JPS58218369A - ろう付装置 - Google Patents

ろう付装置

Info

Publication number
JPS58218369A
JPS58218369A JP10163982A JP10163982A JPS58218369A JP S58218369 A JPS58218369 A JP S58218369A JP 10163982 A JP10163982 A JP 10163982A JP 10163982 A JP10163982 A JP 10163982A JP S58218369 A JPS58218369 A JP S58218369A
Authority
JP
Japan
Prior art keywords
brazing material
nozzle
brazing
tank
iron core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10163982A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160347B2 (enrdf_load_stackoverflow
Inventor
Shingo Harada
信吾 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd, Toshiba Seiki Co Ltd filed Critical Toshiba Corp
Priority to JP10163982A priority Critical patent/JPS58218369A/ja
Publication of JPS58218369A publication Critical patent/JPS58218369A/ja
Publication of JPH0160347B2 publication Critical patent/JPH0160347B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP10163982A 1982-06-14 1982-06-14 ろう付装置 Granted JPS58218369A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10163982A JPS58218369A (ja) 1982-06-14 1982-06-14 ろう付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10163982A JPS58218369A (ja) 1982-06-14 1982-06-14 ろう付装置

Publications (2)

Publication Number Publication Date
JPS58218369A true JPS58218369A (ja) 1983-12-19
JPH0160347B2 JPH0160347B2 (enrdf_load_stackoverflow) 1989-12-22

Family

ID=14305952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10163982A Granted JPS58218369A (ja) 1982-06-14 1982-06-14 ろう付装置

Country Status (1)

Country Link
JP (1) JPS58218369A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2611109A1 (fr) * 1987-02-12 1988-08-19 Outillages Scient Lab Installations de soudure automatique a l'etain

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042445U (enrdf_load_stackoverflow) * 1990-04-19 1992-01-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2611109A1 (fr) * 1987-02-12 1988-08-19 Outillages Scient Lab Installations de soudure automatique a l'etain

Also Published As

Publication number Publication date
JPH0160347B2 (enrdf_load_stackoverflow) 1989-12-22

Similar Documents

Publication Publication Date Title
US3705457A (en) Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
CN103786425B (zh) 粘性材料供给装置及粘性材料印刷装置
DE3300153A1 (de) Loetapparat
JPS58218369A (ja) ろう付装置
EP0159425B1 (en) Soldering apparatus
KR19990036242A (ko) 납땜장치
KR100504403B1 (ko) 납땜장치
US4545520A (en) Method and system for soldering insulation coated parts
JP3917665B2 (ja) ろう付け装置
JPH07504315A (ja) 非同期リニア電気モーター用誘電モジュールと，その製作方法
US4873938A (en) Soldering apparatus
JPS58218370A (ja) ろう付装置
EP0067939B1 (en) Soldering apparatus for printed circuit board
EP0109988A1 (en) Soldering apparatus
JPS595392B2 (ja) ろう付装置のろう材送りコイル機構
JPS58125896A (ja) 部品のリ−ド線を印刷回路板表面上の導体にハンダ付けする方法並びに装置
KR100504402B1 (ko) 납땜장치
JPH0360581B2 (enrdf_load_stackoverflow)
JP3175952B2 (ja) 電子部品用リ−ドの半田付け装置
JP3771676B2 (ja) 局所はんだ付け装置
EP0226650A1 (en) Lead wire soldering apparatus
JPS595393B2 (ja) ろう付装置のろう材受機構
JPH0231628B2 (enrdf_load_stackoverflow)
EP1402082B1 (en) Apparatus for vacuum vaporization
JPH0248119A (ja) ワイヤカット放電加工機における自動結線方法