.

  Application Example 7 An electronic device package according to this application example includes a package having an opening formed on one surface thereof, and a frame-shaped seam ring disposed so as to surround the opening of the package, The heat capacity of a corner portion of the seam ring is larger than the heat capacity of a portion other than the corner portion at a certain length along the outline of the seam ring in plan view.

According to such a configuration, in the electronic device package, the heat capacity of the corner portion of the seam ring is larger than the heat capacity of the portion other than the corner portion at a certain length along the outline of the seam ring in plan view.
Therefore, the package for electronic devices has a large heat capacity at the corner of the seam ring, and the tolerance of variation in each welding condition during seam welding can be widened, so the yield during seam welding is improved and productivity is improved. An electronic device can be provided.

  Application Example 8 In the electronic device package according to the application example described above, the shape of the corner portion in plan view of the seam ring is formed by at least one of an arc or a straight line along a direction intersecting two adjacent sides. The shortest distance between the inner shape and the outer shape of the corner portion is preferably longer than the shortest distance between the inner shape and the outer shape other than the corner portion of the seam ring.

According to such a configuration, the electronic device package is formed such that the shape of the corner portion in the plan view of the seam ring is at least one of an arc or a straight line along a direction intersecting two adjacent sides. The shortest distance between the inner shape and the outer shape of the portion is longer than the shortest distance between the inner shape and the outer shape other than the corner portion.
As a result, since the corner portion of the seam ring is wider than the corner portion in the electronic device package, the heat capacity of the corner portion of the seam ring is constant at a certain length along the outline in plan view of the seam ring. It becomes larger than the heat capacity in the part other than the corner part.

  Application Example 9 In the electronic device package according to the application example described above, a convex portion is formed on the arrangement surface side of the package at a corner portion in plan view of the seam ring, and the convex portion is the arrangement surface of the package. It is preferable to be inserted into a recess or a through hole formed at a position facing the projection.

According to such a configuration, in the electronic device package, the convex portion is formed at the corner portion of the seam ring, and the convex portion is inserted into the concave portion or the through hole of the package.
Therefore, the volume of the electronic device package is increased at the corner portion of the seam ring, and the heat capacity of the corner portion of the seam ring is in a portion other than the corner portion at a certain length along the outline in the plan view of the seam ring. Greater than heat capacity.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a configuration diagram showing a schematic configuration of a crystal resonator as an example of an electronic device. FIG. 1A is a plan view, and FIG. 1B is a line AA in FIG. FIG. In the plan view, including the following plan views, the lid is omitted for easy understanding.

  As shown in FIG. 1, a crystal resonator 1 according to the first embodiment includes a package 2, a crystal resonator element 3 as an electronic element, internal electrodes 4a and 4b, external electrodes 4c and 4d, a conductive adhesive 5, and a pillow. It is composed of a portion 6, a lid 7, a seam ring 8, and the like.

The package 2 includes a flat base portion 2a and a frame-shaped frame portion 2b made of ceramic green sheets, and the base portion 2a and the frame portion 2b are integrated by firing. As described above, the package 2 is formed in a box shape in which the opening 2f is formed on the surface on the lid 7 side described later.
Internal electrodes 4a and 4b are formed on the inner surface 2d of the base portion 2a of the package 2, and external electrodes 4c and 4d are formed on the outer surface 2e of the base portion 2a. The internal electrode 4a is connected to the external electrode 4c and the internal electrode 4b is connected to the external electrode 4d through a via hole (not shown) of the base portion 2a.

The crystal vibrating piece 3 is formed from a crystal wafer polished to a predetermined thickness according to the vibration frequency. In the first embodiment, the crystal vibrating piece 3 is an AT-cut crystal vibrating piece. The crystal vibrating piece 3 may be a tuning fork type crystal vibrating piece.
An excitation electrode 3a is formed on one surface of the quartz crystal vibrating piece 3, and an excitation electrode 3b is formed on the other surface. The extraction electrodes 3 c and 3 d extending from the excitation electrodes 3 a and 3 b are formed on the base 3 e of the crystal vibrating piece 3 so as to go around both sides of the crystal vibrating piece 3.
The quartz crystal vibrating piece 3 is bonded and fixed to the internal electrodes 4 a and 4 b through the conductive adhesive 5. Thus, the excitation electrodes 3a and 3b are electrically connected to the external electrodes 4c and 4d via the extraction electrodes 3c and 3d, the conductive adhesive 5, and the internal electrodes 4a and 4b.

