JPS5827021Y2 - 噴流式メツキ装置 - Google Patents
噴流式メツキ装置Info
- Publication number
- JPS5827021Y2 JPS5827021Y2 JP2552779U JP2552779U JPS5827021Y2 JP S5827021 Y2 JPS5827021 Y2 JP S5827021Y2 JP 2552779 U JP2552779 U JP 2552779U JP 2552779 U JP2552779 U JP 2552779U JP S5827021 Y2 JPS5827021 Y2 JP S5827021Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plating
- back surface
- electrode
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2552779U JPS5827021Y2 (ja) | 1979-02-27 | 1979-02-27 | 噴流式メツキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2552779U JPS5827021Y2 (ja) | 1979-02-27 | 1979-02-27 | 噴流式メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55124473U JPS55124473U (OSRAM) | 1980-09-03 |
| JPS5827021Y2 true JPS5827021Y2 (ja) | 1983-06-11 |
Family
ID=28866065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2552779U Expired JPS5827021Y2 (ja) | 1979-02-27 | 1979-02-27 | 噴流式メツキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5827021Y2 (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH083153B2 (ja) * | 1990-02-26 | 1996-01-17 | 日本電装株式会社 | めっき装置 |
-
1979
- 1979-02-27 JP JP2552779U patent/JPS5827021Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55124473U (OSRAM) | 1980-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20050121313A1 (en) | Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station | |
| JPH0568092B2 (OSRAM) | ||
| JP2002212786A (ja) | 基板処理装置 | |
| JPH0573245B2 (OSRAM) | ||
| US20030070695A1 (en) | N2 splash guard for liquid injection on the rotating substrate | |
| US2763564A (en) | Means and methods for processing cathode ray tube bulbs | |
| JPS5827021Y2 (ja) | 噴流式メツキ装置 | |
| JPS6341630B2 (OSRAM) | ||
| JP2002143749A (ja) | 回転塗布装置 | |
| JP3118142B2 (ja) | 基板処理装置及び基板処理方法 | |
| JPH0240747B2 (OSRAM) | ||
| JP3877910B2 (ja) | めっき装置 | |
| US6224670B1 (en) | Cup-type plating method and cleaning apparatus used therefor | |
| JP2957383B2 (ja) | 回転式塗布装置 | |
| JP2628168B2 (ja) | 半導体ウエーハの表面処理装置 | |
| JPS5923517A (ja) | レジスト除去方法および装置 | |
| JPH05295589A (ja) | 半導体ウエハのバンプ電極めっき装置及びそのめっき方法 | |
| JPH01255684A (ja) | 半導体ウェハーの製造装置 | |
| JP2012036467A (ja) | 処理装置及び処理方法 | |
| JPH09217183A (ja) | エッチング装置およびエッチング方法 | |
| JP2001049494A (ja) | めっき装置 | |
| JPH10303101A (ja) | レジスト塗布装置 | |
| JPH04163916A (ja) | 半導体基板エッチング装置 | |
| JPH0628224Y2 (ja) | 基板回転処理装置 | |
| JPH0758000A (ja) | 回転式基板処理装置 |