JPS5834170A - Concentrated copper solution for electroless copper plating solution vat - Google Patents

Concentrated copper solution for electroless copper plating solution vat

Info

Publication number
JPS5834170A
JPS5834170A JP13137981A JP13137981A JPS5834170A JP S5834170 A JPS5834170 A JP S5834170A JP 13137981 A JP13137981 A JP 13137981A JP 13137981 A JP13137981 A JP 13137981A JP S5834170 A JPS5834170 A JP S5834170A
Authority
JP
Japan
Prior art keywords
copper
soln
concd
solution
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13137981A
Other languages
Japanese (ja)
Other versions
JPH039190B2 (en
Inventor
Satoshi Akazawa
赤沢 諭
Koji Kamiyama
上山 宏治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP13137981A priority Critical patent/JPS5834170A/en
Publication of JPS5834170A publication Critical patent/JPS5834170A/en
Publication of JPH039190B2 publication Critical patent/JPH039190B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE:To provide a concd. copper soln. for electroless copper plating soln. vats which prevents freezing and crystallization of cupric salt by adding chlorine ion and bromine ion supplying sources to the concd. copper soln. consisting essentially of cupric salt. CONSTITUTION:A concd. copper soln. for electroless copper plating soln. vats preped. by adding about 2-70g/l supplying sources for chlorine ions and bromine ions such as hydrochloric acid, sodium chloride, copper chloride (II), hydrogen bromide, sodium bromide, or the like to a concd. copper soln. consisting essentially of cupric salt such as copper sulfate. Crystal deposition and freezing of copper sulfate, etc. can be suppressed by the compsn. of such concd. copper soln. The properties as an electroless copper plating soln. such as the rate of deposition, stability, adhesive power or the like are equal to or better than those of solns. without added with any halogen ions.

Description

【発明の詳細な説明】 本発明は1無電解銅めっき液1cm建浴する際に使用さ
t′する@濃縮液に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a concentrated solution used when preparing a 1 cm electroless copper plating solution.

無電解鋼めっき液は主成分として硫酸銅などV第二銅塩
、ロッシェル@To心いはEDTA(エチレンジアミン
テトラアセテックア7ド)などの錯化剤、ホルマリンな
どの還元剤、および水酸化アルカリυPH調整剤等から
成っているか。
The main components of electroless steel plating solution are cupric salts such as copper sulfate, complexing agents such as EDTA (ethylene diamine tetraacetate), reducing agents such as formalin, and alkali hydroxide. Does it consist of υPH adjuster, etc.?

一般的に建浴に際して#:t#!二銅塩やホルマリンを
主体とした濃縮液および水酸化アルカ9に主体とし7t
#Ik縮液り両者を混曾し、5〜20倍に純水で薄めて
いる・そn、はホルマリンと水酸化アルカリを一緒にす
ると除々にホルマリンか分解する。又、第二銅塩と水酸
化アルカvytt−緒にすると水酸化鋼の沈澱が生ずる
からである。
In general, when preparing a bath #:t#! Concentrated liquid mainly composed of dicopper salts and formalin, and 7 tons mainly composed of alkali hydroxide 9
#Ik Condensation: Mix both and dilute 5 to 20 times with pure water. When formalin and alkali hydroxide are combined, the formalin gradually decomposes. Further, when a cupric salt and an alkali hydroxide are combined, precipitation of hydroxide steel occurs.

cfJcoa酸第二鋼等の第二銅塩を主体としt銅濃縮
液は銅濃度が高いので冬期などの低tptL(−10℃
以下)でO保管時においては凍W1硫11I!第二鋼等
の第二銅塩の結晶が析出しやすい問題点かToる・ イオン供給源1−添加し凍結並びに第二銅塩の結晶化を
防止するものである。
The t-copper concentrate, which is mainly made of cupric salts such as cfJcoa acid ferric steel, has a high copper concentration, so it can be used at low tptL (-10℃) such as in winter.
(below) when storing in O, freeze W1 sulfur 11I! The problem is that crystals of cupric salts such as second steel tend to precipitate.Ion supply source 1-Ion is added to prevent freezing and crystallization of cupric salts.

すなわち本発明は、1s二鋼塩を生体とした銅濃縮液に
、塩素、臭素イオン供給源を添加しに無電解鋼めっき液
媒浴用の銅濃縮液でらる・第二鋼#111:生体とした
銅濃縮液としては例えは硫酸鋼50〜200 g/4、
ホルマリン(37%) 50〜S 00 mj/j の
溶液か使用さj、る。
That is, the present invention produces a copper concentrate for use in an electroless steel plating liquid bath by adding a chlorine and bromine ion source to a copper concentrate containing 1s 2 steel salt as a living body. For example, sulfuric acid steel 50 to 200 g/4 is used as a copper concentrate.
Formalin (37%) A solution of 50 to S 00 mj/j is used.

こり場合、ホルマリンは必ずしも加える必要はな−・ 本弛明で使用される塩素、臭素イオン供給源としては、
塩素、臭素 、ナトリウム、カリウム、第二銅塩、又は
、塩化水素、臭化水素か好1しく、水に対し常温で2g
71以上の溶解度tもつものか使用さn、る。例として
は塩酸、塩化ナトリウム、塩化カリウム、塩化鋼(II
)臭化水素、臭化ナトリウムおよび臭化鋼かめけらn。
In this case, it is not necessary to add formalin.The sources of chlorine and bromide ions used in this process are:
Preferably chlorine, bromine, sodium, potassium, cupric salt, or hydrogen chloride or hydrogen bromide, 2g per water at room temperature
Those having a solubility t of 71 or more are used. Examples include hydrochloric acid, sodium chloride, potassium chloride, steel chloride (II
) hydrogen bromide, sodium bromide and bromide steel shell n.