  The pillow portion 6 is formed on the inner surface 2d of the base portion 2a of the package 2, supports the tip portion 3f of the crystal vibrating piece 3, and prevents damage to the crystal vibrating piece 3 when a strong impact is applied from the outside such as when dropped. .

The seam ring 8 is formed by punching with a press or the like into a frame shape having a substantially equal thickness with a metal such as Kovar, and the surface thereof is plated with gold, and is disposed on the frame portion 2b so as to surround the opening 2f of the package 2. Is done. The seam ring 8 is a brazing material such as silver brazing (not shown), and is joined by brazing to a joining surface 2c obtained by performing nickel plating on the tungsten thin film of the frame 2b.
In the case of a package without the frame portion 2b, the seam ring 8 may be disposed directly on the base portion 2a.

The lid 7 is formed of a metal such as Kovar into a substantially rectangular flat plate shape, and a joint surface with the seam ring 8 is plated with nickel, gold, or the like, and disposed on the seam ring 8.
The lid 7 is pressed and energized via the roller electrode by seam welding, so that the contact portion with the seam ring 8 is heated and welded, and is joined to the package 2 via the seam ring 8. 2 opening 2f is hermetically sealed.

  In the crystal resonator 1, the crystal resonator element 3 applies drive voltage to the excitation electrodes 3a and 3b from the outside via the external electrodes 4c and 4d, the internal electrodes 4a and 4b, the conductive adhesive 5, and the extraction electrodes 3c and 3d. When applied, it oscillates thickness shear vibration.

Here, the planar shape of the seam ring 8 will be described in detail with reference to FIG.
FIG. 2 is an enlarged plan view of the main part of the corner portion of the crystal unit 1.
As shown in FIG. 2, the shape of the corner part in the planar view of the seam ring 8 formed in a frame shape is formed with an arc 8a on the outer side and an arc 8b on the inner side.
Here, the radius R1 of the arc 8a forming the outside of the corner portion is set to be smaller than the shortest distance W1 between the inner shape and the outer shape other than the corner portion (R1 <W1).
Therefore, the shortest distance W2 between the inner shape and the outer shape of the corner portion of the seam ring 8 is between the inner shape and the outer shape other than the corner portion regardless of the radius of the inner arc 8b. Longer than the shortest distance W1.
As a result, since the cross-sectional area of the cross-section cut along the direction of the shortest distance W2 is larger than the cross-sectional area of the cross-section cut along the direction of the shortest distance W1, the seam ring 8 has a constant length L. Volume increases at the corner. Accordingly, at a certain length L along the outline of the seam ring 8 in plan view, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion.

As described above, in the crystal resonator 1 according to the first embodiment, the radius R1 of the arc 8a at the corner portion in plan view of the seam ring 8 is between the inner shape and the outer shape other than the corner portion of the seam ring 8. Is set to be smaller than the shortest distance W1.
As a result, the quartz crystal resonator 1 has the shortest distance W2 between the inner shape and the outer shape of the corner portion of the seam ring 8 and the inner shape other than the corner portion regardless of the radius of the inner arc 8b. It becomes longer than the shortest distance W1 between the outer shapes.
Therefore, in the crystal resonator 1, the volume of the seam ring 8 at a certain length L is increased at the corner portion. Therefore, in the crystal resonator 1, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion at a constant length L along the outline of the seam ring 8 in plan view.
From this, the crystal unit 1 can widen the tolerance of variations in the welding conditions during seam welding by increasing the heat capacity of the corner portion of the seam ring 8, so that the yield during seam welding is improved and the productivity is improved. Will improve.

Further, in the crystal resonator 1, since the shape of the corner portion of the seam ring 8 is formed by the arcs 8 a and 8 b, the corner portion can be easily processed and the seam ring 8 can be easily manufactured.
Further, in the crystal resonator 1, since the shape of the corner portion of the seam ring 8 is formed by the arcs 8a and 8b, the stress of the corner portion generated when an external force is applied to the seam ring 8 is dispersed. Stress concentration can be suppressed.

  In addition, the package 2 in a state where the seam ring 8 as an electronic device package is joined can increase the tolerance of variation in each welding condition during seam welding by increasing the heat capacity of the corner portion of the seam ring 8. It is possible to provide the crystal unit 1 with improved yield during seam welding and improved productivity.

Here, a modified example of the crystal unit 1 of the first embodiment will be described. In addition, a modification is not limited to these, Various aspects are possible.
(Modification 1)
FIG. 3 is a plan view of a main part of a crystal resonator 101 as an example of an electronic device. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, and the description is abbreviate | omitted.

