JPS58218214A - Manufacture of chipped piezoelectric oscillation parts - Google Patents
Manufacture of chipped piezoelectric oscillation partsInfo
- Publication number
- JPS58218214A JPS58218214A JP9763583A JP9763583A JPS58218214A JP S58218214 A JPS58218214 A JP S58218214A JP 9763583 A JP9763583 A JP 9763583A JP 9763583 A JP9763583 A JP 9763583A JP S58218214 A JPS58218214 A JP S58218214A
- Authority
- JP
- Japan
- Prior art keywords
- case
- piezoelectric
- conductive
- piezoelectric resonator
- metallic terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 230000010355 oscillation Effects 0.000 title abstract 3
- 238000000034 method Methods 0.000 claims description 7
- 239000003973 paint Substances 0.000 abstract description 14
- 239000002184 metal Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、チップ状圧電振動部品の製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a chip-shaped piezoelectric vibrating component.
第１Ａ図ａ３よび第１Ｂ図は従来の圧電振動部品の一例
を示す図である。まず、第１Ａ図に示すように、プリン
ト配線１および２が施されたプリント基板３上には、導
電ペイント４および５によって、圧電共振子６が接着固
定される。この圧電共振子６は矩形状圧電基板の両面に
対向電極を設けたいわゆる厚み滑り振動共振子である。FIG. 1A a3 and FIG. 1B are views showing an example of a conventional piezoelectric vibrating component. First, as shown in FIG. 1A, a piezoelectric resonator 6 is adhesively fixed onto a printed circuit board 3 on which printed wirings 1 and 2 are formed using conductive paints 4 and 5. As shown in FIG. This piezoelectric resonator 6 is a so-called thickness-shear vibration resonator in which opposing electrodes are provided on both sides of a rectangular piezoelectric substrate.
そして、その一方電極（図示では圧電共振子６の裏側に
形成されているため示されていない）は導電ペイント４
によってプリント配線１と電気的に接続される。また、
使方電極７は導電ペイント５によつＣプリント配線２と
電気的に接続される。さらに、プリント配ＩＩＩには、
はんだ８によってリード線９が導電的に固定される。ま
た、プリント配線２には、はんだ１０によってリード線
１１が導電的に固定される。The one electrode (not shown in the figure because it is formed on the back side of the piezoelectric resonator 6) is connected to the conductive paint 4.
It is electrically connected to the printed wiring 1 by. Also,
The used electrode 7 is electrically connected to the C printed wiring 2 through the conductive paint 5. Furthermore, in Print Arrangement III,
A lead wire 9 is conductively fixed by the solder 8. Furthermore, a lead wire 11 is electrically conductively fixed to the printed wiring 2 by solder 10 .
上述のプリント基板３には、その圧電共振子６を覆うよ
うに空洞形成キャップ１２が被せられ、さらにその上か
ら樹脂１３がディップされる。第１Ｂ図はイのように樹
脂ディップされたものを承り断面図ぐある。A cavity-forming cap 12 is placed on the above-mentioned printed circuit board 3 so as to cover the piezoelectric resonator 6, and a resin 13 is further dipped thereon. Figure 1B is a cross-sectional view of the resin-dipped product as shown in A.
ところで、第１Ａ図および第１Ｂ図に示すような圧電振
動部品では、以下述べるような欠点があった。すなわら
、部品点数が多いためコストが高くなるとともに、製造
工程が複雑となる。また、導電ペイント４および５やは
んだ８および１０による接続点が多いため信頼性が劣る
。さらに、樹脂ディップによって外装されている！こめ
部品ごとの外形状のばらつきが大きい。By the way, the piezoelectric vibrating components shown in FIGS. 1A and 1B have the following drawbacks. In other words, the large number of parts increases costs and complicates the manufacturing process. Further, since there are many connection points using conductive paints 4 and 5 and solders 8 and 10, reliability is poor. Furthermore, it is coated with resin dip! There are large variations in the external shape of each part.
第２Ａ図および第２Ｂ図は従来の圧電振動部品の伯の例
を示す図である。第２Ａ図および第２Ｂ図に示す圧電部
品では、モールドケース１４の内部に圧電共振子６が収
納さｉシる。すなわち、リード線１５および１６がモー
ルドケース１４の底面に貫通形成され、このリード線１
５に圧電共振子□
６の一方電極がはんだ付けされ、リード線１６に圧電共
振子６の使方電極がはんだ付けされる。そのために、リ
ード線１５および１６はモールドケース１４の幅方向に
段違いに貫通形成されている。FIGS. 2A and 2B are diagrams showing examples of conventional piezoelectric vibrating components. In the piezoelectric component shown in FIGS. 2A and 2B, a piezoelectric resonator 6 is housed inside a molded case 14. That is, lead wires 15 and 16 are formed through the bottom of the mold case 14, and the lead wires 15 and 16 are formed through the bottom surface of the mold case 14.
