JPS62276816A - Chip electrolytic capacitor - Google Patents
Chip electrolytic capacitorInfo
- Publication number
- JPS62276816A JPS62276816A JP1293587A JP1293587A JPS62276816A JP S62276816 A JPS62276816 A JP S62276816A JP 1293587 A JP1293587 A JP 1293587A JP 1293587 A JP1293587 A JP 1293587A JP S62276816 A JPS62276816 A JP S62276816A
- Authority
- JP
- Japan
- Prior art keywords
- terminal plate
- metal cap
- cap terminal
- lead wire
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000007654 immersion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
［産業上の利用分野］
本発明は、半田浸Ｗ！および長時間の高温使用状態にも
耐え得るような構造のチップ形電解コンデンサに関する
ものである。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention is directed to solder immersion W! The present invention also relates to a chip-type electrolytic capacitor having a structure that can withstand long-term high-temperature use.
［従来の技術］
現在、電気部品の小型化およびプリント配線基板への実
装の自動化などの動向から、電気部品のリード線を除去
したチップ部品が開発され、電解コンデンサ分野にも進
展している。[Prior Art] Currently, due to trends such as miniaturization of electrical components and automation of mounting on printed wiring boards, chip components with lead wires removed from electrical components are being developed, and this is also progressing in the field of electrolytic capacitors.
従来、第２図に示すようにチップ形電解コンデンサ（１
）は、円筒状のアルミニウムケース（２）内に少なくと
もコンデンサ素子（３）を組込み、ゴム封［！体（４）
にて封口し、アルミニウムケース（２）自体を第１の電
極、例えば陰極として構成し、ここに第１の金属端子Ｊ
ｆｉ、＜ ５ ）を固着し、またゴム封口体（４）を介
したリード線（６）の７ｆｆ、２の電極、例えば；場→
に第２の金属端子板（７）を因６し、さらにゴム封口体
（４）と第２の金属端子Ｆｉ（７）とを絶縁性の樹脂（
８）にて固着していた。Conventionally, chip type electrolytic capacitors (1
) incorporates at least a capacitor element (3) inside a cylindrical aluminum case (2), and seals it with a rubber seal [! body (4)
The aluminum case (2) itself is configured as a first electrode, for example, a cathode, and a first metal terminal J is connected thereto.
fi, < 5), and also connect the lead wire (6) through the rubber sealing body (4) to the 7ff and 2 electrodes, for example;
A second metal terminal plate (7) is attached to the second metal terminal plate (7), and an insulating resin (
8) was stuck.
［発明が解決しようとする問題点］
このような従来のチップ形電解コンデンサは、後述の第
２表に示すように、温度２６０［”Ｃ］の溶融半田中に
１０秒間浸漬すると、ゴム封口体が膨張するなどして電
解コンデンサの容量［μＦ］、損失［％］、漏れ電流［
μＡ］の変化が半田浸漬前に比較して大幅なものとなっ
て、使用できないものであった。[Problems to be Solved by the Invention] As shown in Table 2 below, when such a conventional chip-type electrolytic capacitor is immersed in molten solder at a temperature of 260 ["C] for 10 seconds, the rubber sealing body breaks down. expands, etc., and the electrolytic capacitor's capacity [μF], loss [%], and leakage current [
μA] was significantly changed compared to before immersion in solder, making it unusable.
［問題点を解決するための手段］
本発明は、このような問題点に鑑み、アルミニウムケー
スの上にざらに耐熱性の樹脂層を設けた改良形のチップ
形電解コンデンサを提供するものである。[Means for Solving the Problems] In view of these problems, the present invention provides an improved chip type electrolytic capacitor in which a heat-resistant resin layer is provided on an aluminum case. .
［実施例］
以下、第１図にもとづいて本発明の一実施例を説明する
。[Example] Hereinafter, an example of the present invention will be described based on FIG.
