JP2537011Y2 - Piezoelectric resonance components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION This invention is a piezoelectric resonance component, details, characterized in drawer structure of the common electrode, a piezoelectric resonance component which corresponds to the size reduction.

[0002]

2. Description of the Related Art In a conventional piezoelectric resonance component utilizing a thickness-shear vibration mode, for example, as shown in FIGS.
a common electrode 24 is formed on the other surface at a position facing the vibrating electrode unit 23.
Is provided, the piezoelectric element 25 having an equivalent circuit as shown in FIG. 9 is formed. And the piezoelectric element 25
An extraction electrode 26 extending from the common electrode 24 is formed on the surface where the common electrode 24 is formed. The extraction electrode 26 is connected to the opposing electrodes 22a, 22 formed on the other surface.
2b (i.e., the vibrating electrode portion 23), when formed at a position facing (overlapping) an electrode, vibration is generated at the facing portion when a voltage is applied to deteriorate the resonance characteristics of the piezoelectric element 25. Become. Therefore, the counter electrodes 22a,
A position that does not face 22b (the vibrating electrode section 23) and the extraction electrodes 27a and 27b extracted therefrom is selected, and the extraction electrode 26 is arranged by being routed. (FIG. 8).

[0003]

As described above, in the above-described conventional piezoelectric resonance component, since the common electrode 24 is disposed at a position on the other surface of the piezoelectric substrate 21 which does not face the vibrating electrode portion 23 and the like, the common electrode 24 is provided. There is a problem that a space must be secured and the piezoelectric element 25 becomes large. Further, since the size of the sealing substrate for sealing the piezoelectric element 25 from both sides is also increased, there is a problem that it is difficult to reduce the size of the final product, that is, the piezoelectric resonance component.

The present invention has been made to solve the above problems, and has as its object to provide a piezoelectric resonator component which can be reduced in size without forming a common electrode lead electrode on a piezoelectric substrate.

[0005]

In order to solve the above-mentioned object, a piezoelectric resonance component according to the present invention is provided with a vibration electrode portion on one surface of a piezoelectric substrate and a common electrode facing the vibration electrode portion on the other surface. A piezoelectric resonance component in which both ends of a piezoelectric element in thickness-shear vibration mode formed with electrodes are sandwiched between sealing substrates.
A lead electrode for a common electrode is formed on the sealing substrate on the side facing the common electrode, and the common electrode and the common electrode
The conductive elastic body into the vibration space between the extraction electrodes
With it, the connecting the common electrode to the common electrode lead-out electrode via the conductive elastic body, the conductive
Made the electro-elastic body function as a damping material
It is characterized by:

[0006]

In the piezoelectric resonance component of the present invention, the common electrode
Conductive elastic body vibration space between the common electrode lead-out electrode
Are filled, the common electrode of the piezoelectric element, to be connected to the common electrode lead-out electrode formed in the sealing substrate via the conductive elastic body, the piezoelectric element (the common electrode is formed face of) in, there is no need to form the common electrode lead-out electrode,
Since it is not necessary to secure the space, it is possible to correspondingly reduce the size of the piezoelectric element, thus the piezoelectric resonator portion
The whole product can be reduced in size. In addition, the space
The filled conductive elastic body also functions as a damping material ,
And dumping the unwanted vibration of the piezoelectric element, it becomes possible to the upper direction <br/> piezoelectric characteristics, separately damping material
Eliminates the need to apply
It is possible to simplify the process and improve productivity.
You. In the present invention, the conductive elastic body is placed in the vibration space.
When filling, the piezoelectric element was sandwiched by the sealing substrate
Later, the space (vibration) formed between the piezoelectric element and the sealing substrate
Inject and fill the conductive elastic body into the moving space)
Before holding the piezoelectric element 5 with the sealing substrate,
Conductive elastic body on common electrode of piezoelectric element or sealing substrate
By applying it on the common electrode extraction electrode,
After being sandwiched by the sealing substrate, the common electrode of the piezoelectric element is formed.
Between the cut surface and the common electrode extraction electrode of the sealing substrate (vibration
Space) is filled with conductive elastic material.
You may.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are views showing the front and back surfaces of a piezoelectric element used in a piezoelectric resonance component according to an embodiment of the present invention, and FIGS. 3 to 6 are manufacturing processes of the piezoelectric resonance component according to the embodiment. FIG. As shown in FIGS. 1 and 2,
The piezoelectric element 5 used in the piezoelectric resonance component of this embodiment includes a pair of opposing electrodes 2 on one surface of a piezoelectric substrate 1.
a, 2b and the opposing electrodes 2a, 2b
The lead-out electrodes 12a and 12b which are electrically connected to the vibration electrode portion 3 are provided on the other surface, and the common electrode 4 is provided at a position facing the vibration electrode portion 3 so that the piezoelectric device in the thickness-shear vibration mode is formed.
It is an element and has an equivalent circuit as shown in FIG.

