JPS5832437A - セラミックケ−スの製造方法 - Google Patents
セラミックケ−スの製造方法Info
- Publication number
- JPS5832437A JPS5832437A JP57122727A JP12272782A JPS5832437A JP S5832437 A JPS5832437 A JP S5832437A JP 57122727 A JP57122727 A JP 57122727A JP 12272782 A JP12272782 A JP 12272782A JP S5832437 A JPS5832437 A JP S5832437A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- ceramic
- frame
- jig
- stopper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Landscapes
- Ceramic Products (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57122727A JPS5832437A (ja) | 1982-07-14 | 1982-07-14 | セラミックケ−スの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57122727A JPS5832437A (ja) | 1982-07-14 | 1982-07-14 | セラミックケ−スの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5832437A true JPS5832437A (ja) | 1983-02-25 |
| JPS6316904B2 JPS6316904B2 (enExample) | 1988-04-11 |
Family
ID=14843087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57122727A Granted JPS5832437A (ja) | 1982-07-14 | 1982-07-14 | セラミックケ−スの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5832437A (enExample) |
-
1982
- 1982-07-14 JP JP57122727A patent/JPS5832437A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6316904B2 (enExample) | 1988-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3574925A (en) | Soldering process | |
| JPS6316904B2 (enExample) | ||
| US6102780A (en) | Substrate polishing apparatus and method for polishing semiconductor substrate | |
| US2691214A (en) | Method of making crucibles for heating thermoplastic materials | |
| CN207825475U (zh) | 一种用于led模组的热铆治具 | |
| US5358169A (en) | Method of soldering leads to electrical components | |
| KR102762283B1 (ko) | 차량용 윈드실드 전원클립 및 그 제조방법 | |
| JPS5831405Y2 (ja) | マルチダイオ−ド半田付用治具 | |
| KR20150049617A (ko) | 대면적 평판 글래스 패턴 성형 장치 | |
| US2252517A (en) | Basing machine | |
| JPH07321273A (ja) | 半導体リード成形金型 | |
| JP4322288B2 (ja) | 台座灸製造装置および台座灸製造方法 | |
| JPS5933978B2 (ja) | ボンディング方法 | |
| CN222512022U (zh) | 热熔压合装置 | |
| CN215698637U (zh) | 一种方便焊接的mems传感器 | |
| JPH06297556A (ja) | 製函装置における熱刃取付位置合わせ方法 | |
| JPS6138953Y2 (enExample) | ||
| JP2822496B2 (ja) | プリント配線板へのリードピンの半田付け方法 | |
| JPH03137030A (ja) | ガラスレンズの成形方法およびその装置 | |
| KR870002397Y1 (ko) | 합성수지 포장대의 절단 및 융착장치 | |
| JPS61248357A (ja) | 蓄電池極板群の溶接方法 | |
| JPS6315452A (ja) | 半導体装置の製造方法 | |
| JPS6039736A (ja) | 平面型表示装置の製造方法 | |
| JP2003290698A (ja) | グリス塗布用治具 | |
| US1492875A (en) | Electrode and process of making the same |