The crystal resonator 101 of Modification 1 and the crystal resonator 1 of the first embodiment are different in the shape of the corner portion of the seam ring 8.
As shown in FIG. 3, the shape of the corner portion in plan view of the seam ring 8 of the crystal unit 101 is formed by an arc 8 c on the outer side and an arc 8 d on the inner side.
Here, the radius R3 of the outer arc 8c is set smaller than the value obtained by adding the shortest distance W1 between the inner shape and the outer shape other than the corner portion of the seam ring 8 to the radius R2 of the inner arc 8d. (R3 <R2 + W1).
Therefore, the shortest distance W21 between the inner shape and the outer shape of the corner portion of the seam ring 8 is longer than the shortest distance W1 between the inner shape and the outer shape other than the corner portion.
Thereby, the cross-sectional area of the cross section cut along the direction of the shortest distance W21 is larger than the cross-sectional area of the cross section cut along the direction of the shortest distance W1, so that the seam ring 8 has a constant length L. Volume increases at the corner. Accordingly, at a certain length L along the outline of the seam ring 8 in plan view, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion.

As described above, in the crystal resonator 101 of the first modification, the volume of the seam ring 8 at the certain length L increases at the corner portion. Therefore, in the crystal unit 101, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion at a certain length L along the outline of the seam ring 8 in plan view.
As a result, the crystal resonator 101 can widen the allowable range of variation in each welding condition during seam welding by increasing the heat capacity of the corner portion of the seam ring 8, thereby improving the yield during seam welding and improving productivity. improves.
Further, in the crystal resonator 101, since the shape of the corner portion of the seam ring 8 is formed by the arcs 8c and 8d, the corner portion can be easily processed and the seam ring 8 can be easily manufactured.
Further, in the crystal resonator 101, since the shape of the corner portion of the seam ring 8 is formed by the arcs 8c and 8d, the stress of the corner portion generated when an external force is applied to the seam ring 8 is dispersed. Stress concentration can be suppressed.

(Modification 2)
FIG. 4 is a plan view of a main part of a crystal resonator 201 as an example of an electronic device. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, and the description is abbreviate | omitted.

The crystal resonator 201 of the modification 2 and the crystal resonator 1 of the first embodiment are different in the shape of the corner portion of the seam ring 8.
As shown in FIG. 4, the shape of the corner portion in plan view of the seam ring 8 of the crystal resonator 201 is formed by straight lines 8 e and 8 f along a direction intersecting two adjacent sides, and the straight lines 8 e and 8 f are It is formed in a C chamfered shape with respect to two adjacent sides.
Here, the seam ring 8 is formed such that the shortest distance W22 between the straight line 8e and the straight line 8f of the corner portion is longer than the shortest distance W1 between the inner shape and the outer shape other than the corner portion. .
As a result, the cross-sectional area of the cross section cut along the direction of the shortest distance W22 of the seam ring 8 is larger than the cross-sectional area of the cross section cut along the direction of the shortest distance W1, so Volume increases at the corner. Accordingly, at a certain length L along the outline of the seam ring 8 in plan view, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion.

As described above, in the crystal resonator 201 according to the second modification, the volume of the seam ring 8 at the certain length L is increased at the corner portion. Therefore, in the crystal resonator 201, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion at a certain length L along the outline of the seam ring 8 in plan view.
As a result, the crystal resonator 201 can widen the allowable range of variation in each welding condition during seam welding by increasing the heat capacity of the corner portion of the seam ring 8, thereby improving the yield during seam welding and improving productivity. improves.
Further, in the crystal resonator 201, the shape of the corner portion of the seam ring 8 is formed in a C chamfer shape with respect to two adjacent sides by the straight lines 8e and 8f.
For this reason, the crystal resonator 201 can easily process the corner portion of the seam ring 8, and the seam ring 8 can be easily manufactured.
Further, in the crystal resonator 201, the stress at the corner portion generated when an external force is applied to the seam ring 8 is easily distributed evenly to the connection portions 8g and 8h with two adjacent sides, and the stress concentration can be suppressed. .

  In the first embodiment, the first modification, and the second modification, the shape of the corner portion of the seam ring 8 is a straight line along a direction intersecting the arcs 8a and 8b, the arcs 8c and 8d, and two adjacent sides, respectively. Although formed by 8e and 8f, it is not limited to this. The shape of the corner portion of the seam ring 8 may be a combination of a circular arc and a straight line along a direction intersecting two adjacent sides. For example, the outer side of the corner portion of the seam ring 8 may have an arc shape, and the inner side may have a linear shape along a direction intersecting two adjacent sides, or vice versa.

