JPS5842435A - Manufacture of signal record carrier - Google Patents

Manufacture of signal record carrier

Info

Publication number
JPS5842435A
JPS5842435A JP14002081A JP14002081A JPS5842435A JP S5842435 A JPS5842435 A JP S5842435A JP 14002081 A JP14002081 A JP 14002081A JP 14002081 A JP14002081 A JP 14002081A JP S5842435 A JPS5842435 A JP S5842435A
Authority
JP
Japan
Prior art keywords
mold
photocurable resin
resin
flat plate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14002081A
Other languages
Japanese (ja)
Inventor
Koichi Konishi
小西 弘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14002081A priority Critical patent/JPS5842435A/en
Publication of JPS5842435A publication Critical patent/JPS5842435A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D17/00Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
    • B29D17/005Producing optically read record carriers, e.g. optical discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/52Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To obtain the titled carrier that is stable and can be provided at a low cost, by putting a photo-setting resin on a press mold that has contoured signals, placing a transparent pressing flat plate, and irradiating them under pressure with a light. CONSTITUTION:A mold 11 is placed on a mold securing bed 14, and then a light-curing resin 12 and a transparent plate 15 are placed thereon. Then the transparent pressing flat plate 13 is put thereon, pressure is applied by a pressing mechine 16, and a light source 18 attached to a light source securing bed 17 is lit while keeping the pressure to cure the photo-setting resin 12. Thereafter, the mold 11 is removed from the photo-setting resin 12 to obtain an intended signal record carrier.

Description

【発明の詳細な説明】 本発明はビデオディスクやオーディオディスクのような
映像、音響もしくは他の情報信号が面の凹凸の形で記録
されCいる信号記録担体の製造法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a signal recording carrier, such as a video disc or an audio disc, on which video, audio or other information signals are recorded in the form of surface irregularities.

通常、信号記録担体の製造法にはコンプレッションプレ
ス法、インジェクションプレス法、光硬化型樹脂法等が
ある・ 光硬化型樹脂法とは第1図に示すように、金型固定台(
υ上の金型(2)上に光硬化型樹脂(3)を載せ、その
−ヒに透明基板(1)を載せ、加圧用平板15)を介し
C光硬化型樹1IivDI)及び透明基板(4)にプレ
ス機(6)で加圧し、加圧解除後透明基板(4)を透し
°C光源(7)より光を照射し、光硬化型樹脂(3)を
硬化させてから金型(2)を取り去り、信号記録担体を
製造する方法である。
Normally, there are compression press method, injection press method, photocurable resin method, etc. for manufacturing signal recording carriers.The photocurable resin method is as shown in Figure 1.
A photocurable resin (3) is placed on the mold (2) on υ, a transparent substrate (1) is placed on the mold (2), and a C photocurable resin (1IivDI) and a transparent substrate ( 4) is pressurized with a press machine (6), and after the pressure is released, light is irradiated from the °C light source (7) through the transparent substrate (4) to harden the photocurable resin (3), and then the mold is removed. This is a method of manufacturing a signal recording carrier by removing (2).

この製造法には次のよう7ノ入点がある。先ず第1に、
圧力を解除した状態で樹脂を硬化させるの ゛で光硬化
型樹脂の膜厚が厚く不均一になる。第2に光硬化型樹脂
の硬化時の収縮により信号記録担体が反り易い。第8に
、圧力を解除したときに光硬化型樹脂の戻りによOその
末端の万に気泡等の火陥を生じ易い。第4に、厚みの薄
い金型を使用した場合その金型の反りにより信号面にも
反りを生ずる。第5に、光硬化型樹脂の量を多く必要と
する。第6に、コストが高い。
This manufacturing method has seven points as follows. First of all,
If the resin is cured with the pressure released, the film thickness of the photocurable resin will become thick and uneven. Second, the signal recording carrier tends to warp due to shrinkage of the photocurable resin during curing. Eighth, when the pressure is released, the return of the photocurable resin tends to cause bubbles and other fires at the ends of the resin. Fourthly, when a thin mold is used, the signal surface will also warp due to the warp of the mold. Fifth, a large amount of photocurable resin is required. Sixth, the cost is high.

