JPS5834170A - Concentrated copper solution for electroless copper plating solution vat - Google Patents
Concentrated copper solution for electroless copper plating solution vatInfo
- Publication number
- JPS5834170A JPS5834170A JP13137981A JP13137981A JPS5834170A JP S5834170 A JPS5834170 A JP S5834170A JP 13137981 A JP13137981 A JP 13137981A JP 13137981 A JP13137981 A JP 13137981A JP S5834170 A JPS5834170 A JP S5834170A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- soln
- concd
- solution
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は1無電解銅めっき液1cm建浴する際に使用さ
t′する@濃縮液に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a concentrated solution used when preparing a 1 cm electroless copper plating solution.
無電解鋼めっき液は主成分として硫酸銅などV第二銅塩
、ロッシェル@To心いはEDTA(エチレンジアミン
テトラアセテックア7ド)などの錯化剤、ホルマリンな
どの還元剤、および水酸化アルカリυPH調整剤等から
成っているか。The main components of electroless steel plating solution are cupric salts such as copper sulfate, complexing agents such as EDTA (ethylene diamine tetraacetate), reducing agents such as formalin, and alkali hydroxide. Does it consist of υPH adjuster, etc.?
一般的に建浴に際して#:t#!二銅塩やホルマリンを
主体とした濃縮液および水酸化アルカ9に主体とし7t
#Ik縮液り両者を混曾し、5〜20倍に純水で薄めて
いる・そn、はホルマリンと水酸化アルカリを一緒にす
ると除々にホルマリンか分解する。又、第二銅塩と水酸
化アルカvytt−緒にすると水酸化鋼の沈澱が生ずる
からである。In general, when preparing a bath #:t#! Concentrated liquid mainly composed of dicopper salts and formalin, and 7 tons mainly composed of alkali hydroxide 9
#Ik Condensation: Mix both and dilute 5 to 20 times with pure water. When formalin and alkali hydroxide are combined, the formalin gradually decomposes. Further, when a cupric salt and an alkali hydroxide are combined, precipitation of hydroxide steel occurs.
cfJcoa酸第二鋼等の第二銅塩を主体としt銅濃縮
液は銅濃度が高いので冬期などの低tptL(−10℃
以下)でO保管時においては凍W1硫11I!第二鋼等
の第二銅塩の結晶が析出しやすい問題点かToる・
イオン供給源1−添加し凍結並びに第二銅塩の結晶化を
防止するものである。The t-copper concentrate, which is mainly made of cupric salts such as cfJcoa acid ferric steel, has a high copper concentration, so it can be used at low tptL (-10℃) such as in winter.
(below) when storing in O, freeze W1 sulfur 11I! The problem is that crystals of cupric salts such as second steel tend to precipitate.Ion supply source 1-Ion is added to prevent freezing and crystallization of cupric salts.
すなわち本発明は、1s二鋼塩を生体とした銅濃縮液に
、塩素、臭素イオン供給源を添加しに無電解鋼めっき液
媒浴用の銅濃縮液でらる・第二鋼#111:生体とした
銅濃縮液としては例えは硫酸鋼50〜200 g/4、
ホルマリン(37%) 50〜S 00 mj/j の
溶液か使用さj、る。That is, the present invention produces a copper concentrate for use in an electroless steel plating liquid bath by adding a chlorine and bromine ion source to a copper concentrate containing 1s 2 steel salt as a living body. For example, sulfuric acid steel 50 to 200 g/4 is used as a copper concentrate.
Formalin (37%) A solution of 50 to S 00 mj/j is used.
