JP2506028Y2 - Lumped constant type high frequency components - Google Patents

Description

TECHNICAL FIELD The present invention relates to a lumped constant type high frequency component.

2. Description of the Related Art One example of a conventional lumped constant type high frequency component is shown in a perspective view in FIG. 9 of the accompanying drawings. FIG. 9 shows a state in which the metal cover is removed. As shown in FIG. 9, this conventional lumped constant type high frequency component has a metal plate 10 having a plurality of through holes 11 and a through hole. Hole 11
And a plurality of lead terminals 20 that are insulated and fixed to the metal plate 10 by using a hermetic seal glass 12 at each through hole 11 so as to pass through. A diode 40, which is a circuit component, is fixedly arranged with an adhesive 51 at approximately the center of the metal plate 10, and is placed on the metal plate 10 on both sides of the diode 40 and between the lead terminal rows. , And ferrite cores 30, which are different circuit components, are arranged. Terminals of these diodes 40 and each lead terminal 20
The electrical connection between the upper end of the and the lead wire 31 of the ferrite core 30 is made by soldering 41 and 52. In order to establish the ground, in this conventional example, the lead terminal 20 at the corner (upper left corner in FIG. 9) of the metal plate 10 is used.
Bend the upper end of the and solder it onto the metal plate 53
are doing. Finally, a metal cover (not shown) is put on the metal plate 10, and the peripheral side surface of the metal plate 10 and the inner peripheral wall of the lower end of the metal cover are soldered to make a sealing connection.

Further, FIG. 10 shows another example of the conventional lumped constant type high frequency component in a perspective view similar to FIG. Since the structure of this conventional example is largely the same as that described with reference to FIG. 9, the same parts will not be described repeatedly. In this conventional example, instead of bending and soldering the upper ends of the lead terminals at the corners as in the conventional example of FIG. The lead terminal 20 in the upper left corner of the figure) is brazed at the through hole.

Problems to be Solved by the Invention In the configuration of the conventional example described above with reference to FIG. 9, in order to ground the case, the lead terminals must be bent and then soldered one by one to the metal plate. It was troublesome and took a long time to assemble. Moreover, since the diode and the ferrite core, which are circuit components, are arranged on the same level on the metal plate, the space factor is inevitably deteriorated, which hinders the miniaturization of the entire component. Furthermore, the electrical connection between the diode, which is a circuit component, and the ferrite core simply depends on the lead wire, and therefore, it cannot be said to be sufficient in terms of high frequency characteristics. In addition, since the sealing connection between the metal plate 10 and the metal cover is also made by soldering in a state where the side surfaces are aligned with each other, it is difficult to align the both sides, and the work is correspondingly troublesome.

In the conventional structure described above with reference to FIG. 10, it is not necessary to bend the upper end of the lead terminal for soldering for grounding, but only one lead terminal will be a metal plate. In order to manufacture a hermetic seal part in which the other lead terminals are fixed to the through holes with hermetic glass, a dedicated mold is required, which is inevitably expensive.

An object of the present invention is to provide a lumped constant type high frequency component capable of solving the above-mentioned conventional problems.

Means for Solving the Problems A lumped constant type high frequency component according to the present invention uses a metal plate having a plurality of through holes, and a metal plate that allows each of the through holes to pass through and uses a hermetically sealed glass at each of the through holes. A plurality of lead terminals insulated and fixed to the plate, and a plurality of through holes, the upper end of each of the lead terminals protruding above the metal plate is passed through the through holes, A dielectric plate mounted on the metal plate, a plurality of circuit components, and a metal cover sealingly connected to the metal plate so as to cover the circuit components arranged on the metal plate. The dielectric plate has a notch in at least one corner and has at least one element mounting hole in a substantially central portion, and the rear surface of the dielectric plate has the at least one corner. Other than the through hole adjacent to A ground conductor is provided on the entire surface except the peripheral portion of the through hole, and a connecting conductor is provided on the peripheral portion of the through hole on the surface of the dielectric plate and to the peripheral portion of the element mounting hole. An extending microstrip line conductor is provided, and the connecting conductor provided in the peripheral portion of the through hole adjacent to the at least one corner extends to the cutout at the corner and is provided on the side surface of the cutout. Is electrically connected to the ground conductor on the back surface of the dielectric plate by at least one connecting conductor, and at least one of the plurality of circuit component elements is embedded in the element mounting hole of the dielectric plate. The other circuit component is arranged on the dielectric plate so as to at least partially overlap the at least one circuit component embedded in the element mounting hole, and the at least one circuit component The lead terminal, which is passed through the through hole adjacent to one of the corners, has its upper end soldered to the connecting conductor provided in the peripheral portion of the through hole, and is soldered to the metal plate at a notch. The connection is made into a ground connection terminal, and the electrical connection between each of the lead terminals and each of the circuit components and the electrical connection between each of the circuit components are performed by the connection conductor or the microstrip. It is characterized in that it is performed by soldering connection to the line conductor.

