JPS5852685Y2 - 電子部品の金属製外囲器 - Google Patents
電子部品の金属製外囲器Info
- Publication number
- JPS5852685Y2 JPS5852685Y2 JP12503778U JP12503778U JPS5852685Y2 JP S5852685 Y2 JPS5852685 Y2 JP S5852685Y2 JP 12503778 U JP12503778 U JP 12503778U JP 12503778 U JP12503778 U JP 12503778U JP S5852685 Y2 JPS5852685 Y2 JP S5852685Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- stem
- metal cap
- convex portion
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 title claims description 38
- 229910052751 metal Inorganic materials 0.000 title claims description 38
- 238000003466 welding Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12503778U JPS5852685Y2 (ja) | 1978-09-12 | 1978-09-12 | 電子部品の金属製外囲器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12503778U JPS5852685Y2 (ja) | 1978-09-12 | 1978-09-12 | 電子部品の金属製外囲器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5542327U JPS5542327U (enrdf_load_stackoverflow) | 1980-03-18 |
| JPS5852685Y2 true JPS5852685Y2 (ja) | 1983-12-01 |
Family
ID=29085585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12503778U Expired JPS5852685Y2 (ja) | 1978-09-12 | 1978-09-12 | 電子部品の金属製外囲器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852685Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387721U (enrdf_load_stackoverflow) * | 1986-09-17 | 1988-06-08 |
-
1978
- 1978-09-12 JP JP12503778U patent/JPS5852685Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5542327U (enrdf_load_stackoverflow) | 1980-03-18 |
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