第１図において、本発明に係るチップ形電解コンデンサ
（１０）は、円筒状のアルミニウムケース（２０）内に
少なくともコンデンサ素子（３０）を組込み、ゴム封口
体く４０）にて封口し、ゴム封口体（４０）から第１の
リード線（５０）および第２のリード線（６０）を引出
し、第１のリード線（５０）に椀状の′ｆ、１の金属キ
ャップ端子板（７０）を固着し、第２のリード線（６ｏ
）は第１のリード線（５０）に対して反対側に位置する
ように折返して椀状の第２の金属キャップ端子板（８０
）を固着し、両側に位置された第１の金属キャップ端子
板（７０）と第２の金属キャップ端子板（８０）との間
のアルミニウムケース（２０）およびゴム封口体（４０
）の全体を両端子板（７０）、（８０）の外表面を残し
て絶縁性の樹脂（９０）に°Ｃ被覆したものである。In FIG. 1, a chip type electrolytic capacitor (10) according to the present invention has at least a capacitor element (30) built into a cylindrical aluminum case (20), which is sealed with a rubber sealing body (40). The first lead wire (50) and the second lead wire (60) are pulled out from the body (40), and a bowl-shaped 'f and one metal cap terminal plate (70) are attached to the first lead wire (50). Fix it and connect the second lead wire (6o
) is folded back to be located on the opposite side to the first lead wire (50) and a bowl-shaped second metal cap terminal plate (80
) and the aluminum case (20) and rubber sealing body (40) between the first metal cap terminal plate (70) and the second metal cap terminal plate (80) located on both sides.
) is coated with an insulating resin (90) at °C, leaving the outer surfaces of both terminal plates (70) and (80) intact.
本発明に係るチップ形電解コンデンサ（１ｏ）において
、第１および第２の金属キャップ端子板（７０）、（８
０）の形状は図示のように丸部形、角筒形でも、さらに
他の形状でも良いつまた、チップ形′賓解コンデンサ（
１０）の極性判別の自動化のため、第１の金属キャップ
端子板（７０）を黄銅材などの非磁性体とし、第２の金
属キャップ端子板（８０）を鉄材などの磁性体とすると
好ましい。絶縁性樹脂（９０）としては、エポキシ樹脂
あるいはフェノール樹脂などの熱硬化性樹ｊ指、または
変形エポキシ樹脂あるいはフェノール樹脂ｒ（どの紫外
線硬化性樹脂である。樹脂（９０）の塗面法および成形
法としては、回転塗布法および金型成形法などがある。In the chip type electrolytic capacitor (1o) according to the present invention, the first and second metal cap terminal plates (70), (8
The shape of the capacitor (0) may be round or square as shown in the figure, or may be of any other shape.
In order to automate the polarity determination in step 10), it is preferable that the first metal cap terminal plate (70) is made of a non-magnetic material such as brass, and the second metal cap terminal plate (80) is made of a magnetic material such as iron. The insulating resin (90) may be a thermosetting resin such as an epoxy resin or a phenol resin, or a modified epoxy resin or a phenol resin (which ultraviolet curable resin). Examples of the method include a spin coating method and a molding method.
次に、第１表と第２表に電解コンデンサ定格５０［Ｖ］
−１［μＦ］について本発明によるものと、従来例によ
るものとを温度２６０［”Ｃ］の溶融半田中に１０秒間
浸漬した試論前と試ｙｉ？、後の対比を示す。第１表は
本発明によるもの、箪２表は従来例によるものである。Next, in Table 1 and Table 2, electrolytic capacitor rating 50 [V]
-1 [μF] of the present invention and the conventional example are immersed for 10 seconds in molten solder at a temperature of 260 ["C]. Comparison is shown before and after the test. Table 1 shows The two tables according to the present invention are based on the conventional example.