Embodiments Next, the present invention will be described in more detail with reference to the accompanying drawings, in particular, with reference to FIGS. 1 to 8.

FIG. 1 is a perspective view showing an assembled state of a lumped constant type high frequency component as one embodiment of the present invention, excluding its metal cover, and FIG. 2 is a lumped constant type high frequency component shown in FIG. FIG. 3 is an exploded perspective view showing a disassembled component array showing a metal plate to which lead terminals constituting the component are assembled, and the electric plate, and FIG. 3 is a perspective view of the dielectric plate shown in FIG. Is. To explain the configuration of the lumped constant type high frequency component shown in FIG. 1, first, as shown in FIG.
For each metal plate 60 having a plurality of through holes 64, each through hole 64
The hermetically sealed component is configured so that each of the lead terminals 20 is insulated and fixed by using the hermetically sealed glass 65 at each through hole 64. A flange portion 61 having a projection 63 used for the purpose described later is provided on the outer periphery of the metal plate 60, and the inside of the flange portion 61 of the metal plate 60 facilitates positioning of the metal cover described later. It is slightly thickened to give a step 62 to

According to the present invention, the lumped-constant type high frequency component of this embodiment is a dielectric plate as well shown in FIGS. 2 and 3.
With 70. The dielectric plate 70 has the through holes 64 of the metal plate 60.
It has a plurality of through holes 71 at positions corresponding to. Further, the dielectric plate 70 has a notch 73 at one corner (upper left corner in FIG. 2) and one circular element disposition hole 72 at substantially the center. As shown in FIG. 3, a ground conductor 78 is provided on the entire back surface of the dielectric plate 70 except for the peripheral portion of the through hole 71 other than the through hole adjacent to the corner where the cutout 73 is provided. Has been. On the surface of the dielectric plate 70,
As well shown in FIG. 2, connecting conductors 74 and 75 are provided in the peripheral portion of each through hole 71, and a pair of parallel microstrip line conductors 77 extending to the peripheral portion of the element mounting hole 72. Is provided. The connecting conductor 75 provided in the peripheral portion of the through hole 71 adjacent to the corner portion where the notch 73 is formed extends to the notch 73 at the corner portion and is provided on the side surface of the notch 73 for connection. The conductor 76 (see FIG. 3) is electrically connected to the ground conductor 78 on the back surface of the dielectric plate 70.

Next, the procedure for assembling such a lumped constant type high frequency component will be described in detail. First, from the relationship shown in FIG. 2, the dielectric plate 70 is mounted on the metal plate 60 so that the upper ends of the lead terminals 20 protruding above the metal plate 60 are passed through the through holes 71. Place. Next, as shown in FIG. 1, a dielectric plate
A diode 40, which is one of the circuit constituent elements, is embedded in the element mounting hole 72 of 70, each terminal of the diode 40 is soldered 41 to the extension of the microstrip line conductor 77, and at the same time, the dielectric plate. Soldering 55 is performed between the connecting conductor 75 and the connecting conductor 76 at the corner of the notch 73 of the 70 and the upper surface of the metal plate 60 by soldering. FIG. 4 is an enlarged partial plan view showing in detail the soldering state of the corners.

