JPS5839933A - Inspection method of packaging printed circuit substrate - Google Patents

Inspection method of packaging printed circuit substrate

Info

Publication number
JPS5839933A
JPS5839933A JP13896181A JP13896181A JPS5839933A JP S5839933 A JPS5839933 A JP S5839933A JP 13896181 A JP13896181 A JP 13896181A JP 13896181 A JP13896181 A JP 13896181A JP S5839933 A JPS5839933 A JP S5839933A
Authority
JP
Japan
Prior art keywords
data
printed circuit
line
axis direction
dark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13896181A
Other languages
Japanese (ja)
Inventor
Yoshikazu Sakagami
坂上 義和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13896181A priority Critical patent/JPS5839933A/en
Publication of JPS5839933A publication Critical patent/JPS5839933A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To detect errors and positions of parts on a printed circuit substrate, by making a light and darkness boundary line by a projector on the surface of the printed circuit substrate and obtaining the data of a profile line by photographing the parts on the substrate which is passing the boundary line by a video camera. CONSTITUTION:A printed circuit substrate 1 which is transported is arranged so that the right side of a light and darkness boundary surface Z including an optical axis which is vertical to the substrate 1 is projected by a slit 21 of a projector 2 and the left-side light is shielded. A television camera 3 is arranged so that the optical axis forms 90 deg.-theta angle to an irradiated area Za side against the boundary surface Z, and a scanning direction is arranged so that a horizontal amplitude direction forms right angles to the direction of a boundary line Y between an irradiated area Za and a light shielded area Zb made on the substrate 1. By operating the profile line data of the Y axial direction obtained from a length of the light and darkness part of the Y axial direction, an outer profile in a width direction is decided. Then, the substrate 1 is moved to a prescribed distance and the profile line data in an X axial direction is obtained and the outer profile of a part 13 in the thickness direction is decided. The shape of the part 13 is specified from these data.

Description

【発明の詳細な説明】 この発明は、実装プリント基板上の部品の種類や取付位
置の正誤を検査する為の自動検査方法に勇する。
DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to an automatic inspection method for inspecting the correctness or incorrectness of the types and mounting positions of components on a mounted printed circuit board.

この発明社、定速搬送される実装プリント基板上に投光
器で明暗境界線を形成せしめ、この明暗境界線を通過す
る部品を、斜め上方からビデオカメラで撮像し、コンピ
ュータにより、ビデオ信号走査線の明度変化点を連結し
て得られる部品のY軸方向のりんかく線を特定する為の
Y軸方向特定データを上記定速搬送方向の所定間かく毎
に、走査線暗部長に基いて求め、これらY軸方向特定デ
−夕を組合せて得られる3次元包絡mi特徴づける為の
形状データと位置データな予め記憶された部品の基準形
状データと位置データと夫々照合する構成とすることに
よ抄、プリント基板上の部品の種類と取付位置の正誤を
、自動的に速やかに判定することができる実装プリント
基板の検査方法を提供することを目的とする。
This inventor uses a projector to form a bright and dark boundary line on a mounted printed circuit board that is being transported at a constant speed, and a video camera images the parts passing through this bright and dark boundary line from diagonally above. Y-axis direction specifying data for specifying the link line in the Y-axis direction of the part obtained by connecting the lightness change points is obtained at predetermined intervals in the constant speed conveyance direction based on the dark part of the scanning line, Shape data and position data for characterizing the three-dimensional envelope mi obtained by combining these Y-axis direction specific data are compared with pre-stored reference shape data and position data of the part, respectively. It is an object of the present invention to provide a method for inspecting a mounted printed circuit board that can automatically and quickly determine whether the type of component and the mounting position on the printed circuit board are correct or incorrect.

以下、この発明の一実施例を図について説明する。An embodiment of the present invention will be described below with reference to the drawings.

第1図において、1は巾WO実装プリント基板、11〜
14は半導体集積回路素子等の部である。
In Fig. 1, 1 is a width WO mounting printed circuit board, 11~
Reference numeral 14 denotes a portion such as a semiconductor integrated circuit element.