本発明は1制の天恵を解決するために為されたもので、
安定で低コストな光硬化型樹脂法による信号記録担体の
製造法を提供するものである。以下本発明を実施例を示
す図面に基づい′C説明する。
This invention was made to solve the blessing of the first system.
The present invention provides a method for manufacturing a signal recording carrier using a stable and low-cost photocurable resin method. The present invention will be explained below based on drawings showing embodiments.

第2図及び第8図に夫々本発明の異rzつ1.一実施例
を示し、両図におい゛C本発明は面上に凹凸状の信号を
記録したプレス用金型I功の七に光硬化型樹脂(1埠を
載せ、更に該光硬化型樹脂θののtに透明な加圧用平板
03を配置し、前記金型(lηと加圧用平板03との間
に圧力をカロえて光硬化型樹脂α→をその加圧状態を保
持したまま加圧用平板θ1側から光を照射し゛C硬化さ
せ、しかるのち金型(II)を取り去ることにより信号
記録担体を製造するものである。
FIG. 2 and FIG. 8 show the differences of the present invention 1. An example is shown in both figures. In the present invention, a photo-curing resin (1 layer) is placed on the press mold 1, which has an uneven signal recorded on its surface, and the photo-curing resin θ A transparent pressurizing flat plate 03 is placed on the nono t, pressure is applied between the mold (lη) and the pressurizing flat plate 03, and the photocurable resin α→ is placed on the pressurizing flat plate while maintaining the pressurized state. A signal recording carrier is manufactured by irradiating light from the θ1 side to cause curing, and then removing the mold (II).

即ち金型固定台0荀の上に金型(l])を固定し、その
、ヒに光硬化型樹脂0埠を、更に透明基板Qlを載せ、
その上に透明な加圧用平板0葎を重ね、プレス機a・に
より圧力を加え、その加圧を保持しtコ状態で光源固定
台αηに取り付けられt、:光源(ト)を点灯し、光硬
化型樹脂G■を硬化させる、その後光硬化型樹脂(2)
から金型Lll>を取り去り信号記録担体を製造する。
That is, the mold (l) is fixed on a mold fixing table 0, and the photocurable resin 0 is placed on it, and the transparent substrate Ql is placed on it.
A transparent pressure plate is placed on top of it, pressure is applied using a press machine a, the pressure is maintained, and the light source is attached to the light source fixing stand αη, and the light source is turned on. Curing the photocurable resin G■, then photocuring resin (2)
The mold Lll> is removed from the mold to produce a signal recording carrier.

尚上記方法において透明基板αQを使用せず、光硬化型
樹脂aカにより信号記録と同時に基板を作製するように
しても良い。
Incidentally, in the above method, the transparent substrate αQ may not be used, and the substrate may be produced simultaneously with signal recording using a photocurable resin a.

次に第1の具体例を第2図に従つ゛C説明する。Next, a first specific example will be explained with reference to FIG.

透明な加圧用平板0として厚み1.51:II、直径8
41の透明石美板を用い、光硬化型樹脂@としC2,2
−ビス(4−アクリ甲イルオキシジエチレンオキシフェ
ニルンプuパン(商品名:NKエステルA−BPE−4
) 100 重>l B%とベンゾインイソプロビルエ
ーテル8重鼠部からなる紫外線硬化型樹脂1(lylを
用い、光源0ンとしCtKWの水銀灯1本を、透明基板
(ト)としC厚み1゛酩、直径201のアクリル板を、
金型C1,)としCH径32(1!Iのニッケル製金型
を夫々用い、プレス機(1qで金型固定台αφを押し上
げ4 kg/cdまで加圧し、その状態で水銀灯を1分
間点灯させ、紫外線硬化型樹脂゛を硬化した。硬化後ニ
ッケル製金型を取り去り信号記録担体を作製した。
Thickness 1.51:II as transparent pressure plate 0, diameter 8
Using 41 transparent stone plates, photo-curable resin @ Toshi C2,2
-Bis(4-acryloyloxydiethyleneoxyphenylpan) (Product name: NK ester A-BPE-4
) 100 weight > l Ultraviolet curing resin 1 (lyl) consisting of B% and benzoin isopropyl ether 8-fold, the light source is 0, one CtKW mercury lamp is used as a transparent substrate (T), and the thickness of C is 1゛. , an acrylic plate with a diameter of 201 mm,
Using a nickel mold with a CH diameter of 32 (1! The ultraviolet curable resin was cured. After curing, the nickel mold was removed to prepare a signal recording carrier.

