JPS5840848U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5840848U JPS5840848U JP13516281U JP13516281U JPS5840848U JP S5840848 U JPS5840848 U JP S5840848U JP 13516281 U JP13516281 U JP 13516281U JP 13516281 U JP13516281 U JP 13516281U JP S5840848 U JPS5840848 U JP S5840848U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- conductive layer
- layer
- semiconductor
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は夫々本考案の実施例を示す断面図で
ある。
１は半導体基体、２，４はＳｉＯ２層、３は５ｎＯ９透
明導電層、６はＴｉ層、７はＷ層、８はＡＩ導電層であ
る。1 and 2 are cross-sectional views showing embodiments of the present invention, respectively. 1 is a semiconductor substrate, 2 and 4 are SiO2 layers, 3 is a 5nO9 transparent conductive layer, 6 is a Ti layer, 7 is a W layer, and 8 is an AI conductive layer.
Claims (1)
してチタン層及びタングステン層を介してアルミニウム
導電層が接続されて成る半導体装置。A semiconductor device in which an aluminum conductive layer is connected to a transparent conductive layer made of tin oxide formed on a semiconductor element through a titanium layer and a tungsten layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13516281U JPS5840848U (en) | 1981-09-11 | 1981-09-11 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13516281U JPS5840848U (en) | 1981-09-11 | 1981-09-11 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5840848U true JPS5840848U (en) | 1983-03-17 |
| JPS62206Y2 JPS62206Y2 (en) | 1987-01-07 |
Family
ID=29928545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13516281U Granted JPS5840848U (en) | 1981-09-11 | 1981-09-11 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5840848U (en) |
-
1981
- 1981-09-11 JP JP13516281U patent/JPS5840848U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62206Y2 (en) | 1987-01-07 |
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