プリント基板1は図示矢印方向に搬送される。2は投光
器であって、プリント基板1に鐙直な光軸を含む鉛直な
明暗境界面(以下、境界面という、)2の図において右
側に投光し、左側が11党されるようにスリット21が
取付けられ【いる、従って、境界lizを境いにし【右
側が照射域Za s左側がしや光域zbとなる。3aテ
レビカメラであって、光学軸が、境界mzに対し照射域
2@憫へ9a″−#O内角度なし、走査−8の走査方内
社、その水平線中方向が、プリント基板1上に作る照射
域z1としや光域zbの境界線Yの向きと直角にな抄、
第2図の構図についてJR3図の画面30が得られるよ
うにセットされる。この画面では、境界lIyが、境界
Myに対応し、部品13上を走る境界線y。
The printed circuit board 1 is transported in the direction of the arrow shown in the figure. Reference numeral 2 denotes a light projector, which emits light to the right side in the figure of 2, a vertical light-dark boundary surface (hereinafter referred to as the boundary surface) including an optical axis perpendicular to the printed circuit board 1, and has a slit so that the left side is 11 points. 21 is attached, therefore, the right side of the boundary liz is the irradiation area Zas, and the left side is the irradiation area zb. 3a TV camera, the optical axis is 9a''-#O to the boundary mz to the irradiation area 2 @ 2, no angle within 9a''-#O, the scanning direction of scan-8, and the horizontal line middle direction is on the printed circuit board 1. Make the irradiation area z1 perpendicular to the direction of the boundary line Y of the light area zb,
The composition of FIG. 2 is set so that the screen 30 of the JR map 3 can be obtained. In this screen, the boundary lIy corresponds to the boundary My, and is the boundary line y running on the part 13.

部分かりんかく#!(以下、Y軸方向りんかく線という
*)ylに対応する。このりんかく線yl上の点イは、
部品13上の境界!Iyのプリント基板1向よシ最高位
置の点イに対応し、該点イな走査する走査線Sの暗部長
紘、プリント基板1面上の境界線yを走査する走査II
Sの暗部長Lmaxよシtだけ短くなシ、Lは、hに比
例する。即ち、H−k= (H/ tan# ) X 
tan (#−ψ)・・・・・・・−(1)k=H(t
 −tan (e−91) ]   −・−−−−−−
−・−・−”’ (2)なお、ψは微小であるから、例
えIff、a=45  とした場合には、単純な比例計
算によってbを求めることができる。
Part understanding #! (hereinafter referred to as the Y-axis direction link line *) corresponds to yl. Point A on this link line yl is
Boundary on part 13! Corresponding to point A at the highest position across the printed circuit board 1 of Iy, the dark side of the scanning line S that scans the point A, scanning II that scans the boundary line y on the surface of the printed circuit board 1
The dark length of S is shorter than Lmax by t, and L is proportional to h. That is, H-k= (H/tan#)
tan (#-ψ)・・・・・・・-(1) k=H(t
-tan (e-91) ] -・------
-・-・-”' (2) Since ψ is extremely small, if Iff and a=45, b can be found by a simple proportional calculation.

