JPS5828820A - Preparation of chip type coil - Google Patents

Abstract

PURPOSE:To simplify each process by forming the core cap through the steps that the core is attached to the lead frame, a lead wire is wound and end treatment is carried out, or by covering the winding with a mold. CONSTITUTION:The adhesive agent 26 is coated on the each pair of lead chips 21a and 21b, and the core 25 is bonded covering the lead chips 21a and 21b so that the flange 25b is placed on the adhesive agent layer 26 of the lead chips 21a and 21b. The winding 27 is provided on the body 25c of each core 25 of the lead frame 23, and both ends 27a and 27b are wound to the cut-away part 24 of each lead chip. Thereafter, the ends 27a and 27b of winding 27 are soldered to the ends of the lead chips 21a and 21b. Then, the core 25 is covered with the cap core 30, the connecting part 22 is cut away at the root portion of the lead chips 21a and 21b and thereby these lead chips are separated and isolated electrically and mechanically. Thereafter, the unused ends of lead chips 21a and 21b are folded along the outer surface of core 30, forming a coil 40.

Description

DETAILED DESCRIPTION OF THE INVENTION In recent years, as electronic devices have become increasingly smaller and thinner, there has been a demand for smaller coil elements, such as inductance elements, used therein.

Examples of conventional coil clusters of this type will be explained with reference to FIGS. 1 to 13. In this example, as shown in an enlarged side view in FIG.
b) is provided with an erected drum-shaped core fil, and one flange portion (1a) of the core fil is held (chucked) by a chuck means (not shown) on the body portion (IC) of the core (1). The winding (3) is wound, and this winding (3)
Terminals (3a) and (3b) are terminals (2a) and (3b), respectively.
2b). Then terminals (2a) and (2
In b), the part where the ends (3a) and (3b) of the winding wire (3) are wound is placed in the solder material (4) which has been heated and melted, as shown in the enlarged side view in FIG. Each terminal (3) of the winding (3) is immersed in the solder dip method.
a) and (3b) are +H1 to terminals (2a) and (2b)
be attached.

Next, the flange portion (1b) on the side having the terminals (2a) and (2b) is reattached to a chuck means (not shown), and the core (1) is placed in the mold material using a tipping mold or in a mold material. By molding, a resin mold (6) is formed as shown in FIG. 3, an enlarged partial cross-sectional side view.

The coil element obtained by such a method has the disadvantage that the entire manufacturing process is complicated and that it cannot be sufficiently miniaturized.

As another example, as shown in an enlarged perspective view in FIG.
Similarly, a drum-shaped core (1) having a pair of 7-rank parts (1a) and (1b) is prepared, and one of the flange parts (1a) is prepared.
) while chucking the body part (IC) of the core (1).
) and wind the winding (3) on top.

On the other hand, as shown in an enlarged perspective view in FIG. 5, a lead frame (8) in which a plurality of lead pieces (7) are arranged in parallel is prepared. This lead frame (8) has each lead piece (
As described above, the swords are arranged in parallel in a belt shape, each end of which is connected to the other by a connecting portion (9), so that the overall shape is, for example, a comb shape, and is formed by punching and pressing from a single metal plate. Each lead piece (7) is bent in a V-shape in one direction at its intermediate part, and a protrusion (10) is formed at the bending top of the opposing part of each adjacent pair of lead pieces (7a) and (7b). is provided. and,
Both flange parts (1a) and (1b) of the core (1) between which the winding (3) explained in FIG. 4 is wound between these protrusions αO)
). In this case, both 7 lunges of core (1) (
For example, four conical parts 0υ are formed in each of 1a) and (1b), and a pair of lead pieces (7a) are formed in this recess (11).
and (7b) are inserted so that the core (II) is held between these pairs of lead pieces (7a) and (7b).In this way, the adjacent pair of lead pieces Each terminal of the winding (3) on the core (1) held between (7a) and (7b) is connected to the corresponding lead piece (7a) and (71) as shown in an enlarged front view in FIG. )), and in this state, the frame (8) is wrapped around the coil ends (3a) and (3b) in the heated and melted half-inch material (4), as shown in FIG. The ends (3a) and (3b) are soldered to the lead piece (7) by dipping the end of the lead piece (sword) wrapped around the lead frame (8).Next, for example, solder the core (1) of this lead frame (8). The core (1) with the winding wire (3) placed therein is placed in a mold case, resin is injected, and the core (1) on which the winding (3) is applied is covered with a resin mold body (11j) as shown in an enlarged perspective view in FIG. Thereafter, the connecting portion (9) of the lead frame (8) is cut at the base side of each lead piece (7) as shown by the chain line a in FIG. Obtain a coil element.

