JPS5824455Y2 - 半導体発光素子の実装装置 - Google Patents
半導体発光素子の実装装置Info
- Publication number
- JPS5824455Y2 JPS5824455Y2 JP9750178U JP9750178U JPS5824455Y2 JP S5824455 Y2 JPS5824455 Y2 JP S5824455Y2 JP 9750178 U JP9750178 U JP 9750178U JP 9750178 U JP9750178 U JP 9750178U JP S5824455 Y2 JPS5824455 Y2 JP S5824455Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- emitting element
- emitting device
- device mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9750178U JPS5824455Y2 (ja) | 1978-07-14 | 1978-07-14 | 半導体発光素子の実装装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9750178U JPS5824455Y2 (ja) | 1978-07-14 | 1978-07-14 | 半導体発光素子の実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5514746U JPS5514746U (enrdf_load_stackoverflow) | 1980-01-30 |
JPS5824455Y2 true JPS5824455Y2 (ja) | 1983-05-25 |
Family
ID=29032392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9750178U Expired JPS5824455Y2 (ja) | 1978-07-14 | 1978-07-14 | 半導体発光素子の実装装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5824455Y2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6112930U (ja) * | 1984-06-28 | 1986-01-25 | 株式会社クボタ | 作業車 |
JPH034748Y2 (enrdf_load_stackoverflow) * | 1986-08-06 | 1991-02-07 | ||
JP6487626B2 (ja) * | 2014-03-24 | 2019-03-20 | スタンレー電気株式会社 | 半導体装置 |
-
1978
- 1978-07-14 JP JP9750178U patent/JPS5824455Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5514746U (enrdf_load_stackoverflow) | 1980-01-30 |
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