従つ【、部#113上の境界線yt−走査する走査線8
の明度変化点を連結して得られるY軸方向りんかく線1
aが、境界面2で裁断した部品13 の巾方向断面外形
に対応するから、本実施例では、上記走査線の暗部長か
ら、Y軸方向りんか<myaを特徴づける為の特定デー
タを演算して巾方向断面外形を特定する。41定データ
として杜、最大重、□最大高さ、頂部水平部の有無とそ
の長さ、中心座標があれに充分である0次に、プリント
基板1が所定距離移動する毎に上記特定データを求めて
夫々の中心座標−の高さを順次連結して得られるX軸方
向シんか<axoq#定データを得る。このX軸方肉粉
んかく線は、境界1iizと直交する鉛直面で裁断した
部品130厚さ方向断面外形に対応するから、こ□X軸
方向)んかく線の特定データ(最大厚さDa最大高さh
、水平頂部の長さdim中心座標Xs)を求めて厚さ方
向断面外形を特定する。このシんか〈−の特徴データ抽
出点Xs 、!+、X7、−一に、夫々対応するりんか
<Jlyaを合せて包路線を作るとこれは部品13の外
形に対応゛するから、本実施例では、X軸方向りんかく
線の始点及び終点、水平頂部O始“点及び終点、中心−
座標に、夫々対応するY軸方向シんか(liyaについ
て得た最大重−1水平頂部長さ■1中心座標Ymを重ね
て、X軸方肉粉んかく線の始点及び終点におけるりんか
く線γaの始点及び終点の位置X、Y、水平頂部の位置
、中央部の位置を演算して部品13のプリント基板1上
の位置を特定し、最大巾−最大厚さ論、水平頂部長さ−
、dm、最大高さ11m(以下、これらをまとめ形状デ
ータという)と中央部位置Xm、Ymを、部品130基
準形状データ及びプリント基板上の基準取付位置と照合
させ、部品O差込み誤)や、差込み忘れ、位置ずれ等の
検査を自動的に行わせる。
Accordingly, [, boundary line yt on section #113 - scanning line 8 to be scanned]
Y-axis direction link line 1 obtained by connecting the brightness change points of
Since a corresponds to the cross-sectional profile in the width direction of the part 13 cut at the boundary surface 2, in this embodiment, specific data for characterizing the Y-axis direction linkage <mya is calculated from the dark part of the scanning line. Specify the cross-sectional shape in the width direction. 41 As constant data, the forest, maximum weight, □ maximum height, presence or absence of the top horizontal part, its length, and center coordinates are sufficient for that. Then, the heights of the respective center coordinates - are successively connected to obtain constant data in the X-axis direction <axoq#. This X-axis direction flesh-grain line corresponds to the cross-sectional profile in the thickness direction of the part 130 cut on the vertical plane perpendicular to the boundary 1iiz, so the specific data (maximum thickness Da height h
, the length (dim) of the horizontal apex (center coordinate Xs), and the cross-sectional shape in the thickness direction is specified. Feature data extraction point Xs of this sink〈-,! +, Horizontal top O start point and end point, center -
Superimpose the corresponding Y-axis direction coordinates (maximum weight obtained for liya - 1 horizontal top length x 1 center coordinate Ym) on the coordinates, and calculate the link line γa at the start and end points of the X-axis direction line. The position of the component 13 on the printed circuit board 1 is determined by calculating the positions X and Y of the starting point and end point, the position of the horizontal top, and the position of the center, and the maximum width, maximum thickness, and horizontal top length are calculated.
, dm, the maximum height of 11 m (hereinafter collectively referred to as shape data) and the center position Xm, Ym are compared with the standard shape data of part 130 and the standard mounting position on the printed circuit board, and it is determined that part O was inserted incorrectly). Automatically checks for forgotten insertion, misalignment, etc.

次に、部品と、その取付位置の特定方法について説明す
る。
Next, a method for specifying parts and their mounting positions will be explained.

1)  Y軸方向の特定データ 境界線1の一部がプリント基板10面に対して高さを持
つとY軸方向りんかく線yaができるので、1EalO
走査線8nO暗部長が始めてLn+axよシ短かくなっ
た場合Ku、該走査線gnがシんかく線yaの始点とな
る。以後の走査線の暗部長は順次減少し、最短となった
後に順次増大して1jnaxとなる。この時の走査II
CI! q番目とする)が9んか(線y1の終点となる
。また部品と部品がオーバラップしているときに社長さ
Lが減少して急に増加したときが次の部品に変化したと
きである。
1) If a part of the specific data boundary line 1 in the Y-axis direction has a height with respect to the printed circuit board 10 surface, a link line ya in the Y-axis direction is created, so 1EalO
When the dark part of the scanning line 8nO first becomes shorter than Ln+ax, the scanning line gn becomes the starting point of the thinning line ya. The dark length of subsequent scanning lines decreases sequentially, reaches the shortest length, and then increases sequentially to 1jnax. Scanning II at this time
CI! qth) is 9 (the end point of line y1).Also, when parts overlap and the length L decreases and then suddenly increases, it is the time when the next part changes. be.