  Moreover, in the said modification 2, although the shape of the corner part of the seam ring 8 was formed in C chamfering shape with respect to two adjacent sides by the straight lines 8e and 8f, it is not limited to this, The straight lines 8e and 8f The angle formed by two adjacent sides may be different at each adjacent location.

(Second Embodiment)
5A and 5B are main part configuration diagrams of a crystal resonator 301 as an example of an electronic device. FIG. 5A is a plan view, and FIG. 5B is a line BB in FIG. It is sectional drawing. In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, and the description is abbreviate | omitted.

The crystal resonator 301 of the second embodiment and the crystal resonator 1 of the first embodiment differ in the cross-sectional shape of the corner portion of the seam ring 8.
As shown in FIG. 5, a convex portion 8 i is formed on the side of the joint surface 2 c as a placement surface of the package 2 at a corner portion in plan view of the seam ring 8 of the crystal resonator 301. And the convex part 8i of the seam ring 8 is inserted in the through-hole 2g formed in the position facing the convex part 8i of the joining surface 2c of the package 2. FIG.
Thereby, in the crystal resonator 301, the volume of the seam ring 8 at a certain length L is increased at the corner portion. Accordingly, at a certain length L along the outline of the seam ring 8 in plan view, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion.
Further, the convex portion 8 i of the seam ring 8 is formed so as to contact an external electrode 4 e formed as a ground terminal on the outer surface 2 e of the base portion 2 a of the package 2. Thereby, in the crystal resonator 301, the heat capacity of the corner portion of the seam ring 8 is further increased by adding the volume of the external electrode 4e.

As described above, in the crystal resonator 301 according to the second embodiment, the volume of the seam ring 8 at the certain length L is increased at the corner portion. Accordingly, in the crystal resonator 301, the heat capacity of the corner portion of the seam ring 8 is larger than the heat capacity of the portion other than the corner portion at a certain length L along the outline of the seam ring 8 in plan view.
Accordingly, since the crystal resonator 301 can widen the tolerance of variation in each welding condition during seam welding by increasing the heat capacity of the corner portion of the seam ring 8, the yield during seam welding is improved and the productivity is improved. To do.
In addition, the package 2 in a state where the seam ring 8 as an electronic device package is joined can increase the tolerance of variations in welding conditions during seam welding due to an increase in the heat capacity of the corner portion of the seam ring 8. It is possible to provide the crystal resonator 301 with improved yield during seam welding and improved productivity.

In the second embodiment, the through hole 2g is formed at a position facing the convex portion 8i of the joint surface 2c of the package 2, but the present invention is not limited to this, and a concave portion may be formed. Further, the convex portion 8i of the seam ring 8 may not be in contact with the external electrode 4e.
Moreover, although the convex shape 8i of the seam ring 8 is illustrated as a circular plane shape, it may be an arbitrary shape such as an ellipse, a triangle, a quadrangle, or a polygon.
Further, the convex portion 8 i of the seam ring 8 may be chamfered at the tip. According to this, the seam ring 8 can easily insert the convex portion 8 i into the through hole 2 g of the package 2.
The convex portion 8i is not necessarily made of the same material as the seam ring 8. For example, the upper portion of the seam ring 8 from the joint surface 2c may be made of Kovar and the convex portion 8i may be made of a metal such as tungsten or molybdenum.

Moreover, you may provide the convex part 8i not only in one place but in multiple places, for example, all four corner parts. When a total of four external electrodes including an input terminal, an output terminal, and two ground terminals are provided on the outer surface 2e of the base portion 2a, the convex portions 8i are brought into contact with the two ground terminals, and the input terminal and the output terminal are contacted with each other. It is good also as a structure which does not contact the convex part 8i. With this configuration, a short circuit between the input terminal and the output terminal can be prevented, and an unnecessary increase in stray capacitance can be reduced.
When the convex portion 8i is not in contact with the external electrode, the base portion 2a has a laminated structure, at least the layer closest to the external electrode is not penetrated, and at least the layer closest to the seam ring 8 is disposed at a position facing the convex portion 8i. What is necessary is just to form a through-hole and insert the convex part 8i in the through-hole.
In addition, when the convex portion 8i penetrates the base portion 2a and the convex portion 8i is exposed on the outer surface 2e of the base portion 2a, the input terminal or the output is prevented in order to avoid a short circuit between the input terminal or the output terminal and the convex portion 8i. It is preferable to shift the terminal from the position where the convex portion 8i is exposed. Furthermore, the surface of the exposed portion of the convex portion 8i on the outer surface 2e may be covered with an alumina coat or a glass coat to further prevent the short-circuit between the input terminal or output terminal and the convex portion 8i.

