JPS5849629Y2 - 半導体装置用容器 - Google Patents

半導体装置用容器

Info

Publication number
JPS5849629Y2
JPS5849629Y2 JP1978092217U JP9221778U JPS5849629Y2 JP S5849629 Y2 JPS5849629 Y2 JP S5849629Y2 JP 1978092217 U JP1978092217 U JP 1978092217U JP 9221778 U JP9221778 U JP 9221778U JP S5849629 Y2 JPS5849629 Y2 JP S5849629Y2
Authority
JP
Japan
Prior art keywords
container body
container
reference mark
coordinates
reference marks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978092217U
Other languages
English (en)
Japanese (ja)
Other versions
JPS559557U (enrdf_load_stackoverflow
Inventor
修一 大坂
敏信 番條
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1978092217U priority Critical patent/JPS5849629Y2/ja
Publication of JPS559557U publication Critical patent/JPS559557U/ja
Application granted granted Critical
Publication of JPS5849629Y2 publication Critical patent/JPS5849629Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP1978092217U 1978-07-03 1978-07-03 半導体装置用容器 Expired JPS5849629Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978092217U JPS5849629Y2 (ja) 1978-07-03 1978-07-03 半導体装置用容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978092217U JPS5849629Y2 (ja) 1978-07-03 1978-07-03 半導体装置用容器

Publications (2)

Publication Number Publication Date
JPS559557U JPS559557U (enrdf_load_stackoverflow) 1980-01-22
JPS5849629Y2 true JPS5849629Y2 (ja) 1983-11-12

Family

ID=29022183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978092217U Expired JPS5849629Y2 (ja) 1978-07-03 1978-07-03 半導体装置用容器

Country Status (1)

Country Link
JP (1) JPS5849629Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6253273U (enrdf_load_stackoverflow) * 1985-09-24 1987-04-02

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53136479A (en) * 1977-05-04 1978-11-29 Fujitsu Ltd Automatic alignment method

Also Published As

Publication number Publication date
JPS559557U (enrdf_load_stackoverflow) 1980-01-22

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