他の例、ヒ1〕゛C%透明な加圧用平板(ロ)として厚
み1.5 (’1n 、直径841のアクリル板を用い
、光源(ト)として第1巨体例と同一の水銀灯を用い、
点灯時間を2分間とし、他は第1具体例と同一条件にて
信号記録担体を作製しIこ。
Another example, H1゛C% An acrylic plate with a thickness of 1.5 ('1n) and a diameter of 841 was used as the transparent pressure plate (b), and the same mercury lamp as in the first giant example was used as the light source (g). ,
A signal recording carrier was produced under the same conditions as the first example except that the lighting time was 2 minutes.

更に他の例とし゛C第8図を用いて説明すると、透明な
加圧用平板a1とし′C厚み1.5画、直径84αのガ
ラス板を用い、透明基板すQとし′C厚みIff、直径
20zの透明塩化ヒニール板を、光硬化型樹脂(6)硬
化型樹脂10weを用い、金型(11)とし°C直径8
21の銅製電型を、光源0I111としC1犯■の水銀
灯1本を用い、プレス機0ゆでガラス板を上方より押し
付け4kg、/cyjまで加圧し、その状態で水銀灯を
1分間点灯させ、紫外線硬化型樹脂を硬化した。硬化後
、銅製金型を取り去り信号記録担体を作製した。
As another example, using FIG. 8, a transparent pressurizing flat plate a1 is a glass plate with a thickness of 1.5 mm and a diameter of 84α, and a transparent substrate is Q with a thickness of Iff and a diameter of 20 mm. A transparent hinyl chloride plate was used as a mold (11) using a photocurable resin (6) and a curable resin of 10 degrees Celsius with a diameter of 8°C.
Using a mercury lamp of C1 type with light source 0I111, press the boiled glass plate of press machine 0 from above to pressurize it to 4kg/cyj, turn on the mercury lamp for 1 minute in that state, and cure with ultraviolet rays. The mold resin was cured. After curing, the copper mold was removed to prepare a signal recording carrier.

上記各方法による信号記録担体は従来法に比べ、気泡等
による二(陥が非常に少)r < %又光硬化型樹脂の
膜厚も100μrnから4 (177mまで薄くでき、
更にその均一性も±50μmから±10μmまで向上さ
せることができた。
Signal recording carriers made by each of the above methods can be reduced in thickness from 100 μrn to 4 (177 m) with less defects due to air bubbles, etc., compared to conventional methods.
Furthermore, the uniformity could be improved from ±50 μm to ±10 μm.

本発明信号記録担体の製造法は以上述べたように実施し
得るもので次に述べるような効果が得られる。
The method for manufacturing the signal recording carrier of the present invention can be carried out as described above, and the following effects can be obtained.

■ 加圧状態を保持したまま光硬化型樹脂を硬化させる
ので光硬化型樹脂の膜厚を半分以下にでき、更にその膜
厚分布も非常に均一にできる。
(2) Since the photocurable resin is cured while maintaining the pressurized state, the film thickness of the photocurable resin can be reduced to less than half, and the film thickness distribution can also be made very uniform.

又光硬化型樹脂の硬化時の収縮による信号記録担体の反
りも起らない。
Further, the signal recording carrier does not warp due to contraction of the photocurable resin during curing.

■ 厚みの薄い金型を用いCも、金型の反りの影響を受
けないので信号記録担体の信号面の反りがない。
(2) Since a thin mold is used, the signal surface of the signal recording carrier does not warp because it is not affected by warping of the mold.

■ 光硬化型樹脂が硬化するまで圧力を解除しないので
光硬化型樹脂の戻りがなく、気泡が生じない。
■ Since the pressure is not released until the photocurable resin is cured, there is no return of the photocurable resin and no air bubbles are generated.

■ 装置を小型化できる。■ The device can be made smaller.

■ 光硬化型樹脂の種類により物理的な特性(特に粘性
)が変化しても容易に対応することができる。
■ Easily adaptable to changes in physical properties (particularly viscosity) depending on the type of photocurable resin.