Next, the piezoelectric element 5 configured as described above
A manufacturing process of a piezoelectric resonance component using the method will be described. First, the piezoelectric element 5 is clamped from both sides by the sealing substrates 7a and 7b (FIG. 3). An electrode (lead electrode for common electrode) 8 is formed on a surface of the lower sealing substrate 7b facing the common electrode 4. This electrode 8 is used as a sealing substrate 7b.
From the surface facing the piezoelectric element 5 to the side surface thereof (in some cases, it may be formed to extend to the bottom surface of the sealing substrate 7b). Then, as shown in FIG. 4, between the lower surface of the piezoelectric element 5 (the surface on which the common electrode 4 is formed) and the common electrode extraction electrode 8 of the sealing substrate 7b (vibration space).
In the meantime , for example, a conductive elastic body 9 formed by mixing conductive particles such as metal powder into an elastic material such as silicon rubber is filled, and the common electrode 4 and the common electrode extraction electrode are filled with the conductive elastic body 9. 8 is electrically connected . In addition, conductive bullets
In filling the conductive body 9, the conductive elastic body 9 is pulled out of the common electrode 4 of the piezoelectric element 5 or the common electrode on the sealing substrate 7b before the piezoelectric element 5 is sandwiched between the sealing substrates 7a and 7b. By coating on the electrode 8 , the sealing substrate 7a,
7b, the common electrode 4 of the piezoelectric element 5 is formed.
Between the cut surface and the common electrode extraction electrode 8 of the sealing substrate 7b
(Vibration space) is filled with the conductive elastic body 9
May be so, also, the sealing substrate 7a as described above,
After being clamped by 7b, the space (vibration space) formed between the piezoelectric element 5 and the sealing substrate 7b may be filled. After sealing both ends of the element sandwiched between the sealing substrates 7a and 7b with the sealing plates 10a and 10b (FIG. 5),
The sealing substrates 7a, 7b extend from the opposing electrodes 2a, 2b.
The external electrodes 11a, 11b that are electrically connected to the extraction electrodes 12a, 12b exposed from the ends of the sealing plates 10a, 10b
Are formed on both end sides to which no is attached, and a center electrode 11c is formed between the external electrodes 11a and 11b. Note that the center electrode 11c is connected to the common electrode extraction electrode 8 extracted from the side surfaces to the bottom surface of the sealing substrates 7a and 7b.

In the piezoelectric resonance component configured as described above, the common electrode 4 of the piezoelectric element 5 is connected to the common electrode lead-out electrode 8 formed on the sealing substrate 7b via the conductive elastic body 9. Therefore, it is not necessary to secure a space for providing the common electrode lead-out electrode (on the surface on which the common electrode is formed) of the piezoelectric element 5, and the piezoelectric element is downsized. The whole component can be reduced in size. In addition, since the conductive elastic body 9 also functions as a damping material , unnecessary vibration of the piezoelectric element is damped.
As a result, the piezoelectric characteristics can be improved, and the need to separately apply a damping material to the vibrating portion of the piezoelectric element can be eliminated, so that the manufacturing cost can be reduced.

