JPS5824455Y2 - 半導体発光素子の実装装置 - Google Patents

半導体発光素子の実装装置

Info

Publication number
JPS5824455Y2
JPS5824455Y2 JP9750178U JP9750178U JPS5824455Y2 JP S5824455 Y2 JPS5824455 Y2 JP S5824455Y2 JP 9750178 U JP9750178 U JP 9750178U JP 9750178 U JP9750178 U JP 9750178U JP S5824455 Y2 JPS5824455 Y2 JP S5824455Y2
Authority
JP
Japan
Prior art keywords
light emitting
semiconductor light
emitting element
emitting device
device mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9750178U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5514746U (enrdf_load_stackoverflow
Inventor
清 白川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9750178U priority Critical patent/JPS5824455Y2/ja
Publication of JPS5514746U publication Critical patent/JPS5514746U/ja
Application granted granted Critical
Publication of JPS5824455Y2 publication Critical patent/JPS5824455Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9750178U 1978-07-14 1978-07-14 半導体発光素子の実装装置 Expired JPS5824455Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9750178U JPS5824455Y2 (ja) 1978-07-14 1978-07-14 半導体発光素子の実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9750178U JPS5824455Y2 (ja) 1978-07-14 1978-07-14 半導体発光素子の実装装置

Publications (2)

Publication Number Publication Date
JPS5514746U JPS5514746U (enrdf_load_stackoverflow) 1980-01-30
JPS5824455Y2 true JPS5824455Y2 (ja) 1983-05-25

Family

ID=29032392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9750178U Expired JPS5824455Y2 (ja) 1978-07-14 1978-07-14 半導体発光素子の実装装置

Country Status (1)

Country Link
JP (1) JPS5824455Y2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112930U (ja) * 1984-06-28 1986-01-25 株式会社クボタ 作業車
JPH034748Y2 (enrdf_load_stackoverflow) * 1986-08-06 1991-02-07
JP6487626B2 (ja) * 2014-03-24 2019-03-20 スタンレー電気株式会社 半導体装置

Also Published As

Publication number Publication date
JPS5514746U (enrdf_load_stackoverflow) 1980-01-30

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