One electrode of the piezoelectric resonator □ 6 is soldered to 5, and the electrode for use of the piezoelectric resonator 6 is soldered to the lead wire 16. For this purpose, the lead wires 15 and 16 are formed to penetrate through the mold case 14 in different steps in the width direction.
さらに、モールドケース１４には、蓋１７が被せられ封
止される。Furthermore, the mold case 14 is covered with a lid 17 and sealed.
ところで、第２Ａ図および第２Ｂ図に示づような圧電振
動部品は以下に述べるような欠点があった。すなわち、
モールドケース１４およびＭ１７が高価であるため全体
的なコストが高くなってしまう。また、圧電共振子６を
はんだ付けによってリード線１５および１６に取付けで
いるため、工程が複雑になり、組立の自動化の妨げとな
っていた。さらに、外形状が大きくなってしまうという
欠点があった。By the way, the piezoelectric vibrating component shown in FIGS. 2A and 2B has the following drawbacks. That is,
Since the molded case 14 and M17 are expensive, the overall cost increases. Furthermore, since the piezoelectric resonator 6 is attached to the lead wires 15 and 16 by soldering, the process becomes complicated, which hinders automation of assembly. Furthermore, there was a drawback that the outer shape became large.
それゆえに、この発明の主たる目的は、上述のような種
々の欠点を解消し得る圧電振動部品の製造方法を提供ず
乞ことである。Therefore, the main object of the present invention is to provide a method for manufacturing a piezoelectric vibrating component that can overcome the various drawbacks mentioned above.
１
この発明は、要約すれば、両端部に開口が形成された筒
状のケ社１スの一端に、導電線接合部材を：。1 To summarize, the present invention includes: A conductive wire joining member is attached to one end of a cylindrical case having openings formed at both ends.
付着させた導電梯・□端子を装着し、ケース内に圧電ｊ
１゜
素子を収納したのちケースの他端に、導電性接合部材を
ｆり着させた導電性端子を装着しＣ１圧電素子の両端に
引出されたとりつけ電極と導電性端子を導電性接合部材
で電気的に導通させるとともに機械的に固定することで
ある。Attach the attached conductive ladder and □ terminal, and place the piezoelectric j in the case.
1゜After storing the element, attach a conductive terminal with a conductive bonding member attached to the other end of the case, and connect the mounting electrodes and the conductive terminal drawn out to both ends of the C1 piezoelectric element with the conductive bonding member. It is to provide electrical continuity and mechanical fixation.
この発明の上述の目的およびその他の目的と特徴は、図
面を参照して行なう以下の詳細な説明から一層明らかと
なろう。The above objects and other objects and features of the present invention will become more apparent from the following detailed description with reference to the drawings.
第３図は以下に説明する実施例に…いられる圧電共振子
の一例を示す斜視図である。この圧電共振子３０は矩形
状の圧電基板３１の一方面に電極３２が形成され他方面
に電極３３が形成されて構成される。すなわち、この圧
電共振子３０はいわゆるエネルギーとじこめ型厚みすべ
り振動共振子である。なお、この発明では他の振動モー
ドを有する圧電共振子を用いることもできる。FIG. 3 is a perspective view showing an example of a piezoelectric resonator that can be used in the embodiments described below. This piezoelectric resonator 30 is constructed by forming an electrode 32 on one side of a rectangular piezoelectric substrate 31 and forming an electrode 33 on the other side. That is, this piezoelectric resonator 30 is a so-called energy confinement type thickness-shear vibration resonator. Note that in the present invention, piezoelectric resonators having other vibration modes can also be used.