However, with this method, the work of holding the core (1) between the lead pieces (7a) and (7b) is troublesome;
Also, during subsequent handling, the pair of lead pieces (7a) and (7
b) There is a drawback that handling is troublesome as the core (1) comes off from the gap.

Furthermore, although the coil elements explained in FIGS. 1 to 3 or 4 to 8 each have a structure in which leads are led out, this element adopts a chip type structure. It is desirable to adopt a method in which the terminals are placed directly on a wiring board or the like and each terminal is simultaneously soldered in order to miniaturize the device and simplify manufacturing. An example of this kind of chip type is a pair of 7 rank parts (la) and (1
The winding wire (3) is wound on the body (1c) of the drum-shaped core (1) having the shape (b). A pair of electrodes (12
a) and (12b) are formed by metallization,
For example, there is one in which the terminals (3a) and (3b) of the winding (3) on the core (1) are semi-HE attached by a solder dip method.

However, in this case, the electrode baking to form the electrodes (12a) and (12)), so-called metallization, is 82
It is carried out at a high temperature of about 0.000. In addition, since the core is heated to a high temperature during solder dipping, the magnetic properties of the core (IJ, such as magnetic permeability μ) are affected, and the electrodes (12a) and (12b) may peel off from the core during solder dipping. , the electrode (1
2a) and (12b) of the terminal (
3a) and (3b) cause deterioration in characteristics such as ease of cutting due to contact with the edge of the 7-rank portion (1b), or deterioration in reliability.

The present invention aims to provide a method for manufacturing a so-called chip-type coil device which is free from such drawbacks and in which a coil element is directly mounted and soldered onto a wiring section of a wiring board or the like.

The unexploded FJA manufacturing method will be explained in detail using rare fish shown in Figure 10 and below.

In the present invention, for example, as shown in an enlarged perspective view in FIG. 10, a plurality of pairs of strip-shaped lead pieces (21
a) and (21b) are arranged side by side and connected at each end by a connecting portion (221) to provide a lead frame (23) having a comb shape as a whole, for example. Each lead piece (
For example, a notch C41 may be formed on the outer surface of each of the free ends of 21a) and 21b.

On the other hand, as shown in an enlarged perspective view in FIG.
) is prepared.

Then, as shown in Fig. 10, each pair of lead pieces (21
Apply adhesive (26) on a) and (21b),
12 and 13 to be placed on this adhesive layer.
As shown in the figure, a pair of lead pieces (21a) and (21b) are shown in an enlarged plan view and a partially sectional enlarged side view, respectively.
) over the core (251) and its flange (2
5b) is placed on the adhesive layer (26) of the pair of lead pieces (21a) and (21b).

Next, as shown in FIGS. 14 and 15, respectively, an enlarged plan view and an enlarged partially sectional side view, the body portion (25C) of each core (C) of the lead frame (23) is Winding (2 wires are wound, both terminals (27a) and (27b)
) around the notch (241) of each lead piece.

After that, as shown in FIG. 16, the lead frame (23)
on the opposite side from the connection part (221, that is, each lead piece (21a
) and (21b), and the ends (27a) and (27b) of each winding (27) are wound around the ends, and are housed in a heated molten state in a tank (28). Dip it into solder (29) and pull it up,
Each terminal (27a) and (27b) of the winding Q force is soldered to the terminal of the lead piece (21a) and (21b). The terminal processing using this solder tip is, for example, 360C to 380C.
This is done at level C.

Next, Fig. 17 shows the enlarged plan view, and Fig. 18 shows the first
The core (25
The cap-shaped core gyrus is crowned on 1. Thereafter, the connecting portions were cut out on the base side of each lead piece (21a) and (21b) along the cutting line shown by the dashed line in FIG. Mechanically cut and separate.

After that, as shown in the enlarged perspective view in FIG.
21a) and (21b) along the outer surface of the free end core C30+.

