JPS5833820A - Chip electrolytic condenser - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a chip-type electrolytic capacitor having a structure that can withstand Ushida immersion and long-term high-temperature use conditions.

Currently, due to trends such as miniaturization of electrical components and automation of mounting on printed wiring boards, chip components with lead wires removed from electrical components are being produced, and this is also progressing in the field of electrolytic capacitors.

Conventionally, as shown in FIG.
1) incorporates at least a capacitor element into an aluminum case (2), seals it with a rubber sealing body (4), and uses the aluminum case itself as the first electrode.

For example, the first metal terminal plate (6
) and also connect the lead wire (6) through the rubber sealing member).
) with the second metal terminal plate (7) on the second electrode 9, e.g. the anode.
, and then attach the rubber sealing body 0 and the metal terminal plate of jll (
1) and were fixed with insulating resin φ).

Conventional chip-type electrolytic containers like this one.

As shown in Table 2 below, the temperature is 260 ('C, 10
When immersed in solder for 10 seconds, the rubber sealing body is stretched by J1, and the capacitance [μF] and loss (D, F) of the electrolytic capacitor are reduced.
) The change in leakage current [-mu] is large compared to before soldering immersion.
It turned out to be unsuitable for A use.

In view of these problems, the present invention provides a modified chip-type electrolytic capacitor in which a heat-resistant resin layer is further provided on the aluminum case.

The present invention will be described in detail below based on FIGS. 2 to 14.

In the second gl, the chip-type electrolytic capacitor (1) according to the present invention incorporates at least an element (<8) in an aluminum case (2), and seals it with a rubber sealing body (4). Jll electrode 9
For example, configure this aluminum case as a cathode)
Attach the L-shaped terminal plate (with straight stripes 1) to the

Further, a second L-shaped terminal plate (7) is fixed to the second electrode 2, for example, the anode, of the nine leads 11 (2) via the rubber sealing body (4).

Further, both the first and 1s20 terminal plates (6), the aluminum case t2) at the end of (1), and the rubber sealing body (4) are entirely covered with a resin body of 11k4&.

#! As shown in Figure 3, another embodiment of the present invention is a chip-type electrolytic capacitor (1) ti, rubber sealing body [)
The first and second lead wires ((roll) and (9) are pulled out from the iris, and the lead wire (9) of the irises 2 is fixed to the aluminum case), and the chip shown in Fig. 2 of the other side is It is similar to type electrolytic fundensor (1).

In the chip type electrolytic capacitor (1) according to the present invention,
The inner shapes of the first and second L-shaped terminal plates (5) and (7) may be square as shown in the figure, or may have other shapes such as a hexagonal half-shape. Further, in order to automate the polarity determination of the chip-type electrolytic capacitor (1), the first L-shaped terminal plate (~ is made of a non-magnetic material such as brass material).

Further, it is preferable that the second L-shaped terminal plate (7) is made of an OWi material such as iron. ! As the l-related tree M(8),
The thermosetting side of epoxy resin tr or phenolic resin, t'II- is modified epoxy resin or phenol resin.
Preferred are ultraviolet curable resins such as odor resins, and thermosetting resins with high heat resistance such as polybutylene terephthalate and polyphenylene sulfide. Examples of the ballast OIk fabric method and molding method include the 9-rotation Is method and metal molding.

Incidentally, the aging of the capacitor is preferably carried out by applying a voltage in a heating furnace after the 9th side is cured.

Next, Tables 1 and 2 show the electrolytic capacitor rating 55 (V
)-58 (pF) of the present invention and the conventional example were immersed in a solder solution for 10 seconds at a temperature of 260 (°C).

The iris 1 table is according to the present invention, and the silver 2 table is according to the conventional example:
It is something that

Table 1・・・・・・・・・%0 according to the present invention − 1 “　　1 1 ′　4 ′　　　5 to “- [ and.

Rattan table 2・・・・・・・・・・Turtle 1 according to the conventional example
%O according to the present invention as seen from the 1K and JIg2 tables.
4 after solder immersion compared to the conventional example.
h11 amount (JaF) e loss CD,? ) @ II A stable chip-type electrolytic capacitor can be provided with little change in leakage current (μm). Also, the ambient temperature is 1ss [℃].

It can withstand even 2000 hours of Oik time value.

By the way, in Fig. 2E and Rattan 5, the 1C) L-shaped terminal (slight damage) was attached to the surface K11II of the piece of the aluminum case (!) or by adhesive means, but as shown in Fig. 4, For example, a cow-circular four part (10) is formed on the L-shaped terminal (10), and this concave S shape is fixed to the periphery of the noodle part of the aluminum case ψ). If you configure it like this.

(first L-shaped terminal plate body).

It is possible to make it smaller.

[Brief explanation of the drawing]

Figure 1 is a partially cutaway diagram showing a conventional example, and Figure 2 is a book! 191
Figure 1 is a partial cross-sectional view showing an embodiment of the present invention, Figure S is a partial cross-sectional view showing another embodiment of the present invention, and Figure 4 is a partial view showing another shape of the L-shaped terminal plate and its fixed state. In the pii3 diagram, (1) is a chip type electrolytic capacitor,
is the IM fat, and tIO) is the concave part. % Fraudulent Applicant Elna Co., Ltd.

Claims (1)

[Scope of Claims] (1) At least a condenser element is assembled in a full i-nicum case, sealed with a rubber sealing body, a L#F carved terminal board of 1 is attached to the aluminum case, and a # rubber sealing body is attached. Fix the No. 20X4 type terminal plate to the No. 9 first lead wire,
A chip type electrolytic capacitor made of an aluminum case coated with an insulating resin. 2) A chip-type electrolytic capacitor according to claim (1), in which a recess is formed in the first L-shaped terminal plate, and the recess is fixed to the periphery of a wrinkled aluminum case. (3) A chip type electrolytic capacitor according to claim (1) and Fiψ), in which a JII2 lead wire is fixed to the aluminum case via the rubber sealing member. (4) Claims (1), t2) and Kiki (3)
In this case, the resin is a thermosetting resin and is a good chip type electrolytic capacitor. (5) 41 Claims (1) and (2)
), a chip shadow electrolytic capacitor characterized in that the Mukuro resin is an ultraviolet curing resin.俤) A chip-type electrolytic capacitor according to claim (i), characterized in that the resin is a thermoplastic resin with high heat resistance. (7) Claim II(t) * In <t> or (3), either one of the L-shaped terminal plates is made of a non-magnetic material. A chip type electrolytic capacitor characterized in that the other L-shaped terminal plate is made of a magnetic material.