従って、 イ)始点から終点までの走査線の本数から部品13の最
大中を演算することができる。
Therefore, a) the maximum inside of the component 13 can be calculated from the number of scanning lines from the starting point to the ending point.

口)最短の暗部長から、境界面2に含まれ部品13の最
大高さを演算することができる。
Ex) The maximum height of the part 13 included in the boundary surface 2 can be calculated from the shortest dark part.

ハ)部品13が水平頂部を持つ場合は、この水平頂部を
走査する走査線の暗部長社同じであるから、これらの走
査線のうち最初の走査線及び最后O走査線が夫々水平頂
部の始点及び終点であ)、この始点から終点までの走査
線の本数から部品13の水平頂部の長さを演算すること
ができる。勿論、所定本数の走査線に亘って暗部長が変
化しない場合に、これを水平頂部とし【特徴づけてもよ
く、このようにすれば、数値処理が容易である。
c) When the component 13 has a horizontal top, the dark lines of the scanning lines that scan this horizontal top are the same, so the first scanning line and the last O scanning line among these scanning lines are the starting points of the horizontal top, respectively. and the end point), and the length of the horizontal top of the part 13 can be calculated from the number of scanning lines from the start point to the end point. Of course, if the dark area does not change over a predetermined number of scanning lines, this may be characterized as a horizontal apex, and numerical processing will be easier if this is done.

二)水平頂部の始点と終点との間の中央を中心座標−と
する。
2) Set the center between the starting point and the ending point of the horizontal peak as the center coordinate -.

2)  X軸方向の特定データ Y軸方向特定データの中心座標Ymにおける高嘔をプロ
ットして得られるX軸方向シんかく線について社、 イ)最大厚さ Y軸方向特定データ抽出点ム、Xl、Xt、・・・・・
・)の数と抽出間隔(所定移動間隔)から演算する。
2) About the X-axis direction synchronization line obtained by plotting the height at the center coordinate Ym of the specific data in the X-axis direction and the specific data in the Y-axis direction, a) Maximum thickness Y-axis direction specific data extraction point m, Xl, Xt,...
・) and the extraction interval (predetermined movement interval).

口)水平頂部長さ ゛ 相隣るY軸方向特にデータ抽出点の中心座標Ymにおけ
る高さが一定であるY軸方向特定データ抽出点の数に基
いて算出する。
Ex) Horizontal top length: Calculated based on the number of Y-axis specific data extraction points whose height is constant in the adjacent Y-axis direction, particularly at the center coordinate Ym of the data extraction points.

ハ)中心座標珈 水平頂部の始点と終点を与えるY軸方向特定データ抽出
点の座標から、画点の中心の座標として演算する。
c) Center coordinates - Calculate the coordinates of the center of the pixel from the coordinates of the Y-axis direction specific data extraction point that gives the starting point and ending point of the horizontal apex.

次に、テレビカメラ3の制御回路から送出されるビデオ
信号の処理方法の1例を第4図について説明する。同図
において、5は2値化回路であって、テレビカメラ30
制御回路4からビデオ信号41を受けて、黒レベルと自
レベルに2値されたビデオ信号を走査線暗部長測長回路
@に送出する。
Next, an example of a method for processing a video signal sent from the control circuit of the television camera 3 will be described with reference to FIG. In the figure, 5 is a binarization circuit, and the television camera 30
It receives the video signal 41 from the control circuit 4, and sends the video signal binarized into the black level and its own level to the scanning line dark length measuring circuit @.

