JPS58217471A - Method of sintering ceramic electronic part - Google Patents

Method of sintering ceramic electronic part

Info

Publication number
JPS58217471A
JPS58217471A JP57100114A JP10011482A JPS58217471A JP S58217471 A JPS58217471 A JP S58217471A JP 57100114 A JP57100114 A JP 57100114A JP 10011482 A JP10011482 A JP 10011482A JP S58217471 A JPS58217471 A JP S58217471A
Authority
JP
Japan
Prior art keywords
sintered
sintering
molded bodies
varistor
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57100114A
Other languages
Japanese (ja)
Inventor
桃木 孝道
結城 経治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marcon Electronics Co Ltd
Original Assignee
Marcon Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marcon Electronics Co Ltd filed Critical Marcon Electronics Co Ltd
Priority to JP57100114A priority Critical patent/JPS58217471A/en
Publication of JPS58217471A publication Critical patent/JPS58217471A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はバリスタ.f−tスタ,感湿抵抗体。[Detailed description of the invention] The present invention is a barista. f-t star, moisture sensitive resistor.

セラミックコンデンサなどのセラミック電子部品のの焼
結方法に関する。
This invention relates to a method for sintering ceramic electronic components such as ceramic capacitors.

これまでセラミック電子部品の焼結方法は路材性を大き
く左右する要因として重要視されておシ一般には所整の
形状に成形したセラミック成形体をアルミナ.シリカな
どからなる胱結すヤに入れ該サヤと同材質からなる蓋を
して所龜の温度に保持したトンネル炉で数時間焼結して
いる。しかしながら焼結過程で焼結サヤと接触している
成形体が焼結サヤとの相互反応で成形体を構成する組成
が変質し成形体のもつ本来の特性を喪失してしまう問題
をかかえている。従来このような問題を解消するため焼
結サヤ内に成形体を配列する場合、第1図に示すように
焼結サヤ(1)内底に成形体(2)と比較的反応しない
材質からなる平板状の七ツタO)を敷き、該七ツタ(3
〕上に成形体(2) II数個を平面的に並べて焼結す
るか、第2図に示すように焼結サヤ(4)内に成形体(
5》と比較的近い組成物からなる粉末(6)を敷き、該
粉末(6)上に成形体(5)を複数個平面的に並べて焼
結するなどの方法がとられている。
Up until now, the sintering method for ceramic electronic components has been considered important as a factor that greatly affects road material properties.In general, ceramic molded bodies formed into a predetermined shape are made of alumina. The material is placed in a shell made of silica or the like, covered with a lid made of the same material as the shell, and sintered in a tunnel furnace maintained at a certain temperature for several hours. However, during the sintering process, the compact that is in contact with the sintered pod undergoes an interaction with the sintered pod, causing the composition of the compact to change in quality, causing the compact to lose its original properties. . Conventionally, when arranging compacts in a sintered pod to solve this problem, the inner bottom of the sintered pod (1) is made of a material that does not relatively react with the compact (2), as shown in Figure 1. Lay out a flat plate of seven ivy O) and place the seven ivy (3
] Either several molded bodies (2) II are arranged on a plane and sintered, or the molded bodies (2) are placed in a sintered sheath (4) as shown in Figure 2.
5) is spread, and a plurality of molded bodies (5) are arranged on the powder (6) in a plane and sintered.