第４Ａ図はこの発明の一実施例で得られたチップ状圧電
振動部品４０を示す断面図である。また、第４Ｂ図は第
４Ａ図において点線で囲んだ部分４ ・１の拡大図であ
る。図において、この圧電振動部品４０はその内部に圧
電共振子３０が収納される筒状のケース４２を含む。こ
のケース４２は第５Ｄ図に示されるように、その外周形
状が長方形となっている。ま／ｊ ケース４２はその
両端部が開口される。ケース４２の一端の開口部には金
属端子４３が装着される。また、ケース４２の他端の開
口部には金属端子４４が装着される。なお、ケース４２
の両端部の内周面には金属端子４３および４４を受入れ
る段部４５が形成されでいる。一方、金属端子４３およ
び４４には、それぞれ、その外周がケース４２の外周と
等しくされ／ｊつば状部４’３ ａおよび４４ａが形成
される。したがって、金属端子４３および４４をケース
４２に装着すると、第５Ｄ図に示すようにその両端部に
つば状部４３ａＪ３よび４４ａが露出した長方形の角柱
となる。FIG. 4A is a sectional view showing a chip-shaped piezoelectric vibrating component 40 obtained in one embodiment of the present invention. Further, FIG. 4B is an enlarged view of the portion 4.1 surrounded by a dotted line in FIG. 4A. In the figure, this piezoelectric vibrating component 40 includes a cylindrical case 42 in which the piezoelectric resonator 30 is housed. As shown in FIG. 5D, this case 42 has a rectangular outer circumferential shape. The case 42 is open at both ends. A metal terminal 43 is attached to an opening at one end of the case 42 . Further, a metal terminal 44 is attached to the opening at the other end of the case 42 . In addition, case 42
Step portions 45 for receiving metal terminals 43 and 44 are formed on the inner circumferential surface of both ends. On the other hand, the metal terminals 43 and 44 are formed with flange-shaped portions 4'3a and 44a whose outer peripheries are equal to the outer periphery of the case 42, respectively. Therefore, when the metal terminals 43 and 44 are attached to the case 42, they become rectangular prisms with flanged portions 43aJ3 and 44a exposed at both ends, as shown in FIG. 5D.
さらに、金属端子４３および４４には、それぞれケース
４２に装着したとき圧電共振子３０の幅方向に沿う条溝
４３ｂおよび４４ｂが形成される。Furthermore, grooves 43b and 44b are formed in the metal terminals 43 and 44, respectively, so that the metal terminals 43 and 44 extend along the width direction of the piezoelectric resonator 30 when attached to the case 42.
この条溝４３ｂおよび４４ｂは圧電共振子３０の端部を
支持するためのもので・あり、たとえ、ば断面「り」字
状の溝が形成される。These grooves 43b and 44b are for supporting the ends of the piezoelectric resonator 30, and are formed into, for example, grooves having a square cross section.
さらに、金属端子４３とケース４２および圧電共振子３
０との間、金属端子４４とケース４２および圧電共振子
３０との間には、導電性ペイント４７が介挿される。こ
の導電性ペイント４７によつＣ１金属端子４３と圧電共
振子３０の電極３３との電気的接続が図られる。また、
金属端子４４ど圧電共振子３０の電極３２との電気的接
続が図られる。さらに、圧電共振子３０の保持が確実な
ものとされる。さらに、ケース４２の封止が図られる。Furthermore, the metal terminal 43, the case 42, and the piezoelectric resonator 3
0, and between the metal terminal 44, the case 42, and the piezoelectric resonator 30, a conductive paint 47 is inserted. This conductive paint 47 establishes an electrical connection between the C1 metal terminal 43 and the electrode 33 of the piezoelectric resonator 30. Also,
The metal terminal 44 is electrically connected to the electrode 32 of the piezoelectric resonator 30. Furthermore, the piezoelectric resonator 30 can be held securely. Furthermore, the case 42 is sealed.
なお、導電性接合部材としては、導電ペイント以外には
んだペーストなどを用いてもよい。Note that as the conductive bonding member, solder paste or the like may be used instead of conductive paint.
づなわち、好ましくは常温において流動体であり加熱処
理によって硬化づるような導電性化学材料が用いられる
。That is, it is preferable to use a conductive chemical material that is fluid at room temperature and hardens by heat treatment.
第５八図ないし第５Ｄ図は第４Ａ図および第４′１１′
＼
Ｂ図に示すものの製造工稈雫実施例を説明するた男
めの図である。以下、こ？、 ５ Ａ図ないし第５Ｄ図
に冶って実施例の製造 について説明する。Figures 58 to 5D are Figures 4A and 4'11'
＼ This is a male diagram illustrating an embodiment of the manufacturing process shown in Figure B. Below is this? , 5A to 5D, manufacturing of the embodiment will be explained.
