JPS5830119A - Composite circuit part and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite circuit component including a coil L, a capacitor TC, etc., and a method for manufacturing the same.

For example, multiple coils Lt=La as shown in diagram jlN1
When configuring an LC filter consisting of capacitors C1 to Cs on one substrate, the conventional device shown in FIG. 2 is a rectangular dielectric substrate 11 O1! IiK prints a plurality of front surface electrodes 12t, and prints a first back electrode 12A' having a large area corresponding to the plurality of front surface electrodes 12 and a small back surface electrode 12B' of 1112 on the back surface of the dielectric. Four OEs formed on one side of the substrate 11! 1s
Coils L1 to Lat4 are installed in each drum-shaped core within 18.
After the coil devices 15 to 16t formed once are fitted and arranged, the coil terminals 19A and intermediate taps 19Bt are pulled out from each coil device 13 to 16. a
A plurality of protrusions 1 provided on the other side of the electrical board 11
The contact portions of the coil terminal 19A and the intermediate tap 19B and each surface electrode 12 are connected in a stain-free manner by soldering or the like while the coil terminal 19A and the intermediate tap 19B are tied together into a single layer, and one of the surface electrodes 12 and two back electrodes 12A', Lead wires 10A to 10C are connected to 12B' by soldering or the like. Here, the facing portions of the front surface electrode 12 and the back surface electrodes 12A' and 12B' are respectively configured as capacitors 01 to Cs.

However, in the above device, the dimension j in the height direction of the large-area back electrode 12A' to ensure the capacitance of the capacitor is
The height dimension 1u of the dielectric substrate 11 must be extremely large, as it is necessary to ensure a uniformity (height dimension required to fixedly support the coil devices 13 to 16). Complex, complex! ◇There is also a problem that the size of the coil device 1 is hindered as the height dimension increases.
The lengths of the coil terminals 19A and the intermediate tabs 719BO that are drawn out from the coil terminals 3 to 16 also increase in length, and there are also problems such as wire breakage occurring during assembly work. Moreover, the number of protrusions @ 11A for wrapping the coil terminals 19A, etc. increases as the number of elements increases, so there is a problem of frequent breakage accidents, or it is difficult to maintain a predetermined spacing on both sides of the dielectric substrate 110. The held concave fl118 and the protrusion 111
The necessity of providing a plurality of 1 At has caused various inconveniences, such as complicating the manufacturing process and increasing the number of man-hours.

The present invention has been made in view of the above circumstances, and provides a composite circuit component and its manufacturing method that can reduce the size and increase the packaging density, as well as simplify the manufacturing process and reduce the number of man-hours. The present invention will be specifically described below with reference to Examples.

Figure 185 is a perspective view showing a composite 1wtl1ssIi&o-embodiment of the present invention. In the same figure, KTh is a rectangular insulating substrate 1, below which a first dielectric substrate 1' of the same shape as KFi and a dielectric substrate jI2 are successively fixed by adhesive or the like. A plurality of passive element connection electrodes 2A1 to 2As are formed on the surface of the O-type base 111. Among these electrodes, a plurality of electrodes are arranged near the three sides of the surface of the insulating substrate 10, and there are a plurality of electrodes on the upper surface between the two electrodes 1 and 2AI.
A coil device 6 to 6 is mounted in which a coil is wound around a drum-shaped core of 11 (the one shown is Fi411), and the coil terminals 3A to 3A at both ends are connected to each electrode Kli. Six of these coil devices are coils wound around a drum lid core with six flanges, and intermediate taps 5B to 5B are drawn out and formed in the middle part of the surface of the insulating substrate 1, respectively. It is connected to five electrode parts to two.