2値化の為のしきい値は、画lim@0暗部よ抄わずか
に明るくなったレベルに設定する。走査線暗部長測長回
路6は、2値化されたビデオ信号41mが黒レベルから
白レベルに変化する明度変化点でセットされ、水平同期
信号42のパル1スの終〉でリセットされるフリップ・
フロップ6aとこの7リツプ・フロップ6aの出力によ
り附勢されるカウンタ6bを有し、2値化ビデオ信号4
1 、aが黒レベルである間だけ、発振器1からのクロ
ックパルスを計数する。従って、走査線暗部長測長回路
6では、走査線の暗部長が計数され、その計数データ6
1がインターフェース$を通して電子計算機(以下、コ
ンピュータという、)sに入力される。インターフェー
ス魯では、水平同期信号42のパルスの始抄と垂直同期
信号43で夫々割込信号421.4$1を作る。コンピ
ュータS紘、割込信号421により計数デー−61を読
込で前記した形状データと位置データを算出してこれを
予め書込まれた基準の形状データと位置データと照合し
、不一致の度合が、部品の種類によって予め定メラれコ
ンピューターに記憶された許容限界値を超えている場合
には、その照合結果をテレビモニタ等の表示装置10に
送出し、又警報信号を発する。
The threshold value for binarization is set to a level that makes the dark part of the image slightly brighter than the dark part of the image lim@0. The scanning line dark length measuring circuit 6 is a flip circuit that is set at the brightness change point where the binarized video signal 41m changes from black level to white level, and reset at the end of one pulse of the horizontal synchronizing signal 42.・
It has a flop 6a and a counter 6b energized by the output of the 7-lip flop 6a, and receives the binary video signal 4.
1. Count clock pulses from oscillator 1 only while a is at black level. Therefore, the scanning line dark length measuring circuit 6 counts the dark length of the scanning line, and the counting data 6
1 is input to an electronic computer (hereinafter referred to as a computer) s through an interface $. In the interface, an interrupt signal 421.4$1 is generated by the beginning of the pulse of the horizontal synchronizing signal 42 and the vertical synchronizing signal 43, respectively. The computer S Hiro reads the count data 61 using the interrupt signal 421, calculates the shape data and position data described above, compares them with the reference shape data and position data written in advance, and determines the degree of discrepancy. If the deviation exceeds a permissible limit value predetermined depending on the type of component and stored in the computer, the comparison result is sent to a display device 10 such as a television monitor, and an alarm signal is issued.

前記説明で社、6個の特徴に基いて部品13の形状と位
置を特定して照合する場合について説明したが、さらに
照合精度を高めたい場合には、データの数を増やせばよ
く、以下に、部品を特徴づけるのに極めて有効である水
平頂部の形状をさらに詳細に記述して新たに形状データ
に取入れる場合について説明する。1ILs図0)及び
←)社、ある部品の上面図と側面図で、実線矢印方向は
移動方向、鎖線矢印方向は走査線の垂直振巾方向を示し
ている。又、Fは部品の底部のりんかく線、Gは水平頂
部のシんかく線、Gs 、Gyは水平頂部の始点及び終
点における中心座標、Gmは部品の中央部である。この
りんかく線Gは、部品の移動距離に対する垂直振巾方向
の長さの変化率が所定値になつた点GB 、Ga 、G
m 、amを新たに特徴点として抽出し、点G@、01
間の長さ、点GいG−間の長さ、点G、 、G、の長さ
、点G@ s G1間及び点Gl 、c。
In the above explanation, we have explained the case where the shape and position of the part 13 are identified and matched based on six features, but if you want to further improve the matching accuracy, you can increase the number of data, and the following is explained below. , a case will be described in which the shape of the horizontal top, which is extremely effective in characterizing a part, is described in more detail and newly incorporated into the shape data. 1ILs Figures 0) and ←) are a top view and a side view of a certain part, in which the direction of the solid arrow indicates the direction of movement, and the direction of the dashed line arrow indicates the vertical oscillation direction of the scanning line. Further, F is a link line at the bottom of the part, G is a sink line at the horizontal top, Gs and Gy are center coordinates at the starting and ending points of the horizontal top, and Gm is the center of the part. This link line G is the point GB, Ga, G where the rate of change in length in the vertical width direction with respect to the moving distance of the component reaches a predetermined value.
m and am are newly extracted as feature points, and the point G@,01
The length between the points G and G, the length between the points G, , G, between the points G@s and G1 and between the points Gl and c.

間の長さ等を求めるととによシ、前記説明の場合に比し
、更に詳細に特定することができる0点Gi 、Gs 
u上記変化率が1になった点である。
When calculating the length between points, etc., the 0 points Gi and Gs can be specified in more detail than in the case of the above explanation.
u This is the point where the above rate of change becomes 1.