  In the first and second embodiments and the modifications, the crystal resonator is taken as an example of the electronic device. However, the present invention is not limited to this, and the crystal oscillator, the surface acoustic wave oscillator, and the surface acoustic wave filter are not limited thereto. The present invention can also be applied to electronic devices such as various sensors using crystal vibrating pieces.

1 is a configuration diagram showing a schematic configuration of a crystal resonator according to a first embodiment. The principal part top view of the crystal oscillator in 1st Embodiment. The principal part top view of the crystal oscillator of the modification 1 in 1st Embodiment. The principal part top view of the crystal oscillator of the modification 2 in 1st Embodiment. The principal part block diagram which shows schematic structure of the crystal oscillator in 2nd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,101,201,301 ... Crystal resonator as an electronic device, 2 ... Package, 2a ... Base part of package, 2b ... Frame part of package, 2c ... Joint surface of frame part as arrangement surface, 2d ... Base part 2e ... outer surface of the base portion, 2f ... opening of the package, 2g ... through hole of the package, 3 ... crystal vibrating piece as an electronic element, 3a, 3b ... excitation electrode, 3c, 3d ... extraction electrode, 3e ... The base of the quartz crystal vibrating piece, 3f: the tip of the quartz crystal vibrating piece, 4a, 4b ... internal electrode, 4c, 4d, 4e ... external electrode, 5 ... conductive adhesive, 6 ... pillow part, 7 ... lid, 8 ... seam Rings, 8a, 8b, 8c, 8d ... arcs of corners, 8e, 8f ... straight lines of corners, 8g, 8h ... connecting parts with two adjacent sides, 8i ... convex parts of seam rings. L: fixed length, W1: shortest distance other than corner, W2, W21, W22 ... shortest distance of corner.

Claims (9)

A package having an opening formed on one surface;
A frame-shaped seam ring arranged to surround the opening of the package;
An electronic element housed in the package;
A lid that is seam welded to the seam ring and seals the opening of the package;
An electronic device, wherein a heat capacity of a corner portion of the seam ring is larger than a heat capacity of a portion other than the corner portion at a certain length along a contour of the seam ring in plan view.   2. The electronic device according to claim 1, wherein the shape of the corner portion in plan view of the seam ring is formed by at least one of an arc or a straight line along a direction intersecting two adjacent sides, and An electronic device, wherein the shortest distance between the inner shape and the outer shape is longer than the shortest distance between the inner shape and the outer shape other than the corner portion of the seam ring.   3. The electronic device according to claim 2, wherein an outer shape of a corner portion in plan view of the seam ring is formed by the arc, and the radius of the arc is an inner shape and an outer shape other than the corner portion of the seam ring. An electronic device characterized by being smaller than the shortest distance between.   3. The electronic device according to claim 2, wherein the shape of the corner portion in plan view of the seam ring is formed by the arc, and the radius of the outer arc is equal to the radius of the inner arc other than the corner portion of the seam ring. An electronic device having a value smaller than a value obtained by adding a shortest distance between an inner shape and an outer shape.   3. The electronic device according to claim 2, wherein the shape of the corner portion in a plan view of the seam ring is formed by a straight line along a direction intersecting with two adjacent sides, and the straight line corresponds to the two adjacent sides. An electronic device having a C-chamfered shape.   2. The electronic device according to claim 1, wherein a convex portion is formed on a placement surface side of the package at a corner portion in plan view of the seam ring, and the convex portion faces the convex portion of the placement surface of the package. An electronic device, wherein the electronic device is inserted into a recess or a through-hole formed at a position to be operated. A package having an opening formed on one surface;
A frame-like seam ring arranged to surround the opening of the package,
A package for an electronic device, wherein a heat capacity of a corner portion of the seam ring is larger than a heat capacity of a portion other than the corner portion at a certain length along a contour in a plan view of the seam ring.   The package for an electronic device according to claim 7, wherein the shape of the corner portion in plan view of the seam ring is formed by at least one of an arc or a straight line along a direction intersecting two adjacent sides, A package for an electronic device, wherein a shortest distance between an inner shape and an outer shape of a portion is longer than a shortest distance between an inner shape and an outer shape other than the corner portion of the seam ring.   The package for an electronic device according to claim 7, wherein a convex portion is formed on a placement surface side of the package at a corner portion in plan view of the seam ring, and the convex portion is the convex portion of the placement surface of the package. An electronic device package, wherein the electronic device package is inserted into a recess or a through-hole formed at a position facing the surface.

Images