こり場合、ホルマリンは必ずしも加える必要はな−・
本弛明で使用される塩素、臭素イオン供給源としては、
塩素、臭素 、ナトリウム、カリウム、第二銅塩、又は
、塩化水素、臭化水素か好1しく、水に対し常温で2g
71以上の溶解度tもつものか使用さn、る。例として
は塩酸、塩化ナトリウム、塩化カリウム、塩化鋼(II
)臭化水素、臭化ナトリウムおよび臭化鋼かめけらn。In this case, it is not necessary to add formalin.The sources of chlorine and bromide ions used in this process are:
Preferably chlorine, bromine, sodium, potassium, cupric salt, or hydrogen chloride or hydrogen bromide, 2g per water at room temperature
Those having a solubility t of 71 or more are used. Examples include hydrochloric acid, sodium chloride, potassium chloride, steel chloride (II
) hydrogen bromide, sodium bromide and bromide steel shell n.
る・塩累臭系イオン供m源V飽加菫は、2〜70g/j
か好ましい。・Salt odor type ion supply m source V saturated violet is 2 to 70 g/j
Or preferable.
硫112輌 50〜200 g/I およびホル
マリン 50〜300 mJ/j tlJ溶gに塩化
ナトリウム等のハロゲンイオン供給rjlを2〜70
g/J添加した楊曾、儲暖銅の結晶析出や凍結か著しく
抑制できs svLm銅めりき液としての特性(析出速
*s安定性、密層力)は塩化ナトリウム等のハロゲンイ
オン供給源を添加しないものと退色かなか−) 7t
。112 sulfur tanks 50-200 g/I and formalin 50-300 mJ/j 2-70 rjl supplying halogen ions such as sodium chloride to tlJ solution
By adding g/J, the crystal precipitation and freezing of Yang Tseng and Chuan copper can be significantly suppressed.The characteristics of svLm copper plating solution (precipitation speed *s stability, compact layer strength) are based on halogen ion sources such as sodium chloride. 7t
.
央71?I
硫酸鋼150 g / j sおよびホルマリン(57
%) 200 mA/j 1/Jlla液に塩化ナトリ
ウム20 g/4添加し几場せqJlifi晶析出およ
び凍結状態を保存11Jt’に変えて観察した・そり結
果表1(/lJjうになりた。Central 71? I sulfuric acid steel 150 g/j s and formalin (57
%) 200 mA/j 1/Jlla 20 g/4 of sodium chloride was added to the solution, crystallization occurred, and the frozen state was changed to 11 Jt' for observation.
表1 硫酸鋼とホルマリンからなる濃縮液の保存安定性
こn、によシ塩化ナトリウムー’j20g/j添加し友
楊せは一15℃で1ケ月間&管しても硫酸鋼の結晶析出
や凍結はおこらなかった・Table 1 Storage stability of a concentrated solution consisting of sulfuric acid steel and formalin. Freezing did not occur.
Claims (1)
素イオン供給源を添加し7を無電解鋼めっき液嬉浴用V
銅S縮液。1. Add chlorine ion and bromine ion sources to a copper concentrate containing cupric salt as the main ingredient, and make 7 an electroless steel plating solution V for pleasure bathing.
Copper S condensate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13137981A JPS5834170A (en) | 1981-08-20 | 1981-08-20 | Concentrated copper solution for electroless copper plating solution vat |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13137981A JPS5834170A (en) | 1981-08-20 | 1981-08-20 | Concentrated copper solution for electroless copper plating solution vat |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5834170A true JPS5834170A (en) | 1983-02-28 |
JPH039190B2 JPH039190B2 (en) | 1991-02-07 |
Family
ID=15056565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13137981A Granted JPS5834170A (en) | 1981-08-20 | 1981-08-20 | Concentrated copper solution for electroless copper plating solution vat |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5834170A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5371426A (en) * | 1990-11-20 | 1994-12-06 | Seiko Epson Corporation | Rotor of brushless motor |
-
1981
- 1981-08-20 JP JP13137981A patent/JPS5834170A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5371426A (en) * | 1990-11-20 | 1994-12-06 | Seiko Epson Corporation | Rotor of brushless motor |
Also Published As
Publication number | Publication date |
---|---|
JPH039190B2 (en) | 1991-02-07 |
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