、３ ′
まず、第５Ａ図に示すよう゛に、金属端子４３に導電性
ペイント４７が塗布される。次に、第５Ｂ図に示すよう
に、金′属端子４３がケース４２の一端開口部に装着さ
れる。続いて、第５Ｃ図に示Ｊように、ケース４２の他
端開口部から圧電共振子３０が挿入される。この圧電共
振子３０は金属端子４３の条溝４３ｂに当接される。こ
の条溝４３ｂには導電性ペイント４７が塗布されている
ため、圧電共振子３０の電極３３と金属端子４３とが電
気的に接続される。, 3' First, as shown in FIG. 5A, a conductive paint 47 is applied to the metal terminal 43. Next, as shown in FIG. 5B, a metal terminal 43 is attached to an opening at one end of the case 42. Subsequently, as shown in FIG. 5C, the piezoelectric resonator 30 is inserted through the opening at the other end of the case 42. This piezoelectric resonator 30 is brought into contact with the groove 43b of the metal terminal 43. Since the groove 43b is coated with conductive paint 47, the electrode 33 of the piezoelectric resonator 30 and the metal terminal 43 are electrically connected.
次に、図示していないが、金属端子４４に導電性ペイン
ト４７が塗布され、ケース４２の他端間口部に装着され
る。これによって、圧電共振子３０の電極３２と金属端
子４４とが電気的に接続される。また、圧電共振子３０
が固定保持される。Next, although not shown, conductive paint 47 is applied to the metal terminal 44, and the metal terminal 44 is attached to the other end of the case 42. Thereby, the electrode 32 of the piezoelectric resonator 30 and the metal terminal 44 are electrically connected. In addition, the piezoelectric resonator 30
is held fixed.
このようにして、第５Ｄ図に示すようなチップ化された
圧電振動部品４０が得られる。In this way, a chipped piezoelectric vibrating component 40 as shown in FIG. 5D is obtained.
第５Ｄ図にシ：、−ようなチップ状の圧電振動部品４０
を他の回路１実装する場合、たとえばプリント基板上に
直接ｉんだなど家導電的に接着固定さ□
れるｄ
以上のごとく、上述の実施例製造方法では圧電撮動部品
の組立に際し従来のようにはんだ付けなどの面倒な工程
を必要としないため、組立の機械化が図れるとと・ｂに
、生産期間を著しく短縮することができる。また、従来
に比べて部品点数が少ないためコストを低減することが
できる。さらに、チップ化によって外形状の統一を図る
ことができるとともに、信頼性の向上を図ることができ
る。In FIG. 5D, a chip-shaped piezoelectric vibrating component 40 such as
When mounting another circuit 1, for example, it is fixed by conductive adhesive, such as directly on a printed circuit board.As described above, in the manufacturing method of the embodiment described above, when assembling piezoelectric moving parts, the conventional method is not used. Since there is no need for troublesome processes such as soldering, assembly can be mechanized and the production period can be significantly shortened. Furthermore, since the number of parts is smaller than in the past, costs can be reduced. Furthermore, by making it into a chip, it is possible to unify the external shape and improve reliability.
また、従来に比べて外形状の小形化を図ることかできる
。Furthermore, the outer shape can be made smaller than in the past.
実験によれば、たとえば第１Ｂ図に示すような従来の圧
電振動部品に比べてこの発明の一実施例で得たものは、
その体積を約１ ／ ３０にＪることができた。また、
第２Ｂ図に示すような従来の圧電振動部品に比べてその
体積を約１／４０にすることができた。According to experiments, compared to a conventional piezoelectric vibrating component as shown in FIG. 1B, an embodiment of the present invention has a
We were able to reduce its volume to about 1/30. Also,
The volume can be reduced to about 1/40 of that of a conventional piezoelectric vibrating component as shown in FIG. 2B.
以上のように、この発明によれば、圧電振動部品をチッ
プ化できるので、従来に比べてコストの低減を図ること
ができるとともに、生産期゛間を短縮することができる
。また、信頼性を向上さゼることができるとともに、小
形化によって他の回路への実装を容易とすることができ
る。As described above, according to the present invention, the piezoelectric vibrating component can be made into a chip, so that the cost can be reduced compared to the conventional method, and the production period can be shortened. In addition, reliability can be improved, and the size can be reduced, making it easier to implement in other circuits.
なお、ケース４２、金属端子４３および４４を横断面円
状にし′Ｃもよい。また、金属端子４３．４４の形状は
上述の例のものでなく、たとえば円筒状ヒユーズなどに
用いられているようなカップ状のものでもよい７゜
１Note that the case 42 and the metal terminals 43 and 44 may also be made circular in cross section. Further, the shape of the metal terminals 43 and 44 is not limited to the above-mentioned example, but may be a cup-like shape such as that used in a cylindrical fuse.
