JPH0510339Y2 - - Google Patents
Info
- Publication number
- JPH0510339Y2 JPH0510339Y2 JP1983116053U JP11605383U JPH0510339Y2 JP H0510339 Y2 JPH0510339 Y2 JP H0510339Y2 JP 1983116053 U JP1983116053 U JP 1983116053U JP 11605383 U JP11605383 U JP 11605383U JP H0510339 Y2 JPH0510339 Y2 JP H0510339Y2
- Authority
- JP
- Japan
- Prior art keywords
- core
- coil
- present
- flanges
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011162 core material Substances 0.000 description 12
- 238000005476 soldering Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【考案の詳細な説明】
本考案は、ドラム型（つつみ型）コアの一辺が
平板状となつており、かつその両側にスパツタ電
極を設け、プリント基板上に直接装着可能とした
チツプ型のインダクタンス素子に関する。[Detailed description of the invention] The present invention is a chip-type inductor that has a drum-shaped (tsutsumi-shaped) core with one side flat and sputtered electrodes on both sides so that it can be mounted directly on a printed circuit board. Regarding elements.
従来のチツプ型インダクタには、例えば第１図
に示す如く、ドラム型コア１の両端にリード線２
を突出形成したリードタイプがあるが、これをプ
リント（PC）基板に、直接装着する場合はリー
ド線２を基板に挿入する作業が必要となる。 A conventional chip-type inductor has lead wires 2 at both ends of a drum-type core 1, as shown in FIG.
There is a lead type in which a protruding wire is formed, but when this is directly attached to a printed (PC) board, it is necessary to insert the lead wire 2 into the board.
ところで、第２図はモールド型チツプインダク
タの例を示しているが、これは電極に半田メツキ
銅板６を使用する為、電極の半田メツキ銅板と巻
コイルを接続する工程、更にモールドする工程が
必要となり、よつて、製造が繁瑳となる欠点を有
する。 By the way, Fig. 2 shows an example of a molded chip inductor, but since this uses a solder-plated copper plate 6 for the electrode, it requires a process of connecting the solder-plated copper plate of the electrode and the wound coil, and a further process of molding. Therefore, it has the disadvantage that manufacturing is complicated.
本考案はかかる点に鑑み、ドラム状コアの両側
端の鍔部の底面及び側面に電極用蒸着膜及び絶縁
膜を形成することにより、プリント基板への実装
作業工数を低減しかつ基板へのデイツプ半田付け
により合理化を可能にしたインダクタンス素子を
提案することを主たる目的とする。 In view of this, the present invention reduces the number of steps required for mounting on a printed circuit board and reduces the number of steps required for mounting on a printed circuit board by forming an electrode deposition film and an insulating film on the bottom and side surfaces of the flanges at both ends of the drum-shaped core. The main purpose is to propose an inductance element that can be rationalized by soldering.
以下本考案の一実施例について図面を参照しな
がら詳細に説明する。 An embodiment of the present invention will be described in detail below with reference to the drawings.
第３図は本案の一例を示す斜視図である。ドラ
ム型（つつみ型）コア１１は、その両端に正方形
状の鍔１３が一体にフエライト材で形成され、か
つ所要のコイル１２が巻回される中央径小部１１
ｂが形成される。そして両鍔１３の一辺又は複数
辺（側面１３ａ及び底面１３ｂ）に電極を形成す
るため、Au，Cu又はステンレス材等をスパツタ
リング等により蒸着膜が形成される。そして中央
径小部１１ｂに所要のコイル１２を巻回して、そ
の端末１２ａ，１２ｂを両側の鍔１３の側面１３
ａに半田付けして完成される。 FIG. 3 is a perspective view showing an example of the present invention. The drum-shaped (tsutsumi-shaped) core 11 has square-shaped flanges 13 integrally formed at both ends of the ferrite material, and has a small center diameter portion 11 around which a required coil 12 is wound.
b is formed. In order to form an electrode on one or more sides (side surface 13a and bottom surface 13b) of both flanges 13, a vapor deposited film of Au, Cu, stainless steel, or the like is formed by sputtering or the like. Then, the required coil 12 is wound around the small center diameter portion 11b, and the ends 12a, 12b are connected to the side surfaces 13 of the collar 13 on both sides.
It is completed by soldering to a.
そして以上の如きインダクタ１４をプリント基
板に固定するには所謂デイツプ半田付けするた
め、鍔１３の底面１３ｂの電極と印刷導線を接触
させて半田槽内を通過させれば、両者は電気的機
械的に一体化することになる。 In order to fix the inductor 14 as described above to the printed circuit board, so-called dip soldering is used. Therefore, if the electrode on the bottom surface 13b of the collar 13 and the printed conductor are brought into contact and passed through the solder tank, the two will be electrically and mechanically connected. will be integrated into.
第４図は本案の他の例を示す斜視図である。本
例においては、両端の鍔１３を円形にしかつ底部
を平坦状にカツトして底面１３ｂを形成したコア
２１を採用している。そして鍔１３の円弧状側面
１３ａ及び底面１３ｂに上述例と同様に蒸着膜を
設けたものである。よつて第３図例と同様の作用
が可能である。 FIG. 4 is a perspective view showing another example of the present invention. In this example, a core 21 is used in which the flanges 13 at both ends are circular and the bottom is cut flat to form a bottom surface 13b. A vapor-deposited film is provided on the arc-shaped side surface 13a and bottom surface 13b of the collar 13 in the same manner as in the above-mentioned example. Therefore, the same effect as the example in FIG. 3 is possible.