［効果］
第１表および第２表から判るように、本発明によるもの
の方が従来例のものに比較して、半田浸漬後においても
容量［μＦ］、損失［％コ、漏れ電流［μＡ］の変化が
少なく、安定なチップ形電解コンデンサを提供できる。[Effects] As can be seen from Tables 1 and 2, the product according to the present invention has lower capacitance [μF], loss [%], and leakage current [μA] even after immersion in solder than the conventional example. It is possible to provide a stable chip-type electrolytic capacitor with little change in .
また、周囲温度８５［”Ｃ］、２０００時間の長時間使
用にも耐え得る。Moreover, it can withstand long-term use of 2000 hours at an ambient temperature of 85[''C].
第１図は本発明の一実施例を示す部分断面図、第２図は
従来例を示す部分断面メである。
図中、（１０）・・・チップ形電解コンデンサ、（２０
） ・・・アルミニウムケース、（３０）・・・コンデ
ンサ素子、（４０）・・・ゴム封口体、 （５０）、
（６０） ・ −・リード線、（７０）、（８０）
・・・金属キャップ端子板、（９０）・・・樹脂。FIG. 1 is a partial sectional view showing one embodiment of the present invention, and FIG. 2 is a partial sectional view showing a conventional example. In the figure, (10)...Chip type electrolytic capacitor, (20
)...Aluminum case, (30)...Capacitor element, (40)...Rubber sealing body, (50),
(60) - Lead wire, (70), (80)
...Metal cap terminal board, (90)...Resin.
Claims (1)
デンサ素子を組込み、ゴム封口体にて封口し、該ゴム封
口体から第１のリード線と第２のリード線を引出し、第
１のリード線に第１の金属キャップ端子板を固着し、第
２のリード線は該第１のリード線に対して反対側に位置
するように折返して第２の金属キャップ端子板を固着し
、両側に位置する該第１の金属キャップ端子板と該第２
の金属キャップ端子板との間のアルミニウムケースおよ
びゴム封口体の全体を該第１の金属キャップ端子板と該
第２の金属キャップ端子板の外表面を残して絶縁性の樹
脂にて被覆したことを特徴とするチップ形電解コンデン
サ。(1) At least a capacitor element is assembled in a cylindrical aluminum case, sealed with a rubber sealing body, a first lead wire and a second lead wire are drawn out from the rubber sealing body, and a first lead wire is attached to the first lead wire. A first metal cap terminal plate is fixed, a second lead wire is folded back to be located on the opposite side to the first lead wire, a second metal cap terminal plate is fixed, and the second lead wire is fixed to the second metal cap terminal plate. a first metal cap terminal plate and a second metal cap terminal plate;
The entire aluminum case and rubber sealing body between the metal cap terminal plate and the metal cap terminal plate are covered with an insulating resin, leaving the outer surfaces of the first metal cap terminal plate and the second metal cap terminal plate. A chip-type electrolytic capacitor featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1293587A JPS62276816A (en) | 1987-01-22 | 1987-01-22 | Chip electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1293587A JPS62276816A (en) | 1987-01-22 | 1987-01-22 | Chip electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62276816A true JPS62276816A (en) | 1987-12-01 |
Family
ID=11819142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1293587A Pending JPS62276816A (en) | 1987-01-22 | 1987-01-22 | Chip electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62276816A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249722U (en) * | 1975-10-06 | 1977-04-08 | ||
| JPS5352594U (en) * | 1976-10-06 | 1978-05-06 | ||
| JPS559457A (en) * | 1978-07-06 | 1980-01-23 | Nichicon Capacitor Ltd | Chip capacitor |
-
1987
- 1987-01-22 JP JP1293587A patent/JPS62276816A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249722U (en) * | 1975-10-06 | 1977-04-08 | ||
| JPS5352594U (en) * | 1976-10-06 | 1978-05-06 | ||
| JPS559457A (en) * | 1978-07-06 | 1980-01-23 | Nichicon Capacitor Ltd | Chip capacitor |
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