In this way, the coil device (4) is constructed.The coil device (40) constructed in this way has a winding (
The respective terminals (27a) and (27b) of 5) are connected to the respective lead pieces (21a) and (21b) which are fixed to the outer surface of the power coil element body (in the illustrated example, the cap core c30). It is characterized by its neck being bent. That is, the coil arrangement [t
4Ql is the circuit part, for example, the wiring equipment of the printed circuit board.
(Place each lead piece (21a) (21b) of 4Ql on the corresponding wiring pattern and pass it through a heating furnace to solder it. That is, the coil device obtained by the present invention +
40) has a so-called chip shop configuration in which it is placed directly on the wiring pattern and mechanically and electrically connected.

In the above example, the core (2) is fixed to the lead frame with an adhesive, but it is possible to mechanically connect the frame and coil with such an adhesive or without using an adhesive. It is also possible to perform the connection.An example of this case will be explained.

In this case, as shown in the enlarged plan view in Fig. 20, the first ()
Regarding the figure, there are multiple pairs of lead pieces (21
Lead frame (a) and (211)) arranged in parallel
C), the reinforcing pieces (31a) and (3) (1)) are connected to each lead piece (21; l) and (21b) at their intermediate parts and extend along the outside thereof. Provided for. In the illustrated example, each lead piece (21a) and (2
], b) are formed into an L-shaped pattern with the free ends bent outward, and the reinforcing piece (31a) and (
31b) is extended, and in this case, the reinforcing pieces (31a) and (31b) and the lead piece (
21a) and (21b) with adhesive (21i
1 or without applying a pair of lead pieces (
As shown in the enlarged plan view in FIG. 21, the flange (25b) of the core (J5J) is placed on the core (25) as shown in the enlarged plan view in FIG. Winding wire (2n) and each terminal (27a
) and (27b) as lead pieces (21a) and (21b)
The reinforcing pieces (31a) and (3) are wrapped around the bent part of the free end and tied with solder in the same manner as in the previous example.
The free ends of 1 and b) are bent so as to sandwich the flange portion (25b) of the core (25), and the core (25) is attached to both ends of the pair of reinforcing pieces (31a) and (31+). hold.

Although the two-terminal example uses a two-terminal configuration, it is also possible to adopt a four-terminal configuration, for example, a transformer type configuration having a primary winding and a secondary winding. An example of this case will be explained. This fitting lead frame C731 is provided with a plurality of pairs of connecting pieces (22al) and (22bl) extending further from the connecting part @ in a direction perpendicular thereto, as shown in an enlarged plan view in FIG. 22, for example. Five pairs of acidic lead pieces are attached to each free end of the connecting pieces (22al) and (22b1) at both ends through U-shaped connecting parts (22a2) and (22b2) that are bent outward. (2
1a) (21a), and (21b) (21b') are provided. These two pairs of lead pieces (21a) (21a
) and (211)) (2113), as shown in FIG. 23 in an enlarged perspective view.
For example, it may be bonded as described above. A secondary winding (27A) and a secondary winding (27B) are respectively wound around the body (25c) of the core (25) as shown in FIG.

Each of these 1st volume & (27A) and 2nd volume + (27B
) to the left and right pair of lead pieces (21a), (21a)
, (21b), and (21b), respectively, and half 111 is attached by half-[il dip or the like. Thereafter, in the same manner as in the previous example, for example, a gap core is applied, and the lead frame (23) is cut along the cutting lines as shown by the chain lines c, d, and e in FIG.
a) A four-terminal transformer can be constructed with terminals (21 and (21b')), respectively.

In addition, as a cap core measurement, as shown in an enlarged cross-sectional view in FIG. The inner circumferential surface of □ is made into a cylindrical surface, and a host screw is formed thereon to be screwed into the threaded groove of the flange portion (25a), and the core O
The inductance may be adjusted by allowing the cap core 00) to move up and down along the eO axis, for example by changing the distance between the lower flange portion (25b) and the lower end of the cap core. can.

In the chip type coil explained in FIGS. 10 to 19, the free ends of the lead pieces (21a) and (21b) are selected to be long enough, and the enlarged perspective view of the free ends is shown in FIG. As shown, extend the cap core (3o) by wrapping it around the outer circumference in a U-shape, and then apply solder to the wiring section of another wiring board to which this coil is to be connected via solder C321. You can also attach it. In this case, it is possible to avoid the disadvantage that the heat generated during soldering to the wiring section affects the soldering section of the terminal section of the coil.

