JPS5841097B2 - Method for separating and recovering components of chips from metal-clad laminates - Google Patents
Method for separating and recovering components of chips from metal-clad laminatesInfo
- Publication number
- JPS5841097B2 JPS5841097B2 JP52091466A JP9146677A JPS5841097B2 JP S5841097 B2 JPS5841097 B2 JP S5841097B2 JP 52091466 A JP52091466 A JP 52091466A JP 9146677 A JP9146677 A JP 9146677A JP S5841097 B2 JPS5841097 B2 JP S5841097B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- chips
- substrate
- components
- separating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Description
【発明の詳細な説明】
本発明は金属箔の付着した、熱硬化性樹脂層を基板とす
る金属張積層板の切粉から金属成分と基板成分と分離回
収する方法に関する
近年の電子通信機器の隆盛に伴い、プリント基板の生産
量は５１年６月には月産１００万枚以上に及んでいる。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for separating and recovering metal components and substrate components from chips of a metal-clad laminate having a thermosetting resin layer as a substrate to which metal foil is attached. As the industry flourished, production of printed circuit boards reached more than 1 million pieces per month in June 1951.
一方、最近の建材の耐久性志向、装飾性志向に伴い、金
属張化粧積層板の全国的な生産量は今後も増大するもの
と予想される。On the other hand, with the recent trend toward durability and decorativeness in building materials, it is expected that the nationwide production of metal-clad decorative laminates will continue to increase.
これら金属の付着した熱硬化性樹脂層を基板とする金属
張積層板を鋸刃又は鉋で加工する際に大量の切粉が発生
している。A large amount of chips are generated when a metal-clad laminate having a thermosetting resin layer to which metal is attached as a substrate is processed with a saw blade or a plane.
これらの切屑は従来は費用をかけて焼却していたが、金
属成分と基板成分を分離できれば、前者は金属資源とし
て後者は成形材料等の有機物フィラーとしての用途は確
立されており、中でも耐燃縁の基板からは、耐燃性フィ
ラーとして有用な資材である。Conventionally, these chips were incinerated at a high cost, but if the metal component and substrate component can be separated, the former can be used as a metal resource, and the latter can be used as an organic filler for molding materials. The substrate is a useful material as a flame-resistant filler.
本発明はかかる可能性がありながら有効なる両成分への
分離ができなかったために焼却していた切粉を、金属成
分と基板成分とに分離回収する方法を提供するものであ
る。The present invention provides a method for separating and recovering chips into a metal component and a substrate component, which would otherwise be incinerated because effective separation into both components could not be achieved despite this possibility.
以下に具体的に説明を加える。A detailed explanation will be added below.
本発明の対象とする材料の一つは金属の付着した熱硬化
性樹脂層を基板とする金属張積層板から派生したもので
ある。One of the materials to which the present invention is directed is derived from a metal-clad laminate whose substrate is a thermosetting resin layer to which metal is attached.
ここに示された金属箔とは、銅、鉄、ニッケル、アルミ
ニウムその他の金属単体乃至はこれらの金属を主成分と
する合金又は表面に異種金属のメッキや酸化物、その他
の被膜が形成されているものをも含む。The metal foil shown here refers to single metals such as copper, iron, nickel, aluminum, or alloys mainly composed of these metals, or to metal foils with different metal plating, oxides, or other coatings formed on the surface. Including those who are present.
また、熱硬化性樹脂層とは紙基材フェノール系樹脂、又
は紙基材エポキシ系樹脂、合成繊維基材エポキシ系樹脂
、その他三次元的な架橋構造をもつ熱硬化性樹脂の硬化
物で適当な可塑剤、添加物を含んでもよく、基材はあっ
てもなくてもよい。In addition, the thermosetting resin layer may be a cured product of paper-based phenolic resin, paper-based epoxy resin, synthetic fiber-based epoxy resin, or other thermosetting resin with a three-dimensional crosslinked structure. It may contain plasticizers and additives, and may or may not contain a base material.
材料の形状としては、粉状、粒状、線状又は薄片状が好
ましい。The shape of the material is preferably powder, granule, linear, or flaky.
これは該分離液媒が該熱硬化樹脂層に特に金属箔と基板
層の境界に瞬時に浸透剥離促進の効果を出すために必要
だからである。This is because the separating liquid medium is necessary to instantaneously permeate into the thermosetting resin layer, particularly at the boundary between the metal foil and the substrate layer, to promote peeling.