Each of these electrodes extends to the lower side of the insulating substrate 1 in the figure, and the intersections with the side are provided with appropriate shapes (for example, V-shaped notches 117g to 7f). 2
As and 2Aa e"j extend to the upper side, and cuts s7y and 7m are formed at their intersections. A plurality of capacitors are provided on the side of the dielectric substrate 1' that is joined to the insulating substrate 1. Electrodes 2Bt to 2B- (details will be described later) are formed.
On the back surface 11, there are formed a capacitor common electrode 2C and other electrodes 2DC (back surface electrode) having shapes as will be described in detail later. The capacitor electrodes 21b to 28s extend to the lower side and the upper side sK so as to correspond to the positions of the electrodes on both sides of the insulating substrate 1, and a plurality of cuts corresponding to the notches are provided at the intersections thereof. Recesses 86 to 8f are formed, and the electrodes of the insulating substrate 111E* and the dielectric substrate 1' are connected to each other through a conductive layer commonly formed in each of the notches 86 to 8f, which are arranged correspondingly above and below. It is electrically connected to the capacitor electrode. Second dielectric substrate IA located at the bottom
t; has almost the same structure as the dielectric substrate 1' of 1!1 above, and is bonded in a state in which it is in contact with the common electrode S for the artist's capacitor. Therefore, a V-shaped cut is formed. Including 1191~
The crams are also arranged to coincide with each of the notches 97a to 7A and 8G to 8, and are electrically connected by a common conductive layer formed in each of the notches. In addition, 11g2
A notch 91% for drawing out the common electrode for the KFi capacitor is provided at the center of the lower side of the dielectric substrate.Then, the common electrode for the capacitor is drawn out to the back side through this notch @9nt, and the lead described later is drawn out. It has a trap so that it is easy to connect to the line.

Lead wires 10 are attached to the electrodes at both ends of the board 10.
A, 100 is also electrically connected to the capacitor common electrode extraction electrode 11 formed on the back surface of the second dielectric substrate 1A, and in this way, An LC coupling filter as shown in FIG. 1 is constructed.

Next, the specific structure and manufacturing method of each part of the device will be explained in detail with reference to FIGS. 4 to 6. The fourth decoy is a cost-cut diagram of the insulating substrate 1. This insulating substrate is a plate-shaped heat-resistant insulating material (for example, a ceramic substrate)
It is cut into a k-square shape, and a plurality of (six in the figure) V-shaped notches 71 to 7f are provided at approximately equal intervals on the lower side i1, and the upper side is provided with a plurality of V-shaped notches 71 to 7f at approximately equal intervals. Also, make multiple (5 in the illustration) V-shaped notches 11 (7y, 7m, etc.)
t-Provide 0 Then, apply silver plating or the like to appropriate locations Ks on the surface of the board, and attach a plurality of (F15 pieces in the figure) passive element connection electrodes (2 people! ~ 2A work) and intermediate tag connection electrodes ( The one shown is six) (2Aa to 2A@) are formed. At this time, the passive element connection electrodes 2A1 to 2A, those with odd numbers among them 2At, 2As, 2M, and the three intermediate tag connection electrodes 2Aa to 2As are provided on the lower side, respectively. Each cut 117E to 7f011.
Extends to form up to a minute. For the remaining passive element connection electrodes 2A, 4, form a KJi long acid 0 so as to reach up to 7A on the upper side s, and form a conductive layer on the end face of each of the notches 7α to 7. , to make the electrical connection pipe easier in the subsequent process 0 After that, wrap the coil around the 3-piece tsuba core and end the coil! I
Coil devices 3 to 5 are formed by electrically connecting A"5A to conductive layers 30, 4C, and 5C on both sides, and coil terminals 6A are wound around two flange cores and coil terminals 6A are connected to conductive layers 30, 4C, and 5C on both sides.
After preparing coil devices 6t-n connected to each other and applying adhesive to each opposing end of the two electrodes 1 to 1, each coil device 5 to 6 is mounted and fixed on the bonded portion. At this time, the intermediate tabs 19B of the coil devices 3 to 5 are arranged so as to be in contact with the intermediate tap connection electrodes 2A4 to 2A-.

Figure 5 is a surface view of the dielectric substrate 1' of the IE1,
FIG. 6 is a back view of one second dielectric substrate.

It is cut into a shape. In the lower and upper sides of the dielectric substrate 1' of @1, a plurality of V-shaped notches 118 are provided at positions corresponding to the notches 7 and 0 of the insulating substrate 1, respectively. 84 will be provided. A plurality of appropriately shaped capacitor electrodes 2B, -2B are provided on the surface of this first dielectric substrate 1'.
s (surface electrode) is formed by silver plating or the like. This
Of each electrode, six electrodes 2B+ to 2Bs-21ht!
Lower side 11 cut 58P-8f Extend 1N to reach K, and the remaining electrodes 2Bm and 2B are cut @8 on the upper side.
7. A conductive layer is applied to the end face of each notch extending to reach 8 mm. Then, leaving the periphery s on the back side, a large area common electrode 2C for capacitors and a small area electrode 2D (back electrode) and '! ! In this way, each capacitor in the circuit shown in FIG.
Partial capacity (for example, 1/2 capacity) of Ct-Cm Csα~
It becomes C8a.

