JPS5842766A - 無電解ニツケル−ホウ素析出物のホウ素含量の調節 - Google Patents

無電解ニツケル−ホウ素析出物のホウ素含量の調節

Info

Publication number
JPS5842766A
JPS5842766A JP14675182A JP14675182A JPS5842766A JP S5842766 A JPS5842766 A JP S5842766A JP 14675182 A JP14675182 A JP 14675182A JP 14675182 A JP14675182 A JP 14675182A JP S5842766 A JPS5842766 A JP S5842766A
Authority
JP
Japan
Prior art keywords
bath
boron
electroless
soluble
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14675182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0153352B2 (zh
Inventor
グレン・オ−・マロリ−
テレサ・ア−ル・ホ−ン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richardson Chemical Co
Original Assignee
Richardson Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richardson Chemical Co filed Critical Richardson Chemical Co
Publication of JPS5842766A publication Critical patent/JPS5842766A/ja
Publication of JPH0153352B2 publication Critical patent/JPH0153352B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP14675182A 1981-08-24 1982-08-24 無電解ニツケル−ホウ素析出物のホウ素含量の調節 Granted JPS5842766A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29552381A 1981-08-24 1981-08-24
US295523 1981-08-24

Publications (2)

Publication Number Publication Date
JPS5842766A true JPS5842766A (ja) 1983-03-12
JPH0153352B2 JPH0153352B2 (zh) 1989-11-14

Family

ID=23138067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14675182A Granted JPS5842766A (ja) 1981-08-24 1982-08-24 無電解ニツケル−ホウ素析出物のホウ素含量の調節

Country Status (4)

Country Link
EP (1) EP0073583B1 (zh)
JP (1) JPS5842766A (zh)
CA (1) CA1176404A (zh)
DE (1) DE3269823D1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01222064A (ja) * 1988-03-02 1989-09-05 Hitachi Ltd 化学ニッケルめっき液およびそれを使用する方法
JP2007270344A (ja) * 2006-03-09 2007-10-18 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液
JP2013028866A (ja) * 2006-03-09 2013-02-07 Okuno Chemical Industries Co Ltd 無電解ニッケルめっき液

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
JP2002226974A (ja) * 2000-11-28 2002-08-14 Ebara Corp 無電解Ｎｉ−Ｂめっき液、電子デバイス装置及びその製造方法
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
CN111118480B (zh) * 2020-01-14 2022-02-11 常州大学 一种低温化学镀Ni-B二元合金层的化学镀液及化学镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1198167B (de) * 1958-11-26 1965-08-05 Du Pont Waessriges Bad zur chemischen Abscheidung von UEberzuegen aus Nickel-Bor- oder Kobalt-Bor-Legierungen
US4139660A (en) * 1963-07-16 1979-02-13 Bernhard Joos Method for increasing solid surface tension
GB1360592A (en) * 1973-02-14 1974-07-17 Rca Corp Electroless cobalt plating bath
US4019910A (en) * 1974-05-24 1977-04-26 The Richardson Chemical Company Electroless nickel polyalloy plating baths
US4151311A (en) * 1976-01-22 1979-04-24 Nathan Feldstein Post colloid addition of catalytic promoters to non noble metal principal catalytic compounds in electroless plating catalysts
IT1070268B (it) * 1976-10-19 1985-03-29 Alfachimici Spa Composizione per la deposizione anelettrica di leghe a base di nichelio
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
GB2066857A (en) * 1980-01-07 1981-07-15 Vmei Lenin Nis >Method for the production of an abrasive surface

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01222064A (ja) * 1988-03-02 1989-09-05 Hitachi Ltd 化学ニッケルめっき液およびそれを使用する方法
JP2007270344A (ja) * 2006-03-09 2007-10-18 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液
JP2013028866A (ja) * 2006-03-09 2013-02-07 Okuno Chemical Industries Co Ltd 無電解ニッケルめっき液

Also Published As

Publication number Publication date
EP0073583B1 (en) 1986-03-12
JPH0153352B2 (zh) 1989-11-14
CA1176404A (en) 1984-10-23
DE3269823D1 (en) 1986-04-17
EP0073583A1 (en) 1983-03-09

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