しかしながら第1図に示すような方法の場合平板状のセ
ンタ(3)と接触する成形体(2)下′面が平板状のセ
ンタ(3)との相互反応で電極を形成する成形体シ〕表
面の特性が失われ本来の特性を発偉し得ない欠点をもっ
ておシ、また第2図に示すような方法の場合粉末(6)
が成形体(5)に喰い込んだり全表面に付智するため第
1図に示すような方法の場合と同様の欠点をもっていた
。・そのため第3図にボすように焼結サヤ(7〕内に成
形体(8〕と比較的反応しない材質からなる平板状のセ
ンタ(9)を敷き、該センタ(9)上に成形体(5)を
1!数個直立に並べて焼結する方法で両面の電極形成箇
所と前記平板上のセンタ(9)との相互反応を防止する
ようにすることも考えられるが、成形体(8)を構成す
る粉末同志の溶融拡散反応によシ該成形体(8)が軟化
する過程で成形体(8)自体の友さが平板状のセンタ(
9)との接触部の一点に集中すると同時に焼結時成形体
(8)自体が10〜20%収縮する結果成形体(8)間
に空間ができ成形体(8)が傾くことによシ第4図にボ
すように焼結体(lO)が変形し!!他形成時に割れf
cシあるいは′WL極形酸形成まくいかないなどの欠点
をもっていた。
However, in the case of the method shown in FIG. 1, the lower surface of the molded body (2) in contact with the flat center (3) forms an electrode through interaction with the flat center (3). However, in the case of the method shown in Figure 2, powder (6)
Since the particles dig into the molded body (5) or are attached to the entire surface, it has the same drawbacks as the method shown in FIG.・Therefore, as shown in Fig. 3, a flat center (9) made of a material that does not react with the compact (8) is laid inside the sintered pod (7), and the compact is placed on the center (9). It is conceivable to prevent interaction between the electrode forming portions on both sides and the center (9) on the flat plate by sintering 1! several pieces of (5) upright, but ) In the process of softening the molded body (8) due to the melt-diffusion reaction between the powders constituting the powder, the body of the molded body (8) itself becomes fused to form a flat center (
At the same time, the compact (8) itself shrinks by 10 to 20% during sintering, creating a space between the compacts (8) and causing the compact (8) to tilt. The sintered body (lO) deforms as shown in Figure 4! ! Cracks during other formation f
It had drawbacks such as failure to form a C or 'WL polar acid.

これは成形体の厚みとして比較的薄いものを用いしかも
並べる成形体の数が多ければ多いはと顕著であった◎ 木兄8A#′i上記の点に艦みてなされたもので焼結ナ
ヤ内に入れて焼結する場合、センタの形状を改良しセラ
ミック成形体を七ツタに支持した状態で前記成形体の最
下部が焼結サヤまたは七ツタと接触することなく前記最
下部よシ高い2鋤所で成形体を支持すると同時に複数個
の成形体間に任意な間隔で自立可能なセパレータを配設
することによって成形体両面の電極形成面とセンタとの
相互反応のないしかも変形の危険性のない焼結体を得る
ことのできるセラミック寛子部品の焼結方法を提供せん
とするものである。以下セラミックバリスタを例示し本
発明の一実施例につき説明する。すなわち第5図に示す
ように例えばアルミナまたはシリカなどからなる焼結サ
ヤ(11]の底面に第6図にボ丁ように例えば鹸化マグ
ネシウムなどからなる三角柱状の七ツタ(12)を複数
個配設し、該センタ(12)間に形成された断面la#
4状の支持溝(13)に例えば酸化亜鉛、酸化鉄、#c
化錫、6&化チタンま7’Ctiチタン酸バリウムなど
を主成分とし他に数棟類の釡属飯化物を添加混合して造
粒し、つき゛に粘結剤を添加し円板状に成形したバリス
タ成形体(14)をil数個立てた状態に配列し該成形
体(14)を支持した状態で成形体(14)外周の飯下
部が前記焼結サヤ(11)と接触することなく前記最下
部に位置する箇所よυ高い2箇所で支持する。なおこの
場合前記複数個のバリスタ成形体(14]間に任意な間
隔で自立可能な該成形体(14)と同一組成物からなる
セパレータ(15)を配設する。しかして前記焼結サヤ
(11)開口部に該すヤ(11)と同材質の蓋(図示せ
ず)をして700〜1600°Cの温度に保持したトン
ネル炉(図示せず)に1−10時間通し焼結するもので
ある。
This was especially noticeable when the thickness of the molded body was relatively thin and the number of molded bodies to be arranged was large. In the case of sintering in a sintering sheath, the shape of the center is improved so that when the ceramic molded body is supported by the seven vines, the lowest part of the molded body is higher than the lowest part without coming into contact with the sintering sheath or the seven vines. By supporting the compact at the plow station and at the same time arranging self-supporting separators at arbitrary intervals between multiple compacts, there is no interaction between the electrode forming surfaces on both sides of the compact and the center, and there is no risk of deformation. The object of the present invention is to provide a method for sintering ceramic parts that can produce a sintered body free of sintered parts. An embodiment of the present invention will be described below using a ceramic varistor as an example. That is, as shown in FIG. 5, a plurality of triangular prism-shaped seven vines (12) made of, for example, saponified magnesium are arranged on the bottom surface of a sintered pod (11) made of, for example, alumina or silica, as shown in FIG. and the cross section la# formed between the centers (12)
For example, zinc oxide, iron oxide, #c
The main ingredients are tin chloride, 6&titanium oxide, 7'Cti barium titanate, etc., and several other types of metal oxides are added and mixed, granulated, and then a binder is added and formed into a disk shape. Several varistor molded bodies (14) are arranged in an upright manner, and while the molded bodies (14) are supported, the molded bodies (14) are arranged so that the outer peripheral part of the varistor molded bodies (14) does not come into contact with the sintered sheath (11). It is supported at two locations that are υ higher than the lowest location. In this case, separators (15) made of the same composition as the varistor molded bodies (14) and capable of standing on their own are arranged at arbitrary intervals between the plurality of varistor molded bodies (14). 11) Cover the opening with a lid (not shown) made of the same material as the corresponding jar (11) and sinter it in a tunnel furnace (not shown) maintained at a temperature of 700 to 1600°C for 1 to 10 hours. It is something.