Figure 2g6 is a back view of one person on the second dielectric substrate,
The shape and configuration of each electrode are determined by the first dielectric substrate 1'.
Noso n is almost the same. That is, the capacitor common electrodes 2C' and 2D' are formed on the back surface, and the capacitor electrodes 2B1' to 28s' (surface electrodes) are formed on the surface n1.
The lower side and the upper side sK are provided with V-shaped notches 1ira to 9, which correspond to the notches 8aHμ. A conductive layer is applied to the end face of each notch.

In this case, especially the common electrode 2 on the back side of the dielectric substrate fs2.
C' extends to the center of the lower side, and a notch s9 for drawing out the electrode is provided at the intersection thereof, and the surface K at the position corresponding to fLK is provided.
An electrode 2B' for drawing out the common electrode is provided, and a conductive layer is applied to the end face of the notch s9 for drawing out the electrode so that the front and back electrodes can be electrically connected. back electrodes 2C', 2D' and front electrodes 2B1' to 2B
The dielectric part sandwiched between the capacitor C1 and the capacitor C1 shown in the circuit of FIG. K becomes.

Next, with the back side of one of the dielectric substrates 1IL2 facing up, an appropriate conductive adhesive is applied to the entire surface or part of the dielectric substrate 1IL2, and the back sides of the first dielectric substrate 1' are aligned with each other. Glue and fix together. After that, the first dielectric substrate 1'
After applying an appropriate adhesive partially or completely to the surface of the coil device, the insulating substrate 1 on which the coil device is mounted is superimposed and fixed by adhesive. As a result, each corresponding notch 41
7s-71, E3x-8k.

911-9, they overlap almost on the same line.

After that, the electrodes 2A*, 2Ai at both ends of the surface of the insulating substrate 1 are
Both boards 1.1"lr were held between the lead wires 10A and 10C that were in contact with the dielectric board IX2, and the lead wire 10B that was in contact with the capacitor common electrode extraction electrode 2B3' on the back side of one of the dielectric boards of IX2. As a result, the conductive layer 3hC on the 11th side of each coil device 3 to 60, the connection electrode 1-2A, and the n1 Nakaseki tag 3B- are immersed in the solder tank in the state of soldering. 5B and the intermediate tag connection electrode 2A P2A are soldered, and each electrode on the entire surface of the insulating substrate 1 and the capacitor electrode on the surface of the first and second dielectric substrates 1' and IA are connected to each notch. Part 7α~7mu, 8g
-8le, 9α-9A attached to the conductive layer on each end face and soldered with thin solder n1 Furthermore, each lead @10A to 10C and one pole each were soldered nl so n z n electrically connected n That will happen. In this way, the device shown in FIG. 6 is constructed.
Ru. In this case, each capacitor c on the first dielectric substrate 1'
xg-c@a and each capacitor C of one person on the second dielectric substrate
Since +b-C*hFi is connected in parallel, each capacitance is doubled, and by adding the two, the value becomes equal to the capacitance of each capacitor Ct to C8 in the circuit shown in Figure 1 above. 0, Cl=C*a+Cxb, Qz=Csa+Ct
A e ""...p Cm-Cog+C@4.

Therefore, in order to secure the same capacitor capacity as in the conventional device, the area of one dielectric substrate can be reduced to half, and as a result, if the lateral (longitudinal) dimension 11 is kept constant, Dimensions in height direction! , Dimension CI of the capacitor electrode part of the conventional device! 1/2 of No. 11) in Figure 2 will be sufficient.

In this way, since one capacitor substrate is constructed by bonding all the back electrode parts of two dielectric substrates in common, the height dimension of the substrate is 1/21 of the conventional size! Moreover, since the insulating substrate on which the coil device EA is mounted is bonded to such a capacitor forming substrate, there is no need for space for fitting the coil device or protrusions for binding the coil terminals, unlike in the past. Therefore, the overall height can be kept within the height of the dielectric substrate.

