JPS58162184U - 発光ダイオ−ド表示装置 - Google Patents
発光ダイオ−ド表示装置Info
- Publication number
- JPS58162184U JPS58162184U JP6023282U JP6023282U JPS58162184U JP S58162184 U JPS58162184 U JP S58162184U JP 6023282 U JP6023282 U JP 6023282U JP 6023282 U JP6023282 U JP 6023282U JP S58162184 U JPS58162184 U JP S58162184U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- metal case
- display device
- diode display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は本案品の一実施例を示す路外観斜視図、第２図
は本案品の一実施例の略断面図である。 １・・・金属ケース、２・・・発光部本体、４・・・底
板、５．５′・・・リード線、６・・・発光ダイオード
素子、８・・・絶縁性合成樹脂、９・・・電流制限用抵
抗器、１１・・・電極。
は本案品の一実施例の略断面図である。 １・・・金属ケース、２・・・発光部本体、４・・・底
板、５．５′・・・リード線、６・・・発光ダイオード
素子、８・・・絶縁性合成樹脂、９・・・電流制限用抵
抗器、１１・・・電極。
Claims (1)
- 発光部本体、金属ケース及び電流制限用抵抗器を具備し
た発光ダイオード表示装置において、前記発光部本体は
発光ダイオード素子の電気的に接続された２個のリード
線の先端部−を透過性の絶縁性合成樹脂でモールド成型
したものであり、かつその下端部を金属ケースの上端開
口部に嵌入固定することに取り付けられるものであり、
前記金属ケースの下端部に形成され、かつ金属ケースと
は′絶縁されている電極と、電流制限用抵抗器と、発光
部本体と、金属ケースとは電気的に直列に接続されてい
るものであることを特徴とする発光ダイオード表示装置
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6023282U JPS58162184U (ja) | 1982-04-23 | 1982-04-23 | 発光ダイオ−ド表示装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6023282U JPS58162184U (ja) | 1982-04-23 | 1982-04-23 | 発光ダイオ−ド表示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58162184U true JPS58162184U (ja) | 1983-10-28 |
Family
ID=30070488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6023282U Pending JPS58162184U (ja) | 1982-04-23 | 1982-04-23 | 発光ダイオ−ド表示装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58162184U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014376B1 (ja) * | 1970-12-11 | 1975-05-27 |
-
1982
- 1982-04-23 JP JP6023282U patent/JPS58162184U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014376B1 (ja) * | 1970-12-11 | 1975-05-27 |
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