JPS5840614Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5840614Y2
JPS5840614Y2 JP1981004300U JP430081U JPS5840614Y2 JP S5840614 Y2 JPS5840614 Y2 JP S5840614Y2 JP 1981004300 U JP1981004300 U JP 1981004300U JP 430081 U JP430081 U JP 430081U JP S5840614 Y2 JPS5840614 Y2 JP S5840614Y2
Authority
JP
Japan
Prior art keywords
wire bonding
circuit element
wire
external lead
semiconductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981004300U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56167549U (enrdf_load_stackoverflow
Inventor
健一 近藤
謙二郎 八木
Original Assignee
セイコーインスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーインスツルメンツ株式会社 filed Critical セイコーインスツルメンツ株式会社
Priority to JP1981004300U priority Critical patent/JPS5840614Y2/ja
Publication of JPS56167549U publication Critical patent/JPS56167549U/ja
Application granted granted Critical
Publication of JPS5840614Y2 publication Critical patent/JPS5840614Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1981004300U 1981-01-16 1981-01-16 半導体装置 Expired JPS5840614Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981004300U JPS5840614Y2 (ja) 1981-01-16 1981-01-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981004300U JPS5840614Y2 (ja) 1981-01-16 1981-01-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS56167549U JPS56167549U (enrdf_load_stackoverflow) 1981-12-11
JPS5840614Y2 true JPS5840614Y2 (ja) 1983-09-13

Family

ID=29600988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981004300U Expired JPS5840614Y2 (ja) 1981-01-16 1981-01-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS5840614Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182858A (ja) * 1982-04-21 1983-10-25 Nec Corp リ−ドフレ−ム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ELECTRONIC DESIGN=1967 *

Also Published As

Publication number Publication date
JPS56167549U (enrdf_load_stackoverflow) 1981-12-11

Similar Documents

Publication Publication Date Title
US6339252B1 (en) Electronic device package and leadframe
CN101471317B (zh) 引线框架封装及引线框架
JP2509595B2 (ja) 電子構成要素のパツケ−ジおよびその製造方法
JPH0815193B2 (ja) 半導体装置及びこれに用いるリードフレーム
US6107676A (en) Leadframe and a method of manufacturing a semiconductor device by use of it
KR0133493B1 (ko) 메탈코어타입 다층 리드프레임
JPH04233244A (ja) 集積回路アセンブリ
JPS5840614Y2 (ja) 半導体装置
JPH10270623A (ja) ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
CN108109926B (zh) 制造半导体器件的方法
US5510654A (en) Semiconductor device and method of fabricating same
JPH05235245A (ja) 半導体集積回路装置
JP2990645B2 (ja) 半導体集積回路用リードフレームおよび半導体集積回路
US7485960B2 (en) Semiconductor device and manufacturing method thereof
JPH06112395A (ja) 混成集積回路装置
KR100668932B1 (ko) 리드프레임 및 이를 이용한 반도체패키지
JP2913858B2 (ja) 混成集積回路
JPH02253650A (ja) リードフレーム
JP2504901B2 (ja) 複数の電子部品パッケ―ジの製造方法
JP2822446B2 (ja) 混成集積回路装置
US6459157B1 (en) Semiconductor device and double-sided multi-chip package
JPH023622Y2 (enrdf_load_stackoverflow)
JP2841459B2 (ja) 混成集積回路
JPS5828359Y2 (ja) 半導体集積回路装置
JP4229086B2 (ja) 半導体装置