る・塩累臭系イオン供m源V飽加菫は、2〜70g/j
か好ましい。
・Salt odor type ion supply m source V saturated violet is 2 to 70 g/j
Or preferable.

硫112輌   50〜200 g/I  およびホル
マリン 50〜300 mJ/j  tlJ溶gに塩化
ナトリウム等のハロゲンイオン供給rjlを2〜70 
g/J添加した楊曾、儲暖銅の結晶析出や凍結か著しく
抑制できs svLm銅めりき液としての特性(析出速
*s安定性、密層力)は塩化ナトリウム等のハロゲンイ
オン供給源を添加しないものと退色かなか−) 7t 
112 sulfur tanks 50-200 g/I and formalin 50-300 mJ/j 2-70 rjl supplying halogen ions such as sodium chloride to tlJ solution
By adding g/J, the crystal precipitation and freezing of Yang Tseng and Chuan copper can be significantly suppressed.The characteristics of svLm copper plating solution (precipitation speed *s stability, compact layer strength) are based on halogen ion sources such as sodium chloride. 7t
.

央71?I 硫酸鋼150 g / j sおよびホルマリン(57
%) 200 mA/j 1/Jlla液に塩化ナトリ
ウム20 g/4添加し几場せqJlifi晶析出およ
び凍結状態を保存11Jt’に変えて観察した・そり結
果表1(/lJjうになりた。
Central 71? I sulfuric acid steel 150 g/j s and formalin (57
%) 200 mA/j 1/Jlla 20 g/4 of sodium chloride was added to the solution, crystallization occurred, and the frozen state was changed to 11 Jt' for observation.

表1 硫酸鋼とホルマリンからなる濃縮液の保存安定性
こn、によシ塩化ナトリウムー’j20g/j添加し友
楊せは一15℃で1ケ月間&管しても硫酸鋼の結晶析出
や凍結はおこらなかった・
Table 1 Storage stability of a concentrated solution consisting of sulfuric acid steel and formalin. Freezing did not occur.

Claims (1)

【特許請求の範囲】[Claims] 1、第二銅塩を主体とした銅濃縮液に、塩素イオン、臭
素イオン供給源を添加し7を無電解鋼めっき液嬉浴用V
銅S縮液。
1. Add chlorine ion and bromine ion sources to a copper concentrate containing cupric salt as the main ingredient, and make 7 an electroless steel plating solution V for pleasure bathing.
Copper S condensate.
JP13137981A 1981-08-20 1981-08-20 Concentrated copper solution for electroless copper plating solution vat Granted JPS5834170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13137981A JPS5834170A (en) 1981-08-20 1981-08-20 Concentrated copper solution for electroless copper plating solution vat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13137981A JPS5834170A (en) 1981-08-20 1981-08-20 Concentrated copper solution for electroless copper plating solution vat

Publications (2)

Publication Number Publication Date
JPS5834170A true JPS5834170A (en) 1983-02-28
JPH039190B2 JPH039190B2 (en) 1991-02-07

Family

ID=15056565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13137981A Granted JPS5834170A (en) 1981-08-20 1981-08-20 Concentrated copper solution for electroless copper plating solution vat

Country Status (1)

Country Link
JP (1) JPS5834170A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371426A (en) * 1990-11-20 1994-12-06 Seiko Epson Corporation Rotor of brushless motor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371426A (en) * 1990-11-20 1994-12-06 Seiko Epson Corporation Rotor of brushless motor

Also Published As

Publication number Publication date
JPH039190B2 (en) 1991-02-07

Similar Documents

Publication Publication Date Title
GB771943A (en) Compositions for inhibiting corrosion of both cuprous and ferrous metals by aqueous solutions
US1921941A (en) Electrodeposition of palladium
GB1160314A (en) Acidified Hydrogen Peroxide Solutions for Dissolving Metals
US3303029A (en) Tin coating of copper surfaces by replacement plating
GB493365A (en) Improvements in or relating to the coating of surfaces of zinc or zinc alloys
JPS5834170A (en) Concentrated copper solution for electroless copper plating solution vat
GB367588A (en) Improvements in or relating to the electrodeposition of the metals of the platinum group
US4107004A (en) Trivalent chromium electroplating baths and method
US2012462A (en) Stabilization of peroxide solutions
NO135188B (en)
JPS5887291A (en) Chromium electroplating bath
GB673058A (en) Regeneration of exhausted photographic silver bleaching solutions
GB1234226A (en)
US2391258A (en) Treatment of water containing chlorides and sodium dissolved therein
GB831929A (en) Improvements in or relating to copper plating
US2528601A (en) Copper-tin alloy plating
FI62347C (en) GALVANISERINGSBAD
GB413342A (en) Improvements in and relating to the coating of articles with rhodium
JP2004523661A (en) Corrosion inhibitors for pool or bath water containing sodium chloride and magnesium sulfate
JPS6296692A (en) Nickel-boron alloy plating method
US1279524A (en) Process of liberating a gaseous disinfectant.
US1491313A (en) Compound for making photographic toning baths
JPH0474870A (en) Electroless copper plating solution
JPH0510398B2 (en)
GB438228A (en) A new or improved process for the plating of aluminium