なお、前記実施例では、プリント基板1を定速移動させ
たが、プリント基板1を固定し、投光器2とテレビカメ
ラ3を一体にして移動させるようにしてもよい。
In the above embodiment, the printed circuit board 1 is moved at a constant speed, but the printed circuit board 1 may be fixed and the projector 2 and the television camera 3 may be moved together.

以上の如く、この発明によれに、プリント基板面上に投
光器により明暗境界線を炸9、この明暗境界線を通過す
るプリント基板上の部品を斜め上方からビデオカメラで
撮影する為、明暗境界線を含む面で部品巾方向に裁断し
た載断面の外形の特徴が、走査線の明度変災点を連結し
て得られるシんか〈線上に直接に現われるので、とのり
んか〈−を特徴とする特定データだけで上記外形の特徴
を表わすことができ、この特定データは、)んかく線が
2次元である為、部品を走査する走査#A。
As described above, according to the present invention, a light-dark boundary line is projected onto the surface of a printed circuit board using a projector, and parts on the printed circuit board that pass through this bright-dark boundary line are photographed from diagonally above by a video camera. The feature of the external shape of the mounting cross-section cut in the width direction of the part on a surface containing The characteristics of the above-mentioned external shape can be expressed only with specific data, and this specific data is used for scanning #A to scan the part because the intersection line is two-dimensional.

本数や暗部長に基いて簡単に演算することができ、又、
上記シんかく線の対応点を順次連結して得られるりんか
く線の特徴も、部品の厚さ方向裁断面外形の特徴を直接
に表わすから、このりんかく線を特徴とする特定データ
の演算も簡単に行うことができるので、低級なコンピュ
ータを用いて充分速やかに、部品011類と取付位置の
正誤を判定させることができる。
It can be easily calculated based on the number of lines and dark part, and
The features of the link lines obtained by sequentially connecting the corresponding points of the above-mentioned link lines also directly represent the features of the outer shape of the cutting surface in the thickness direction of the part, so calculation of specific data featuring this link line is performed. Since this can be easily performed, it is possible to determine whether the parts 011 class and the mounting position are correct or incorrect quickly enough using a low-grade computer.

又、部品の厚さ方向所定間かく毎に巾方向2次元外形の
特徴を抽出すると共に、厚さ方向2次元外形の特徴を抽
出するから、部品の種類を識別する為に有効な特徴の抽
出、取付位置の特定が容易であり、小数の特徴点を利用
してプリント基板上の部品の種類の正誤、取付位置のず
れの有無等を正確に判定させることができる。
In addition, since the features of the two-dimensional external shape in the width direction are extracted at every predetermined interval in the thickness direction of the part, and the features of the two-dimensional external shape in the thickness direction are also extracted, features that are effective for identifying the type of part can be extracted. It is easy to specify the mounting position, and it is possible to accurately determine whether the type of component on the printed circuit board is correct, whether the mounting position is misaligned, etc. using a small number of feature points.

【図面の簡単な説明】[Brief explanation of the drawing]