このようなバリスタ成形体(14)の焼結方法によれば
センタ(12)との接触部はバリスタ成形体(14)を
支持する外周の2箇所のみでめシ、バリスタ成形体(1
4)の電極形成IIは焼結サヤ(11)はもちろんのこ
と七ツタ(12)とも接触することなく焼結できるので
、その部分の表面における焼結サヤ(11)およびセン
タ(12]との反応になく本来の特性を失うことがなく
、さらにバリスタ成形体(14)の支持が断面傾斜状の
支持溝(13)で支持された状態で外周の最下部に位置
する箇所よシ高い2箇所で行われているためバリスタ成
形体(14)自体の友さが2箇所に分散され、しかもセ
パレータ(15)の存在によってバリスタ成形体(14
)の傾きが少ないためバリスタ成形体(14)の変形は
大幅に緩和されバリスタ特性の劣化を防ぐことができる
According to such a method of sintering the varistor molded body (14), the contact portions with the center (12) are only two places on the outer periphery supporting the varistor molded body (14), and the varistor molded body (1
4) Electrode formation II can be sintered without contacting not only the sintered pod (11) but also the seven vines (12), so that the contact between the sintered pod (11) and the center (12) on the surface of that part is reduced. The varistor molded body (14) is supported by the support groove (13) with an inclined cross section, and the two positions are higher than the lowest position on the outer periphery. Since the varistor molded body (14) itself is dispersed in two places, and due to the presence of the separator (15), the varistor molded body (14)
) has a small inclination, the deformation of the varistor molded body (14) is greatly alleviated, and deterioration of the varistor characteristics can be prevented.

なお上記説明ではセンタの形状として三角柱状のものを
例示し成形体として円板状のものを例示したが、第7図
に示すように1箇所が平面部(16]からなる断面が一
部切欠した円柱状の七ツタ(17)を用い、第8図に示
すように焼結ナヤ(18)内に前記平面部(16]を当
接してvI数個を一定間隔で配列し前記一部切欠した円
柱状のセンタ(17)間に形成された鵠斜状の支持溝(
19)にたとえば角板状または円板状に形成したバリス
タ成形体(20)を複数個直立して配列するようにして
も同効である。図中(21)にセパレータを示す0また
上記実施例でに6個のセンタ間に一定間隔を設けて配設
した場合を例ボしたが、第9図および第1O図のように
前記三角柱状の七ツタ(12)同志または一部切欠した
円柱状のセンタ(17)同志を引つ付けて配列しバリス
タ成形体を支持した状態で最下部がセンタ(12)また
は(17)に接触しないようにした場合で%もちろんの
こと、第11図〜第14図にボすように断面傾斜状の支
持@(22)を一体成形したセンタ(23)を用いても
同効である。第9図および第10図で(24)は動1面
傾斜状の支持溝である。さらに上記説明ではバリスタを
例ボしたがサーミスタ、感湿抵抗体、セラミックコンデ
ンテなどのセラミック電子部品の焼結方法にも適用でき
同効であることは15までもない。
In the above description, a triangular prism-shaped center was used as an example, and a disc-shaped molded body was used as an example, but as shown in FIG. Using the cylindrical seven ivy (17), as shown in Fig. 8, the flat part (16) is brought into contact with the sintered nail (18), and several vI are arranged at regular intervals, and the partial notch is made. An oblique support groove (17) formed between the cylindrical centers (17)
The same effect can be achieved by arranging a plurality of varistor molded bodies (20) in the shape of a rectangular plate or a disk in an upright manner in 19). In the figure, (21) shows a separator. In addition, in the above embodiment, the separator is arranged at a constant interval between six centers, but as shown in FIG. 9 and FIG. The seven ivy (12) or the partially cut-out cylindrical center (17) are arranged so that they are attracted to each other so that the lowest part does not come into contact with the center (12) or (17) while supporting the varistor molded body. Needless to say, the same effect can be obtained by using a center (23) integrally formed with a support (22) having an inclined cross section as shown in FIGS. 11 to 14. In FIGS. 9 and 10, reference numeral (24) indicates a support groove having an inclined plane. Furthermore, although the above explanation uses a varistor as an example, it can also be applied to a method for sintering ceramic electronic components such as a thermistor, a moisture-sensitive resistor, and a ceramic capacitor, and the same effect cannot be denied.