■ これらにより光硬化型樹脂の使用量を少なくでき、
行程も簡易化できるのでコストを下ケることが“できる
■ These allow us to reduce the amount of photocurable resin used,
Since the process can be simplified, costs can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例を示す概略断面図、第2図及び第8図は
夫々本発明の異なつtコ実施例を示す概略断面図である
。 0υ・・・金型、0埠・・・光硬化型樹脂、α4・・・
加圧用平板。 θ→・・・金型固定台、((Q・・・透明基板、 QI
G・・・プレス機。 (17)・・・光源固定台、α榎・・・光源代理人  
森 本 義 弘 第1図 第2図 199− 第3図
FIG. 1 is a schematic sectional view showing a conventional example, and FIGS. 2 and 8 are schematic sectional views showing different embodiments of the present invention. 0υ...mold, 0υ...light curing resin, α4...
Flat plate for pressure. θ→...Mold fixing base, ((Q...Transparent substrate, QI
G...Press machine. (17)...Light source fixing stand, α Enoki...Light source agent
Yoshihiro Morimoto Figure 1 Figure 2 199- Figure 3

Claims (1)

【特許請求の範囲】[Claims] 1、 面上に凹凸状の信号を記録したプレス用金型の上
に光硬化型樹脂を載せ、更に該光硬化型樹脂の上に透明
な加圧用平板を配置し、前記金型と加圧用平板との間に
圧力を加えて光硬化型樹脂をこの加圧状態を保持したま
ま加圧用平板側から光を照射し°C硬化させ、しかるの
ち金型を取り去ることを特徴とする信号記録担体の製造
法。
1. A photocurable resin is placed on a press mold with an uneven signal recorded on its surface, and a transparent pressurizing flat plate is placed on top of the photocurable resin, and the press mold and the pressurizing mold are placed on top of the photocurable resin. A signal recording carrier characterized by applying pressure between the photocurable resin and a flat plate, irradiating the photocurable resin with light from the pressurizing flat plate side while maintaining this pressurized state to cure it at °C, and then removing the mold. manufacturing method.
JP14002081A 1981-09-04 1981-09-04 Manufacture of signal record carrier Pending JPS5842435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14002081A JPS5842435A (en) 1981-09-04 1981-09-04 Manufacture of signal record carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14002081A JPS5842435A (en) 1981-09-04 1981-09-04 Manufacture of signal record carrier

Publications (1)

Publication Number Publication Date
JPS5842435A true JPS5842435A (en) 1983-03-11

Family

ID=15259067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14002081A Pending JPS5842435A (en) 1981-09-04 1981-09-04 Manufacture of signal record carrier

Country Status (1)

Country Link
JP (1) JPS5842435A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62144914A (en) * 1985-12-18 1987-06-29 Alps Electric Co Ltd Manufacture of optical component and device thereof
JPS63312122A (en) * 1987-06-12 1988-12-20 Omron Tateisi Electronics Co Manufacture of resin disc
WO1998053452A1 (en) * 1997-05-23 1998-11-26 Steag Hamatech Ag Device for drying substrates

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749530A (en) * 1980-09-08 1982-03-23 Mitsubishi Electric Corp Manufacture of replica
JPS5749529A (en) * 1980-09-08 1982-03-23 Mitsubishi Electric Corp Manufacture of replica
JPS57163533A (en) * 1981-04-01 1982-10-07 Toppan Printing Co Ltd Preparation of information recording carrier
JPS57212028A (en) * 1981-06-24 1982-12-27 Hitachi Ltd Production of disk form substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749530A (en) * 1980-09-08 1982-03-23 Mitsubishi Electric Corp Manufacture of replica
JPS5749529A (en) * 1980-09-08 1982-03-23 Mitsubishi Electric Corp Manufacture of replica
JPS57163533A (en) * 1981-04-01 1982-10-07 Toppan Printing Co Ltd Preparation of information recording carrier
JPS57212028A (en) * 1981-06-24 1982-12-27 Hitachi Ltd Production of disk form substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62144914A (en) * 1985-12-18 1987-06-29 Alps Electric Co Ltd Manufacture of optical component and device thereof
JPH0217336B2 (en) * 1985-12-18 1990-04-20 Alps Electric Co Ltd
JPS63312122A (en) * 1987-06-12 1988-12-20 Omron Tateisi Electronics Co Manufacture of resin disc
JPH0725093B2 (en) * 1987-06-12 1995-03-22 オムロン株式会社 Resin disk manufacturing method
WO1998053452A1 (en) * 1997-05-23 1998-11-26 Steag Hamatech Ag Device for drying substrates

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