そのための加工具として鋸刃、鉋が掲げられるが、同等
の形状が得られるならば他の加工具、機械でも構わない
。Saw blades and planes are cited as processing tools for this purpose, but other processing tools and machines may be used as long as the same shape can be obtained.
分離液媒としてエチレン、エタン又はベンゼンの各塩素
化誘導体と限定したのは、該金属張積層板に対するヌレ
性、浸透性、膨潤性がよいので金属箔と基板層の境界に
おける密着力を瞬時なこ低下させる働きと、基板層より
大きな比重とを同時に兼備し、かつ、工業用としても扱
いやすい化合物だからである。The reason why chlorinated derivatives of ethylene, ethane, or benzene are used as the separation liquid medium is because they have good wettability, permeability, and swelling properties for the metal-clad laminate, so that the adhesion at the boundary between the metal foil and the substrate layer can be instantly maintained. This is because it is a compound that simultaneously has the function of lowering the specific gravity and has a specific gravity greater than that of the substrate layer, and is also easy to handle for industrial use.
具体例として２，２ジクロルエチルエーテル、ジ塩化エ
チレン、オルソジクロルベンゼン、トリクロルベンゼン
、トリクロルエチレン、過クロルエチレン等が掲げられ
る。Specific examples include 2,2 dichloroethyl ether, dichloroethylene, orthodichlorobenzene, trichlorobenzene, trichlorethylene, perchlorethylene, and the like.
更に、ヌレ性、浸透性を向上させるために各種の界面活
性剤を添加することは勿論可能である。Furthermore, it is of course possible to add various surfactants to improve wettability and permeability.
該基板より大きな比重を有する単独又は混合の分離媒体
中に投じ、同液中にてはげしく撹拌すれば該分離液媒の
働きにより該金属は該基板とは瞬時に分離し、撹拌を抑
えれば速やかに金属成分は底部に沈降し、基板成分は浮
遊浮上するためこれらを別々に取り出すことは容易とな
る。If the metal is poured into a single or mixed separation medium having a specific gravity greater than that of the substrate and stirred vigorously in the same liquid, the metal will instantly separate from the substrate by the action of the separation liquid medium, and if the stirring is suppressed, the metal will separate from the substrate instantly. Since the metal components quickly settle to the bottom and the substrate components float, it is easy to take them out separately.
かくして得られる金属成分、基板成分を適宜乾燥し、溶
剤を除けば充分利用できる資材として回収できるもので
ある。If the metal components and substrate components thus obtained are dried appropriately and the solvent is removed, they can be recovered as fully usable materials.
Claims (1)
張積層板の鋸刃又は鉋の加工により生じた粉状、粒状、
糸状又は薄片状の切粉を、エチレン、エタン、又はベン
ゼンの各多塩素化誘導体のうち、該基板より大きな比重
を有する単独又は混合成分の液中に投じ、同液中にては
げしく撹拌し、しかるのち該切粉の金属成分を沈降させ
基板成分を浮遊浮上させ各々を取出すことを特徴とする
金属張積層板の切粉から金属成分と基板成分を分離回収
する方法。1. Powder, granules, etc. generated by saw blade or plane processing of metal-clad laminates with metal foil attached and thermosetting resin substrates;
Thread-like or flaky chips are thrown into a solution of polychlorinated derivatives of ethylene, ethane, or benzene, either singly or in combination, having a specific gravity greater than that of the substrate, and vigorously stirred in the same solution, A method for separating and recovering metal components and substrate components from chips of a metal-clad laminate, characterized in that the metal components of the chips are then allowed to settle, and the substrate components are floated and taken out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52091466A JPS5841097B2 (en) | 1977-08-01 | 1977-08-01 | Method for separating and recovering components of chips from metal-clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP52091466A JPS5841097B2 (en) | 1977-08-01 | 1977-08-01 | Method for separating and recovering components of chips from metal-clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5426567A JPS5426567A (en) | 1979-02-28 |
| JPS5841097B2 true JPS5841097B2 (en) | 1983-09-09 |
Family
ID=14027147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52091466A Expired JPS5841097B2 (en) | 1977-08-01 | 1977-08-01 | Method for separating and recovering components of chips from metal-clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5841097B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100889315B1 (en) * | 2007-11-16 | 2009-03-18 | 한국지질자원연구원 | Novel pre-treatment process for liberation of metals from waste printed circuit boards using organic solution |
-
1977
- 1977-08-01 JP JP52091466A patent/JPS5841097B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5426567A (en) | 1979-02-28 |
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