In addition, in the above-mentioned example, a chip-type coil having a structure in which the cap core (3) is covered is used, but in a case where the cap core (30) is not provided, the winding part of the winding C force is formed by a resin mold. It can also be plugged. In this case as well, the lead frame (23)
Since the cores are handled and inserted into, for example, a resin molded mold case or suspended, each core is handled individually and its flange portion is chucked as in the conventional method. This eliminates the need for inserting and holding the resin mold into a case, making it suitable for information production.

In addition, a lead frame having a four-terminal configuration, for example, a pair of connecting portions C2' as shown in an enlarged plan view in FIG.
a (lead piece (21a) extending inward between 221
) and (2]a) , (21b) and (2]))')
Form these lead pieces (21a) (
21a) (21b) (21b) straddle the core (25)
Arrange and fix the windings (2710 windings, each lead piece (21
a) (21a) (21b) (21b) Wrapping, soldering, etc. of the heno terminal can be done in the same way as described above, but cutting can also be done along the cutting lines indicated by chain &lf and g in the figure. .

As mentioned above, according to the manufacturing method of the present invention, the core is mounted on the lead frame, the wire is wound, and the end is treated to form a core cap or the winding portion is covered with a mold. Each of these processes becomes easy to handle, and manufacturing automation becomes easy. Furthermore, since a large number of inductance clusters are manufactured at the same time, there is an advantage that the cost can be reduced. Furthermore, since electrode formation on the core is avoided, heat treatment associated with metallization and the like for electrode formation is not required, thereby avoiding deterioration in reliability such as changes in magnetic properties due to thermal stress and the like. In addition, since it is easy to attach a cap core or ring core to the core, it is possible to achieve a smaller size and higher inductance.Furthermore, by using these cap cores, a shielding effect can be obtained, and interference between inductance elements due to leakage magnetic flux can be obtained. Benefits such as avoidance are achieved.

[Brief explanation of drawings]

Figures 1 to 3 are 1 step diagrams of the conventional manufacturing method, Figures 4 to 8 are process diagrams of other examples of the conventional manufacturing method, and Figure 9 is a side view of a coil device according to another example of the conventional manufacturing method. Figures 10 to 19 are process diagrams of an example of the manufacturing method of the present invention, Figures 20 and 21 are process diagrams of other examples of the manufacturing method of the present invention, and Figures 22 to 24 are process diagrams of an example of the manufacturing method of the present invention. Further example process diagram, 2nd
5 and 26 are a perspective view and a plan view, respectively, of one step of each other example of the manufacturing method of the present invention. (to) is the lead frame, (2], a) (21a') (
21b) (21,b') is its lead piece, (22+ (
22a) (22b) (22a+) (22az) (22b
t) (22b2) is the connecting part, (251 is the core, (25a
) (22b) is the flange part of the hole, (25c) is its ll.
In the ljtl section, C27+ is a winding, (4 (sha is a chip type coil device.) Supplementary Procedure Amendment Document dated March 1980 1, Indication of the Case Patent Application No. 126901 of 1982 2. Title of Invention Process for Manufacturing a Chip-Type Coil Device 3, Person Making the Amendment Relationship with the Case Patent applicant) 2: 1, -1.1, -, -
-・J Representative Director, ;J deceased Kazuo Iwama's column. 8. Contents of amendment (1) (1) The claims are amended as shown in the attached sheet. (2) In the specification, page 9, line 2, "Then, Figure 19"
"Then, if necessary, correct it to Figure 19-1. (3) Same, page 11, line 5.
ta)-1. After that, add reinforcement pieces (3
1a) Correct it as J. (4) Same, page 16, line 7 r (22a) (221)
) Delete J. (5) Same page, line 8 ``(25a) (22+3) J is corrected as 1- (25a) (25b) J. Hereinafter - G Claims On the lead piece of a conductive plate-shaped lead frame a step of mounting and fixing the core so that its central axis is substantially perpendicular to the surface of the lead frame; a step of winding the core; A method for manufacturing a chip-type coil device, comprising a step of connecting the lead pieces to a portion remote from the core, and a step of cutting and separating the mutually connected portions of the lead pieces.

Claims (1)

[Claims] placing and fixing the core on a lead piece of a conductive plate-like lead frame so that the central axis of the core is substantially perpendicular to the surface of the lead frame; winding the core; and winding the core. a step of connecting each end of the lead piece to a portion of the lead piece away from the core; a step of cutting and separating the mutually connecting portions of the lead pieces; and a step of connecting the connecting portion of the winding and the lead piece to a side surface of the core. A method for manufacturing a chip-type coil device that includes a step of bending it into a shape.