In addition, since there is no need for a fitting recess or a protrusion for binding the coil end, there is no risk of disconnection of the coil end or breakage of the protrusion.
It is also possible to simplify the manufacturing process, reduce man-hours, and improve reliability.

The present invention is not limited to the embodiments described above, and various modifications can be made. For example, in the embodiment described above, the dimensions of each substrate 1°1' and IA are all the same, and the dielectric substrate 1', IA
In contrast, the height dimension of the insulating substrate 1 may be made slightly shorter. Further, the shape of the notch for connecting the electrodes of each substrate may be limited to a 7-shape, or may be a U-shape or a U-shape.

In the above embodiment, a coil device was used as a passive element mounted on an insulating substrate, but a chip capacitor, a resistor, etc. may also be used, or an appropriate combination of these may be mounted. Good too.

Furthermore, when creating a circuit in which the same configuration as the filter circuit shown in FIG. 1 is connected in series or in parallel in Fi as a composite component, the insulating substrate 1 of the embodiment as shown in FIG. ．． The first and second dielectric substrates 1' and IA are laminated together, and another insulating substrate IBft is laminated on the surface of the second dielectric substrate 1A. This purpose can be achieved by mounting and connecting the coil arrangement [3'. In this case, substrates 1, 1
', one set of filter circuits, one other board, 1B
It goes without saying that it is necessary to appropriately change the connection relationship with a set of filter circuits consisting of the following to obtain a desired circuit configuration. In addition, the leads 1s10 and 10' are
Multiple pieces will have to be attached to the front and back sides.

According to the present invention described in detail above, it is possible to provide a composite circuit component that is smaller in size and has an improved packaging density, and also to manufacture a composite circuit component that can simplify the manufacturing process and reduce the number of man-hours. method can be provided. Moreover, since the capacitor substrate and the coil device substrate can be made separately, manufacturing is extremely easy, and the electrodes of the coil device can be standardized, resulting in excellent versatility.

[Brief explanation of the drawing]

Fig. 1 is a circuit diagram of the LC composite filter, Fig. 2 is a full-scale diagram of a conventional device in which it is made into a composite part, and Fig. 3 is a circuit diagram of the composite 1 of the present invention.
1. Perspective views showing one embodiment of circuit components, @Figure 4 to II6
The figures are diagrams for explaining an example of the specific configuration of the embodiment device and the manufacturing method thereof in the order of steps, FIG. 4 is a surface view of the insulating substrate, and FIG. Figure, 6th
The figure is a back view of the dielectric substrate of tail 2, and FIG. 7 is a front view showing another embodiment of the present invention. 1... Insulating substrate, i', IA... Dielectric substrate, 2A
t-2As...Passive element connection electrode, 2B! ~2B-
... Electrode for capacitor, 2C... Electrode for capacitor, 3-6... Coil device, 76-74.8?8
96~9h...notch part, 3A-→A...coil terminal, 3B-5B...intermediate tap, 10A~10
C... Lead wire.

Claims (2)

[Claims] (1) A capacitor substrate formed of a common electrode St of first and second dielectric substrates having electrodes formed on both sides and fixed to face each other; and a back surface fixed to the surface of the capacitor substrate.
Passive elements are mounted and connected to a plurality of electrode portions formed on the surface of at least one insulating substrate, and opposing sides 11 of each substrate.
1. A composite circuit component comprising: a plurality of cut portions each provided in a plurality of cut portions for electrically connecting n electrodes to each other; (2) At least, dielectric electrodes are formed on both sides, and a plurality of cuts St- are formed on the side 11, and the 7tjj11 and the second
a step of obtaining a dielectric substrate of
A step of providing a plurality of notches S corresponding to the notches of the dielectric substrate Km, forming a plurality of electrodes reaching each notch 11 on the surface of this insulating substrate, and forming a plurality of notches S between each electrode. a step of mounting and connecting a passive element; a step of adhering the insulating substrate to the surfaces of the first and second dielectric substrates;
A method for manufacturing a composite lid circuit component, characterized in that it includes a step of electrically connecting the electrode portions of each substrate through each notch s.