JPS5849453U - 発光ダイオ−ドランプ - Google Patents

発光ダイオ−ドランプ

Info

Publication number
JPS5849453U
JPS5849453U JP14291681U JP14291681U JPS5849453U JP S5849453 U JPS5849453 U JP S5849453U JP 14291681 U JP14291681 U JP 14291681U JP 14291681 U JP14291681 U JP 14291681U JP S5849453 U JPS5849453 U JP S5849453U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode lamp
lead wire
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14291681U
Other languages
English (en)
Inventor
藤田　貞三
Original Assignee
和泉電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 和泉電気株式会社 filed Critical 和泉電気株式会社
Priority to JP14291681U priority Critical patent/JPS5849453U/ja
Publication of JPS5849453U publication Critical patent/JPS5849453U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は、この考案に係る発光ダイオードランプの正面
図、第２図は同じく縦断正面図、第３図は同じ（底面図
、第４図は従来の発光ダイオニドランプの正面図である
。 １・・・・・・発光ダイオード、２・・・・・・透光性
樹脂、３゜３′・・・・・・リード端子、４・・・・・
・抵抗、５・・・・・・接触子、６・・・・・・導電体
ワッシャ部材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光ダイオードと抵抗とをリード線を介して接続し、且
    つこれらを透光性樹脂にて下側部外形が、　　スワン式
    電球口金形状となるよう一体成形し、且、　っ前記リー
    ド線の一端を、前記樹脂に一体的に埋め込むとともにそ
    の中央部底面側から一部を外部に突設した接触子に′接
    続し、他端を前記樹脂の底面側に前記接触子との間に形
    成したバリヤを介して固着してなる導電体ワッシャ部材
    に接続してなることを特徴とする発光ダイオードランプ
    。
JP14291681U 1981-09-26 1981-09-26 発光ダイオ−ドランプ Pending JPS5849453U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14291681U JPS5849453U (ja) 1981-09-26 1981-09-26 発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14291681U JPS5849453U (ja) 1981-09-26 1981-09-26 発光ダイオ−ドランプ

Publications (1)

Publication Number Publication Date
JPS5849453U true JPS5849453U (ja) 1983-04-04

Family

ID=29935927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14291681U Pending JPS5849453U (ja) 1981-09-26 1981-09-26 発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS5849453U (ja)

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