1
第１Ａ図および第１Ｂ図は従来の圧電振動部品の一例を
示１図Ｃ゛ある。第２Δ図および第２Ｂ図は従来の圧電
振動部品の他の例を示１図である。
第３図はこの発明の一実施例に用いられる几電共振子の
一例を示す図である。第４Ａ図および第４Ｂ図はこの発
明の一実施例で得たチップ状圧電振動部品を示Ｊ断面図
である。第５八図ないし第５Ｄ図はこの発明の一実施例
の製造工程を説明するための図である。
図において３０は圧電共振子、４２はケース、４３およ
び４４は金属端子、４７は導電ペイントを示す。
特 許 出 願 人
株式会社村田製作所1A and 1B show an example of a conventional piezoelectric vibrating component, and FIG. 1C shows an example of the conventional piezoelectric vibrating component. FIG. 2Δ and FIG. 2B are views showing other examples of conventional piezoelectric vibrating components. FIG. 3 is a diagram showing an example of a phosphor resonator used in an embodiment of the present invention. FIGS. 4A and 4B are J cross-sectional views showing a chip-shaped piezoelectric vibrating component obtained in an embodiment of the present invention. FIGS. 58 to 5D are diagrams for explaining the manufacturing process of an embodiment of the present invention. In the figure, 30 is a piezoelectric resonator, 42 is a case, 43 and 44 are metal terminals, and 47 is a conductive paint. Patent applicant Murata Manufacturing Co., Ltd.
Claims (1)
状のケース、 前記両開１］に装着される導電性端子、および前記導電
性端子と前記圧電素子とを導電的に接合させる導電性接
合部−材を備える、チップ状圧電振動部品の製造方法で
あって、導電性端子に導電性接合部材を付着させ、導電
性接合部材を付着させた導電性端子でケースの一端開口
を塞ぎ、ケース内に圧電素子を収納して導電性端子と導
通させ、いま一つの導電性端子に導電性接合部材を付着
させ、この導電性端子でケースの細端開口を塞いで圧電
素子と導通させたことを特徴とづる、チップ状圧電振動
部品の製造方法。[Scope of Claims] A piezoelectric element, a cylindrical case in which the piezoelectric element is housed and has openings at both ends, a conductive terminal attached to the double opening 1, and a conductive terminal and the piezoelectric A method for manufacturing a chip-shaped piezoelectric vibrating component, which includes a conductive joint member for conductively joining an element, the method comprising: attaching a conductive joint member to a conductive terminal; One end of the opening of the case is closed with a conductive terminal, a piezoelectric element is housed in the case and electrically connected to the conductive terminal, a conductive bonding member is attached to the other conductive terminal, and this conductive terminal is used to close the narrow end of the case. A method for manufacturing a chip-shaped piezoelectric vibrating component, characterized in that the opening is closed to establish electrical conduction with a piezoelectric element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9763583A JPS58218214A (en) | 1983-05-31 | 1983-05-31 | Manufacture of chipped piezoelectric oscillation parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9763583A JPS58218214A (en) | 1983-05-31 | 1983-05-31 | Manufacture of chipped piezoelectric oscillation parts |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6138483A Division JPS58212219A (en) | 1983-04-07 | 1983-04-07 | Chip-shaped piezoelectric oscillating component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218214A true JPS58218214A (en) | 1983-12-19 |
| JPH0244411B2 JPH0244411B2 (en) | 1990-10-03 |
Family
ID=14197605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9763583A Granted JPS58218214A (en) | 1983-05-31 | 1983-05-31 | Manufacture of chipped piezoelectric oscillation parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218214A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436523A (en) * | 1992-11-06 | 1995-07-25 | Avance Technology | High frequency crystal resonator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52119371U (en) * | 1976-03-09 | 1977-09-09 | ||
| JPS5619466U (en) * | 1979-07-23 | 1981-02-20 | ||
| JPS5648120U (en) * | 1979-09-20 | 1981-04-28 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5470818A (en) * | 1977-11-16 | 1979-06-07 | Matsushita Electric Ind Co Ltd | Production of speaker diaphragm |
-
1983
- 1983-05-31 JP JP9763583A patent/JPS58218214A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52119371U (en) * | 1976-03-09 | 1977-09-09 | ||
| JPS5619466U (en) * | 1979-07-23 | 1981-02-20 | ||
| JPS5648120U (en) * | 1979-09-20 | 1981-04-28 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5436523A (en) * | 1992-11-06 | 1995-07-25 | Avance Technology | High frequency crystal resonator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0244411B2 (en) | 1990-10-03 |
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