つぎに本発明による効果につき実験例をもとに説明する
。まず’ZnO82,8モル%とMgO13,5モル%
を生成分とし他にBiaj)a  O,8モル%。
Next, the effects of the present invention will be explained based on experimental examples. First, 'ZnO82.8 mol% and MgO13.5 mol%
and Biaj)a O, 8 mol%.

SbgOr51.2モル%、Co00.5モル%。SbgOr51.2 mol%, Co00.5 mol%.

Mn00.5モル%、NiO0,5%ル% r Cr 
2030.2モル%を添加混合して造粒し粘結剤として
ポリビニルアルコールを添加し直径25s111.厚さ
1履のバリスタ成形体400個を製造し、該バリスタ成
形体400個を100個ずつに区分した。つぎ100個
ずつに区分した4ブロツクの焼結方法として■第5図に
示す方法を用いた本発明の実施例(4)■第1図に示す
方法を用いた従来の踪考例(II)  (3)第2図に
示す方法を用いた従来の参考例(C)■第3図に示す方
法を用いた従来の参考例の)それぞれの焼結方法のちが
いによるバリスタ特性を調べた結果第15図および第1
6図に示すような結果が得られた。なおこの場合実施偶
因における三角柱状のセンタ、お考例俤)、カ考例(2
)に示す平板状のセンタはいずれ%酸化マグネシウムの
民結物からなるものを用い、参考例(Qに示す粉末は酸
化亜鉛粉末を用い電極はいずれ%直径20mの金属電極
とした0また焼結温度と時間は(A) (B) (C)
(2)とも1300’0.3時間とした。なお実地例匹
)におけるセパレータはバリスタ成形体と同一組成物か
らなるものを用いた。第15図は電圧−寛流特性曲組図
で、第16図に8×20μseaの橡−波形で400O
Aのサージ11Laを印加したときの印加[!11斂−
バリスタ電圧(VlmA)の変化率を示すものである。
Mn00.5mol%, NiO0.5%le% r Cr
2030.2 mol% was added and mixed, granulated, polyvinyl alcohol was added as a binder, and the diameter was 25s111. 400 varistor molded bodies each having a thickness of 1 shoe were manufactured, and the 400 varistor molded bodies were divided into 100 pieces each. Next, as a method for sintering 4 blocks divided into 100 blocks: ■ Example (4) of the present invention using the method shown in FIG. 5 ■ Conventional sintering example (II) using the method shown in FIG. 1 (3) Conventional reference example using the method shown in Figure 2 (C) Conventional reference example using the method shown in Figure 3 Figure 15 and 1st
The results shown in Figure 6 were obtained. In this case, the triangular prism-shaped center in the implementation contingency, example 俤), example (2)
The flat center shown in ) is made of a non-woven material of magnesium oxide, and the reference example (the powder shown in Q is zinc oxide powder, and the electrode is a metal electrode with a diameter of 20 m) is also sintered. The temperature and time are (A) (B) (C)
(2) Both were set at 1300' for 0.3 hours. The separator used in the practical example was made of the same composition as the varistor molded body. Figure 15 is a voltage-reduction characteristic curve diagram, and Figure 16 shows a square waveform of 8 x 20μsea at 400O.
Application when applying surge 11La of A [! 11-
It shows the rate of change of the varistor voltage (VlmA).