第５図は本案の更に他の実施例を示すドラムコ
アを底面より見た斜視図である。本例においては
半田付けの必要部分のみに電極形成した例であ
る。２４はプリント基板に接続されるコア３１の
鍔３３の平坦底面３３ａとその側面とに連続して
形成した電極を示し、平坦な側面部分にコイルの
引き出し線が半田付けされて電気的接続がされ
る。 FIG. 5 is a perspective view of a drum core seen from the bottom showing still another embodiment of the present invention. In this example, electrodes are formed only in the parts that require soldering. Reference numeral 24 indicates an electrode formed continuously on the flat bottom surface 33a of the flange 33 of the core 31 and its side surface to be connected to the printed circuit board, and the lead wire of the coil is soldered to the flat side surface portion for electrical connection. Ru.
よつて本例においても上述例と同様の作用効果
が得られる。 Therefore, in this example as well, the same effects as in the above-mentioned example can be obtained.
第６図は本考案の他の実施例を示す側面図であ
る。フエライトには比抵抗の大きいものもある
が、102（Ω−cm）程度と小さいものも少なくな
い。このようなフエライトコアの場合には絶縁性
が問題となるので、フエライトの上に絶縁膜例え
ばSiO2等のスパツタリング膜４６を形成してお
き、その上に導電塗布膜あるいは導電スパツタリ
ング膜の電極４４を堆積させることにより得るも
のである。尚、４３はフエライトコアの鍔を示
す。 FIG. 6 is a side view showing another embodiment of the present invention. Some ferrites have a high resistivity, but many have a low resistivity of around 10 2 (Ω-cm). In the case of such a ferrite core, insulation is a problem, so an insulating film, for example, a sputtering film 46 of SiO 2 or the like is formed on the ferrite, and then a conductive coating film or an electrode 44 of a conductive sputtering film is formed on the ferrite. It is obtained by depositing . In addition, 43 indicates the collar of the ferrite core.
以上述べた如く本考案によれば、両端の鍔に平
坦底面を形成した比抵抗の小さいフエライトコア
にコイルを巻裝したインダクタンス素子におい
て、鍔の平坦底面と側面とに連続する導電性膜が
絶縁膜を介在して設けられ、コイル引き出し線が
上記側面の導電性膜に電気的接続されたので、
コア素材の比抵抗が小さいものであつても絶縁
膜を設けることにより、絶縁性を高めることがで
き、かつ実装する際回路基板へのデイツプ半田付
が可能となり、基板への実装作業が向上する。特
にデイツプ半田作業を合理的な自動化ラインで行
うには特に効果的である。 As described above, according to the present invention, in an inductance element in which a coil is wound around a ferrite core with low resistivity, which has flat bottom surfaces formed on the flanges at both ends, the conductive film continuous with the flat bottom surface and side surfaces of the flanges is insulated. The coil lead wire is electrically connected to the conductive film on the side surface, so even if the core material has a low resistivity, the insulation can be improved by providing the insulating film. It also enables dip soldering to the circuit board during mounting, which improves the mounting work on the board. It is particularly effective for performing dip soldering work on a rational automated line.
第１図及び第２図は従来の素子の例を示す斜視
図、第３図は本案の一例を示す斜視図、第４図は
本案の他の例を示す斜視図、第５図は本案の更に
他の実施例を示す図、第６図は本考案の他の実施
例を示す側面図である。
１１……コア、１２……コイル、１３…鍔、１
３ａ……側面、１３ｂ……底面、１４……インダ
クタ。
1 and 2 are perspective views showing examples of conventional elements, FIG. 3 is a perspective view showing an example of the present invention, FIG. 4 is a perspective view showing another example of the present invention, and FIG. 5 is a perspective view showing an example of the present invention. FIG. 6 is a side view showing another embodiment of the present invention. 11...core, 12...coil, 13...tsuba, 1
3a...Side surface, 13b...Bottom surface, 14...Inductor.
Claims (1)
フエライトコアにコイルを巻装したインダクタン
ス素子において、 鍔の平坦底面と側面とに連続する導電性膜が絶
縁膜を介在して設けられ、コイル引き出し線が上
記側面の導電性膜に電気的接続されたことを特徴
とするインダクタンス素子。[Scope of Claim for Utility Model Registration] In an inductance element in which a coil is wound around a ferrite core with low resistivity that has flat bottom surfaces formed on the flanges at both ends, a conductive film continuous with the flat bottom surface and side surfaces of the brim has an insulating film. An inductance element characterized in that a coil lead wire is provided interveningly and electrically connected to the conductive film on the side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605383U JPS6025114U (en) | 1983-07-25 | 1983-07-25 | inductance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11605383U JPS6025114U (en) | 1983-07-25 | 1983-07-25 | inductance element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6025114U JPS6025114U (en) | 1985-02-20 |
| JPH0510339Y2 true JPH0510339Y2 (en) | 1993-03-15 |
Family
ID=30267683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11605383U Granted JPS6025114U (en) | 1983-07-25 | 1983-07-25 | inductance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025114U (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11854727B2 (en) | 2017-03-24 | 2023-12-26 | Proterial, Ltd. | Powder magnetic core with terminal and method for manufacturing the same |
| JP6748626B2 (en) * | 2017-11-20 | 2020-09-02 | 太陽誘電株式会社 | Electronic parts |
| JP6922044B2 (en) * | 2017-11-20 | 2021-08-18 | 太陽誘電株式会社 | Electronic components |
| JP6924881B2 (en) * | 2017-11-20 | 2021-08-25 | 太陽誘電株式会社 | Electronic components |
| JP7177893B2 (en) * | 2020-06-30 | 2022-11-24 | 太陽誘電株式会社 | electronic components |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877017U (en) * | 1981-11-17 | 1983-05-24 | 株式会社 光輪技研 | high frequency coil |
-
1983
- 1983-07-25 JP JP11605383U patent/JPS6025114U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6025114U (en) | 1985-02-20 |
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