In the above embodiment, the piezoelectric element 5 and the sealing substrate 7
has been described as being filled with a conductive elastic member 9 on the entire space (vibration space) between is b, it is the entire vibration space
Alternatively, the main part may be filled with a conductive elastic body. In the above-described embodiment, the description has been given of the piezoelectric resonance component using the piezoelectric element having only one vibration electrode portion. However, a piezoelectric element having a plurality of stages of vibration electrode portions (there are a plurality of common electrodes). The present invention can also be applied to a piezoelectric resonance component using.

Further, when a piezoelectric element having a common electrode formed on both sides is used, it is possible to fill the vibration space on both sides of the piezoelectric element with a conductive elastic body.

[0012]

[Effect of the invention] As described above, the piezoelectric resonance component of this invention is to form a common electrode lead-out electrode to the sealing substrate on the side facing the common electrode formed on the piezoelectric element, the common electrode co
Fill the vibrating space between the extraction electrodes for conductive electrodes with a conductive elastic body.
By filling the conductive elastic body as a damping material
Since it is made to function and the common electrode is connected to the common electrode extraction electrode via the conductive elastic body,
The space for forming the common electrode extraction electrode on the surface of the piezoelectric element on which the common electrode is formed becomes unnecessary. Therefore, it is possible to reduce the size of the piezoelectric element and the sealing substrate for sealing the piezoelectric element, and to reduce the size of the piezoelectric resonance component as a whole.

In addition, since the conductive elastic body also functions as a damping material, it is possible to improve the piezoelectric characteristics.
That together, it is possible to eliminate the need to apply separately the damping material to the vibrating part of the piezoelectric element, improve the productivity by simplifying the manufacturing process.

[Brief description of the drawings]

FIG. 1 is a plan view showing one surface of a piezoelectric element used in a piezoelectric resonance component according to an embodiment of the present invention.

FIG. 2 is a plan view showing the other surface of the piezoelectric element used in the piezoelectric resonance component of the embodiment of the present invention.

FIG. 3 is an exploded perspective view showing a manufacturing process of the piezoelectric resonance component according to the embodiment of the present invention.

FIG. 4 is a perspective view showing a manufacturing process of the piezoelectric resonance component according to the embodiment of the present invention.

FIG. 5 is a perspective view showing a manufacturing process of the piezoelectric resonance component according to the embodiment of the present invention.

FIG. 6 is a perspective view showing a piezoelectric resonance component according to an embodiment of the present invention.

FIG. 7 is a plan view showing one surface of a piezoelectric element used for a conventional piezoelectric resonance component.

FIG. 8 is a plan view showing the other surface of a piezoelectric element used for a conventional piezoelectric resonance component.

FIG. 9 is a diagram showing an equivalent circuit of a piezoelectric element used in the piezoelectric device of the present invention and a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Piezoelectric substrate 2a, 2b Counter electrode 3 Vibration electrode part 4 Common electrode 5 Piezoelectric element 7a, 7b Sealing substrate 8 Common electrode extraction electrode 9 Conductive elastic body

Claims (1)

(57) [Scope of request for utility model registration] 1. A vibration electrode portion provided on one surface of the piezoelectric substrate, the two ends of the piezoelectric element in the thickness shear vibration mode formed by providing a common electrode facing the said vibrating electrode portion on the other surface <br / > a piezoelectric resonance component obtained by sandwiching a sealing substrate, the common electrode and the opposite side for the common electrode lead-out electrode to the sealing substrate is formed, the common electrode and the common electrode lead-out
Filling the vibration space between the electrodes with a conductive elastic body
Ri, along with connecting the common electrode to the common electrode lead-out electrode via the conductive elastic body, the conductive elastic
A piezoelectric resonance component characterized in that a body functions as a damping material .