fllLx図社、この発明による実装プリント基板の自
動検査方法の実施例の光学系を示す配置図、第2図及び
第3図社、上記実施例の作用を説明する為の図、菖4図
社、上記実施例の制御系のブロック図、第5図ピ)及び
(ロ)は、上記実施例の他の作用を説明する−の図であ
る。 図において、 1・・・プリント基板、 2・・・投光器、 3・・・テレビカメラ、 4・・・制御回路、 5・−2値化回路、 6・・・走査線暗部長II長回路、 1・・・発振器、 8−・インターフェース、 9…コンピユータ、 10・・・表示装置 な−1図中、同一符号は同−又は相当部分を示す。
fllLx Zusha, Layout diagram showing the optical system of an embodiment of the automatic inspection method for a mounted printed circuit board according to the present invention, Figures 2 and 3, Sha, Diagram for explaining the operation of the above embodiment, Iris Zusha , a block diagram of the control system of the embodiment described above, and FIGS. In the figure, 1... Printed circuit board, 2... Floodlight, 3... Television camera, 4... Control circuit, 5... -binarization circuit, 6... Scanning line dark section II length circuit, DESCRIPTION OF SYMBOLS 1... Oscillator, 8--Interface, 9... Computer, 10... Display device, etc.-1 In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] 部品実装後の定速搬送されるプリント基板面に正対し該
プリント基板面上を上記搬送方向と直角向きの明暗境界
線で遮光部と照射部に区画する投光器、上記プリント基
板面と所定鉛直角度から上記明暗境界線を含む上記値光
域と照射域を上記明暗境界線に対して直交する方向に走
査するテレビカメラ、ビデオ信号の走査線の暗部長を測
定する走査線暗部長渕定回路及びこの調定回路の出力を
読込むコンピュータを具え、該コンピュータにより、上
記走査線の暗部長に基いて、上記走査線の明度変化点が
作るY軸方向シんかく線の2次元形状を特定する為のT
軸方向特定データを上記プリント基板の所定移動距離毎
に演算せしめると共に上記舎Y軸方向善定データの対応
点をX軸方向に連結して得られるX軸方向りんかく線0
2次元形状を特定する為のX軸方向特定データを、上記
T軸方向特定データに基いて演算させ、更に、上記両特
定データを組合せて得られる3次元包路線を特定する為
の形状データと位置データを、上記両特定データに基い
て演算せしめ、この形状データと位置データを、予め上
記コンピュータに記憶された上記部品についての基準形
状データ及び基準位置データと夫々照合させることを特
徴とする実装プリント基板の検査方法。
a projector that directly faces the surface of a printed circuit board that is transported at a constant speed after mounting the components and divides the surface of the printed circuit board into a light-shielding part and an irradiation part by a bright and dark boundary line perpendicular to the transport direction, and a predetermined vertical angle with the surface of the printed circuit board; A television camera that scans the light area and the irradiation area including the bright/dark boundary line in a direction orthogonal to the bright/dark boundary line, a scanning line dark area edge determining circuit that measures the dark area of a scanning line of a video signal, and A computer is provided to read the output of the adjustment circuit, and the computer specifies, based on the dark part of the scanning line, the two-dimensional shape of the Y-axis direction synchronization line created by the brightness change points of the scanning line. T of
The X-axis direction link line 0 is obtained by calculating the axial direction specific data for each predetermined movement distance of the printed circuit board and connecting the corresponding points of the Y-axis direction determination data in the X-axis direction.
X-axis direction specifying data for specifying the two-dimensional shape is calculated based on the T-axis direction specifying data, and shape data for specifying the three-dimensional envelope obtained by combining both of the above specifying data. An implementation characterized in that position data is calculated based on both of the specific data, and the shape data and position data are compared with reference shape data and reference position data for the component stored in advance in the computer, respectively. How to inspect printed circuit boards.
JP13896181A 1981-09-02 1981-09-02 Inspection method of packaging printed circuit substrate Pending JPS5839933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13896181A JPS5839933A (en) 1981-09-02 1981-09-02 Inspection method of packaging printed circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13896181A JPS5839933A (en) 1981-09-02 1981-09-02 Inspection method of packaging printed circuit substrate

Publications (1)

Publication Number Publication Date
JPS5839933A true JPS5839933A (en) 1983-03-08

Family

ID=15234215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13896181A Pending JPS5839933A (en) 1981-09-02 1981-09-02 Inspection method of packaging printed circuit substrate

Country Status (1)

Country Link
JP (1) JPS5839933A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239040A (en) * 1986-04-11 1987-10-19 Tokyo Electron Ltd Inspection system for fitting state of electronic component
CN112903632A (en) * 2021-01-22 2021-06-04 中国科学院上海光学精密机械研究所 Method for improving measurement accuracy of nonlinear optical coefficient of thin-film material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239040A (en) * 1986-04-11 1987-10-19 Tokyo Electron Ltd Inspection system for fitting state of electronic component
CN112903632A (en) * 2021-01-22 2021-06-04 中国科学院上海光学精密机械研究所 Method for improving measurement accuracy of nonlinear optical coefficient of thin-film material
CN112903632B (en) * 2021-01-22 2021-10-08 中国科学院上海光学精密机械研究所 Method for improving measurement accuracy of nonlinear optical coefficient of thin-film material

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