第7図および第8図から明らかなように実施例(4)は
電圧−電流特性およびバリスタ電圧の変化率特性のいず
れもすぐれているのに対し、参考例ω)(Qの〕は電圧
−を流特性およびバリスタ電圧の変化率特性が実地例囚
よシ劣如実地偶因の効果が顕著であることがわかる。ま
た参考例(2)に電極形成時100個中6o個に成形体
割れが発生し歩留が悪く実用的でない。
As is clear from FIGS. 7 and 8, Example (4) has excellent voltage-current characteristics and varistor voltage change rate characteristics, whereas Reference Example ω) (Q) has excellent voltage-current characteristics and varistor voltage change rate characteristics. It can be seen from the actual example that the current characteristics and the rate of change characteristics of the varistor voltage are inferior, and the effect of actual accidental causes is remarkable.Also, in reference example (2), 6 out of 100 molded bodies cracked during electrode formation. occurs, resulting in poor yield and impractical.

以上述べたように本発明によればセラミック成形体を焼
結サヤ内に入れて焼結する場合、前記焼結サヤ内に断面
傾斜状の支持溝を設けたセンタを配設し前記支持溝に板
状セラミック成形体を複数個直立して立、てた状態に配
列し支持した状態で前記成形体外周の最下部が前記焼結
サヤまたはセンタと接触することなく前記最下部よシ高
い2薗所で支持すると同時に襞数個のセラミック成形体
間に任意な間隔で自立可能な該成形体と同一組成物から
なるセパレータを配設することによって特性劣化および
変形を防止し特性の安定したセラミック焼結体を得るこ
とのできるセラミック電子部品の焼結方法を提供するこ
とができる0
As described above, according to the present invention, when a ceramic molded body is placed in a sintering pod and sintered, a center having a support groove with an inclined cross section is provided in the sintering pod, and When a plurality of plate-shaped ceramic molded bodies are arranged and supported in an upright state, the lowermost part of the outer periphery of the molded bodies is not in contact with the sintered sheath or the center, and the lowermost part is higher than the lowermost part. By arranging separators made of the same composition as the ceramic molded bodies, which can stand on their own at arbitrary intervals between several folded ceramic molded bodies while supporting the ceramic molded bodies in place, property deterioration and deformation can be prevented and ceramic sintering with stable characteristics can be achieved. A method for sintering ceramic electronic components capable of obtaining a solid body can be provided.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第4図は従来の参考例に係るもので第1図〜第
3図は焼結サヤにセラミック成形体を収容した状態を示
す断面図、第4図に第3図にボ丁状態で焼結して得られ
友焼結体をボす側面図、第5図および第6図は本発明の
一実施例に係シ第5図は焼結サヤにバリスタ成形体を収
容した状態を示す一部切欠斜視図、第6図は第5図に用
いたセンタを示す斜視図、第7図〜第14図は本発明の
他の実施例に係υ第7図はセンタを示す斜視図、第8図
は第7図に示すセンタを用い腕結すヤにバリスタ成形体
を収容した状態を示す一部切欠斜視図、第9図および第
10図はセンタの配設状態を示す斜視図、第11図〜第
14図はセンタのそれぞれの形状を示す斜視図、第15
図は電圧−電比特性曲線図、第16図はサージ印加回数
−バリスタ電圧の変化率特性1llIR図である。 (11H1B)−−−−−−−・焼結サヤ(12H17
)(23)−−−−−−−−センタ(13)(19)(
22)(24)−−−−−−一断面傾斜状の支持溝(1
4) (20)−−−一−−−−バリスタ成形体(15
) (21)−−−一−−−−七バレータ特  許  
出  願 人 マルコン電子株式金社 第1図 第3図 第5図 第2図 、勺 第4図 第4図 第7図     第3図 第7図      第1θ図 第1/図       第12図 第13図     第1IJ−図
Figures 1 to 4 are related to conventional reference examples, and Figures 1 to 3 are cross-sectional views showing a state in which a ceramic molded body is housed in a sintered pod, and Figure 4 and Figure 3 are sectional views. FIGS. 5 and 6 are side views showing a varistor molded body obtained by sintering in a state where the varistor molded body is housed in a sintered sheath. FIG. 6 is a perspective view showing the center used in FIG. 5, and FIGS. 7 to 14 relate to other embodiments of the present invention. Fig. 8 is a partially cutaway perspective view showing a state in which a ballista molded body is housed in an arm-tying shell using the center shown in Fig. 7, and Figs. 9 and 10 are perspective views showing the state in which the center is arranged. 11 to 14 are perspective views showing the respective shapes of the center, and FIG.
The figure is a voltage-to-electricity ratio characteristic curve diagram, and FIG. 16 is an IR diagram of the surge application number-varistor voltage change rate characteristic. (11H1B)-----・Sintered pod (12H17
) (23)--------- Center (13) (19) (
22) (24) -------Support groove with inclined cross section (1
4) (20)----1--- Varistor molded body (15
) (21)---1---7 Valet Patent
Applicant Marcon Electronics Co., Ltd. Figure 1 Figure 3 Figure 5 Figure 2 Figure 4 Figure 4 Figure 7 Figure 3 Figure 7 Figure 1 θ Figure 1/Figure 12 Figure 13 1st IJ-Figure