The reason why the soldering is performed at the corners in this manner is to use the lead terminals 20 arranged in the through holes 71 at the corners as the ground connection terminals, and the connection conductors 75 to the metal plate 60. This is because it is connected to the ground. As described above, the ground conductor 78 is provided on the back surface of the dielectric plate 70. Therefore, it may be considered that the ground connection can be performed only by placing the dielectric plate 70 on the metal plate 60. Absent. However, in the process of forming a hermetic seal part composed of the metal plate 60 and the lead terminal 20 as shown in FIG. 2, the hermetic seal glass 65 filled in each through hole 64 is inevitable.
Since the metal plate 60 slightly protrudes from the surface of the metal plate 60, it is not possible to sufficiently achieve the ground connection only by placing the dielectric plate 70 on the metal plate 60.

Next, two ferrite cores 30, which are other circuit components, are placed on the dielectric plate 70 as shown in FIG.
At least a part of the lead wire 31 is arranged so that it overlaps with the diode 40 embedded in the element mounting hole 72, and those lead wires 31 are arranged at the upper end of the corresponding lead terminal 20 and the connection adjacent thereto. The conductors 74, 75, the microstrip line conductor 77, etc. are soldered 56 to be connected. FIG. 1 shows such an assembled state.

Finally, as shown in the partially enlarged sectional view of FIG.
After applying the resin 90 so as to cover the upper ends of the ferrite core 30 and the diode 40 and the soldered lead terminals 20 assembled as shown in the figure, the metal cover 80 is
Cover the metal plate 60. At this time, the flange portion 81 provided at the lower end portion of the metal cover 80 rides on the projection 63 of the flange portion 61 of the metal plate 60. As shown schematically in FIG. 6, the combination in this state is placed between a pair of copper-made sealing jigs 103 and 104 in an inert gas, and they are placed in a pair of electrodes 101. And 102. Then, resistance welding is performed by applying an electric current as shown by an arrow C while applying a pressure as shown by an arrow P. In this way, when a current is applied while applying pressure between the metal plate 60 and the metal cover 80, the projection
Since the resistance of the contact portion between 63 and the flange portion 81 of the metal cover 80 is large, heat is generated and the projection 63 is melted.
The metal cover 80 and the metal plate 60 are welded to each other via a welded portion as indicated by reference numeral 63A in the figure. FIG.
The external appearance of the lumped constant type high frequency component thus assembled is shown.

Effect of the Invention Since the lumped constant type high frequency component of the present invention has the above-described configuration, the following effects can be obtained.

(1) Since the lead terminal can be used as the ground connection terminal only by soldering the connecting conductor and the connecting conductor at the corners of the dielectric plate to the metal plate, the work for grounding can be performed. Very easy. Moreover, this can ensure stable high-frequency performance.

(2) Since the circuit constituent element can be embedded and arranged in the element mounting hole provided in the dielectric plate, other circuit constituent elements can be arranged on the circuit constituent element, so that high-density mounting is possible, and only that part The overall size can be reduced.

(3) Since the electrical connection between the circuit constituent elements can be performed by using the microstrip line conductor provided on the dielectric plate, the high frequency characteristics of the circuit can be improved. Further, it becomes easier to pull out the lead wire and solder the dielectric plate.

(4) Since the ground can be taken from the conductor pattern of the dielectric plate to the case, the ground terminal can be arbitrarily selected by the circuit only by making the hermetic seal component common and changing the pattern.

(5) Even if there are a plurality of ground terminals in the circuit configuration, if the through hole of the dielectric plate is soldered as the ground terminal connecting conductor, the connecting conductor and the connecting conductor at one corner will be a metal plate. Just solder it to the conductor.

(6) Since the sealing connection between the metal plate and the metal cover is performed by resistance welding while being positioned by the flange portion and the step portion of the metal plate and the inner peripheral wall and the flange portion of the lower end portion of the metal cover. It can be done very easily and precisely.

(7) Static electricity can be prevented by short-circuiting the lead terminal of the hermetically sealed component and the metal plate and covering the metal plate.

(8) By hermetically sealing the hermetically sealed component and the metal cover by resistance welding, the outside air and moisture can be more completely prevented.

