JPS5897855U - 発光ダイオ−ドランプ - Google Patents
発光ダイオ−ドランプInfo
- Publication number
- JPS5897855U JPS5897855U JP19587881U JP19587881U JPS5897855U JP S5897855 U JPS5897855 U JP S5897855U JP 19587881 U JP19587881 U JP 19587881U JP 19587881 U JP19587881 U JP 19587881U JP S5897855 U JPS5897855 U JP S5897855U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light
- diode lamp
- light emitting
- color
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
図面はこの考案の実施例を示す正面図である。
１・・・・・・発光ダイオード、２・・曲直列抵抗、３
・・・・・・透光性樹脂、４・・・・・・口金、５・・
・・・・絶縁ベース、６・・・・・・接触子。
・・・・・・透光性樹脂、４・・・・・・口金、５・・
・・・・絶縁ベース、６・・・・・・接触子。
Claims (1)
- 発光ダイオード素子を透光性樹脂でモールドして外形を
小形電球と同一形状にし・た発光ダイオードランプにお
いて、口金と接触子間を絶縁する絶□縁ベースを発光ダ
イオードの表示色に着色して発・光色を表示するように
したことを特徴とする発光ダイオードランプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19587881U JPS5897855U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19587881U JPS5897855U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5897855U true JPS5897855U (ja) | 1983-07-02 |
Family
ID=30109136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19587881U Pending JPS5897855U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897855U (ja) |
-
1981
- 1981-12-24 JP JP19587881U patent/JPS5897855U/ja active Pending
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