JPS585350U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS585350U JPS585350U JP9809681U JP9809681U JPS585350U JP S585350 U JPS585350 U JP S585350U JP 9809681 U JP9809681 U JP 9809681U JP 9809681 U JP9809681 U JP 9809681U JP S585350 U JPS585350 U JP S585350U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pellet
- semiconductor device
- encapsulated semiconductor
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の樹脂封止半導体装置の断面図、第２図
乃至第４図は、この考案の実施例に係り、第２図は樹脂
封止パワートランジスタの断面図、第３図はその外殻樹
脂を除去した平面図、第４図はプリコート樹脂の表皮層
形成作業を示す紫外線発生器及び、樹脂封止パワートラ
ンジスタの内部金属細線配線済構体の断面図である。
１１・・・・・・基板、１２・・・・・・ベレット、１
４・・・・・・外部導出リード、１７．２０・・・・・
・内部金属細線、２２・・・・・・プリコート樹脂、２
３・・・・・・表皮層、２４・・・・・・内部、２８・
・・・・・紫外線発生器。FIG. 1 is a sectional view of a conventional resin-sealed semiconductor device, FIGS. 2 to 4 are examples of this invention, FIG. 2 is a sectional view of a resin-sealed power transistor, and FIG. 3 is a sectional view of a resin-sealed power transistor. FIG. 4 is a plan view with the outer shell resin removed, and FIG. 4 is a cross-sectional view of the ultraviolet generator and the internal fine metal wire wiring structure of the resin-sealed power transistor, showing the work of forming the skin layer of the pre-coated resin. 11...Substrate, 12...Bellet, 1
4...External lead-out lead, 17.20...
・Internal thin metal wire, 22...Pre-coated resin, 2
3... Epidermal layer, 24... Internal, 28.
・・・・・・Ultraviolet light generator.
Claims (1)
とを内部金属細線で接続し、ペレットをプリコート樹脂
で覆い、さらに外殻樹脂にて被覆したものにおいて、前
記プリコート樹脂は、その表皮層のみを硬化させ、内部
は軟化状態に設定したことを特徴とする樹脂封止半導体
装置。In the case where a pellet is fixed on a substrate, the pellet and an external lead are connected with an internal thin metal wire, the pellet is covered with a pre-coated resin, and further coated with an outer shell resin, the pre-coated resin covers only the outer layer of the pellet. A resin-sealed semiconductor device characterized in that it is hardened and the inside is set in a softened state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9809681U JPS585350U (en) | 1981-06-30 | 1981-06-30 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9809681U JPS585350U (en) | 1981-06-30 | 1981-06-30 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS585350U true JPS585350U (en) | 1983-01-13 |
Family
ID=29892865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9809681U Pending JPS585350U (en) | 1981-06-30 | 1981-06-30 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS585350U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252955A (en) * | 1985-09-05 | 1987-11-04 | Nec Corp | Package |
-
1981
- 1981-06-30 JP JP9809681U patent/JPS585350U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62252955A (en) * | 1985-09-05 | 1987-11-04 | Nec Corp | Package |
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