[Brief description of drawings]

FIG. 1 is a perspective view showing an assembled state of a lumped constant type high frequency component as one embodiment of the present invention, excluding its metal cover, and FIG. 2 constitutes the lumped constant type high frequency component shown in FIG. FIG. 3 is a perspective view showing the disassembled parts array showing the metal plate to which the lead terminals are assembled and the dielectric plate, FIG. 3 is a perspective view of the dielectric plate shown in FIG. FIG. 5 is an enlarged partial plan view showing in detail the soldering condition at the corners of the dielectric plate with respect to the metal plate in the lumped constant type high frequency component of FIG. 1, and FIG. 5 is a metal plate and metal of the lumped constant type high frequency component of FIG. FIG. 6 is a partially enlarged cross-sectional view showing a state before resistance welding and sealing with a cover, FIG. 6 is a schematic diagram for explaining a method of resistance welding and sealing, and FIG. FIG. 8 is a partially enlarged sectional view showing a state where welding and sealing are completed.
FIG. 1 is a perspective view showing an appearance of the lumped constant type high frequency component after assembly is completed, FIG. 9 is a schematic perspective view showing an example of a conventional lumped constant type high frequency component, and FIG. 10 is a conventional lumped constant type high frequency component. It is a schematic perspective view which shows another example of a high frequency component. 20 …… Lead terminal, 30 …… Ferrite core, 31 …… Lead wire, 40 …… Diode, 41,55,56 …… Soldering,
60 …… Metal plate, 61 …… Flange part, 62 …… Step part, 63 ……
Projection, 63A ... Welded portion, 64 ... Through hole, 65
…… Hermetically sealed glass, 70 …… Dielectric plate, 71…
… Through hole, 72 …… Element mounting hole, 73 …… Notch, 74,75…
… Connecting conductor, 76 …… Coupling conductor, 77 …… Microstrip line conductor, 78 …… Ground conductor, 80 …… Metal cover, 81 …… Flange part, 101,102 …… Electrode, 103,104…
… Jig for sealing.

Claims (3)

(57) [Scope of utility model registration request] 1. A metal plate having a plurality of through-holes, and a plurality of lead terminals that are insulated from and fixed to the metal plate by using the hermetic seal glass so as to pass through the through-holes and at each of the through-holes. A dielectric plate that is placed on the metal plate such that the upper end portions of the lead terminals that have a plurality of through holes and project above the metal plate are passed through the through holes. And a metal cover sealingly connected to the metal plate so as to cover the circuit component arranged on the metal plate, and the dielectric plate is at least 1 One corner is provided with a notch and at least one element-arranging hole is provided substantially in the center, and the back surface of the dielectric plate is provided with the above-mentioned other than the through hole adjacent to the at least one corner. Ground conductor over the entire surface except the peripheral part of the through hole It is provided, on the surface of the dielectric plate, a conductor for connection is provided in the peripheral portion of the through hole, and a microstrip line conductor that extends to the peripheral portion of the element mounting hole is provided, At least 1
The connecting conductor provided in the peripheral portion of the through hole adjacent to one of the corners extends to the notch of the corner and is provided with the connecting conductor provided on the side surface of the notch on the back surface of the dielectric plate. Is electrically connected to the ground conductor, at least one of the plurality of circuit components is embedded in the element mounting hole of the dielectric plate, and the other circuit component is Is disposed on the dielectric plate so as to at least partially overlap the at least one circuit component embedded in the element mounting hole,
The lead terminal, which is passed through the through hole adjacent to the at least one corner, has its upper end soldered to the connecting conductor provided in the peripheral portion of the through hole, and has the notch formed in the metal plate. And a grounding terminal by soldering with, and the electrical connection between each of the lead terminals and each of the circuit components and the electrical connection between each of the circuit components are the conductor for connection. Alternatively, a lumped constant type high frequency component characterized by being soldered to a microstrip line conductor. 2. A flange portion having a projection is provided on the outer periphery of the metal plate, and a flange portion corresponding to the flange portion of the metal plate is provided at the lower end of the metal cover, The metal cover is inactive in a state of covering the upper ends of the circuit component element and the lead terminal coated with the resin, and the flange portion of the metal cover overlapping the flange portion of the metal plate through the projection. The lumped constant type high frequency component according to claim 1, which is sealed and connected to the metal plate by performing resistance welding and sealing in gas. 3. The lumped constant type high frequency component according to claim 1, wherein the at least one circuit component is a diode and the other circuit component is a ferrite core.