Claims (2)

【特許請求の範囲】[Claims] (1)焼結サヤ内に1#面傾斜状の支持溝を設けたセク
タを配設し、前記支持溝に板状のセラミック成形体を複
数個室てて配列し、該成形体を支持した状態で該成形体
外周の最下部が前記焼結サヤまたはセクタと接触するこ
となく前記最下部よシ高い2箇所で支持するとともに前
記lIl!数個の成形体間に任意な間隔で自立$1]此
な該成形体と同一組成物からなるセパレータを配設して
焼結することを特徴とするセラミック電子部品の焼結方
法。
(1) A state in which a sector with a support groove with a 1# surface slope is provided in the sintered pod, a plurality of plate-shaped ceramic molded bodies are arranged in the support groove, and the molded bodies are supported. The lowermost part of the outer periphery of the molded body is supported at two points higher than the lowermost part without contacting the sintered sheath or sector, and the lIl! A method for sintering a ceramic electronic component, characterized in that separators made of the same composition as the molded bodies are disposed between several molded bodies and are sintered so that they are self-supporting at arbitrary intervals.
(2)  支持溝を個々の七ツタ間に設けたことを特徴
とする特許 電子部品の焼結方法。 (31  支持溝を一体に成形したセンタで設けたこと
を特徴とする特許請求の範囲第(1》項記載のセラ゜ミ
ツク電子”部品の焼結方法。
(2) A patented method for sintering electronic components, characterized in that support grooves are provided between each of the seven vines. (31) A method for sintering a ceramic electronic component according to claim 1, wherein the support groove is provided in an integrally molded center.
JP57100114A 1982-06-10 1982-06-10 Method of sintering ceramic electronic part Pending JPS58217471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57100114A JPS58217471A (en) 1982-06-10 1982-06-10 Method of sintering ceramic electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57100114A JPS58217471A (en) 1982-06-10 1982-06-10 Method of sintering ceramic electronic part

Publications (1)

Publication Number Publication Date
JPS58217471A true JPS58217471A (en) 1983-12-17

Family

ID=14265335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57100114A Pending JPS58217471A (en) 1982-06-10 1982-06-10 Method of sintering ceramic electronic part

Country Status (1)

Country Link
JP (1) JPS58217471A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200083A (en) * 1984-03-26 1985-10-09 三菱電機株式会社 Floor plate for baking
JPS63197879A (en) * 1987-02-13 1988-08-16 東芝セラミツクス株式会社 Setter for baking ceramics
JP2011151197A (en) * 2010-01-21 2011-08-04 Tdk Corp Method of manufacturing chip type electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200083A (en) * 1984-03-26 1985-10-09 三菱電機株式会社 Floor plate for baking
JPS63197879A (en) * 1987-02-13 1988-08-16 東芝セラミツクス株式会社 Setter for baking ceramics
JP2011151197A (en) * 2010-01-21 2011-08-04 Tdk Corp Method of manufacturing chip type electronic component

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