JPS58204877A - Ceramic electronic parts sintering method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention includes a varistor and a thermistor.

Concerning the results of seven ramic electronic components such as ceramic capacitors and pressure IIL confectionery.

Up until now, the sintering method for ceramic electronic components has been regarded as important as a factor that greatly influences the m-characteristics, and in general, a ceramic molded body formed into a predetermined shape is placed in a sintered pod made of alumina, silica, etc. It is boiled for several hours in a tunnel furnace that is covered with a lid made of the same material and maintained at the desired temperature. However, during the sintering process, the molded body that is in contact with the sintered material undergoes an interaction with the sintered material, causing the composition of the molded material to change in quality and cause the molded material to lose its original properties. There is. Conventionally, in order to solve this problem, when arranging molded bodies in a sintering container, the inner bottom of the sintered sheath (1) is made of a material that does not react with the molded body (2), as shown in Figure 1. Lay out a flat plate-shaped sector (3), and
3) Sinter a plurality of molded bodies (2) on top of each other in a plane, or sinter the molded bodies (5) in a sintered sheath (4) as shown in Figure 2.
) is spread, and a plurality of molded bodies (5) are arranged on the powder (6) in a plane and sintered.

However, in the case of the method shown in Fig. 1, the molded body (2) is in contact with the flat seven ivy (3), and the molded body (2) forms an electrode through interaction with the sectors (3) whose lower surfaces are flat. However, in the case of the method shown in Figure 2, powder (6)
Since the molded body (5) was dug into or a letter was written on the entire surface, it had the same drawbacks as the method shown in FIG. Therefore, as shown in Fig. 3, a flat sector (9) made of a material that does not react with the molded body (8) is placed inside the sintering column (7), and the molded body (5) is placed on the vertical sector (9). ) to W
It is possible to prevent the interaction between the electrode formation places on both sides and the plate-shaped seven ivy (9) by arranging Wk pieces upright and pressing W, but it is possible to ) J-! 7. The molded body (8
) in the process of softening, the weight of the compact (8) itself is concentrated at one point in contact with the flat seven ivy (9), and the sintered compact (10) deforms as shown in Figure 4. Broken during electrode shape #)
Alternatively, they had drawbacks such as poor electrode formation. This was particularly noticeable when the thickness of the molded product was relatively thin.O Uninventively, this was done in view of the above points, and the shape of the center was improved by placing it in the already paid sac. With the ceramic molded body supported by the sector, the lowest part of the molded body is visible! ? By supporting the molded body at two points higher than the lowest part without contacting the vines with the pods, there is no risk of deformation due to interaction between the electrode forming surfaces of both sides of the molded body and the center. The aim is to improve the performance of ceramic electronic components by obtaining a sintered body free of oxidation.

An embodiment of the present invention will be described below using a ceramic varistor as an example. That is, as shown in FIG. 5, one side of a triangular prism made of, for example, magnesium oxide is made into a planar shape (12) and the other side is made of a triangular prism shape (12) made of, for example, magnesium oxide, as shown in FIG. The planar shape (1) of the center (14) whose both sides are formed into a step shape (13)
2) A plurality of parts are disposed in contact with each other, and a curved stepped inclined support 4F153 formed between the centers (14) is coated with plated zinc, iron oxide, tin dioxide, titanium chloride, or barium titanium chloride. A ballista molded body (16) made by mixing the main ingredients with a number of similar acid analogues, adding a binder to the shank, and forming it into a disk shape (16) The molded bodies (16) are arranged in an upright position and supported by the molded bodies (16).
) The lowest part of the outer periphery is supported at two points higher than the one located at the lowest point without contacting the outer periphery of the opening of the folk sill sheath (11). 700~
The dish is placed in a tunnel furnace (not shown) maintained at a temperature of 1600' (!) for 1 to 10 hours and then washed.

According to the bladder adhesion method of such a ballista molded body (16), the contact part with the ivy (14) is the ballista molded body (16).
There are only two places on the outer periphery that support the varistor molded body (
Since the 16 carrying IE electrode formation surface can be formed without contacting the center (14) as well as the center (11), the surface of the IL pole FFA surface can be connected to the connection point (11) and the center (14). The varistor molded body (16) may lose its original position without reacting, or the weight of the varistor molded body (16) itself may be distributed over two pieces, which is higher than the one located at the bottom. ) can greatly prevent the deterioration of the varistor characteristics.

In the above practical example, the seven ivy shape was explained as an example in which one side was flat, but as shown in Fig. 7, the seven ivy shape (7 ivy) with a stepped shape (17) on the three sides of the triangular prism shape was explained. 1
8), if n then sector r! It's a problem if you install it without considering the direction of Iev. In addition, the varistor molded body is not limited to disc-shaped ones, but can be applied to rectangular plate-shaped ones. As shown in FIG. 8, when the centers (14) are arranged in such a way as to support the varistor molded body, the lowermost part has seven ivy (14).
In the case where the support groove is 1% 1% chirunno, as shown in Figs. 9 and 10, the support groove (
The same effect can be obtained by using a sector (20) integrally molded with 19). The eighth factor is (21), which is a support groove with a stepped slope in cross section. Furthermore, in the above explanation, a varistor was used as an example, but a thermistor is also used.

Needless to say, this method can also be applied to a method of washing ceramic electronic components such as humidity-sensitive resistors and ceramic condensers, and has the same effect.

Next, a varistor will be exemplified and the effects of the present invention will be explained based on experimental examples. 1 zn, o 82.8 mol Mn
O0, 5 mol% NLOO, 5 mol% Cr2b30.2
Mol% was mixed with #i and granulated, and polyvinyl alcohol was added as a binder.@diameter 25-. *400 varistor molded bodies of size 1■ were torn apart, and the 400 varistor molded bodies were 1
It was divided into 004IA. Next, as a result method for four blocks divided into 1001- blocks, ■ An example of the present invention using the method shown in Figure 5 (5) ■ A conventional reference example (B) using the method shown in Figure 1 ■ Conventional reference example using the method shown in Figure 2 (Q ■ Conventional reference example using the method shown in Figure 3) Paris due to differences in the respective scoring methods:
The properties of the varnish were investigated and the results shown in Figures 11 and 12 were obtained. In this case, the center provided with a support groove with a step-like cross section in Example (4), and the flat center shown in Reference Example (B) and Reference Example (D) are n%.
In reference example (C), fermented zinc powder was used as the powder, and both electrodes were silver electrodes with a diameter of 2 OW.

Also yaits temperature and time H (A) (B) (C) ■
) and %, 1300-0 3 hours. ], Figure 1 ζ Voltage - 11L capacity curve is poor, K 121gu8 X 2
The mark flfl (b) carpet-varistor voltage (
The rate of change of VlmA) is not accurate. As is clear from Fig. 11 and Fig. 12, both the a voltage-voltage retention characteristic and the rate of change characteristic of the varistor voltage are not consistent, whereas the reference @ (B) (C) (Dl
It can be seen that the effect of Example (5) is remarkable in that the a-voltage-electricity, the characteristic, and the rate of change characteristics of the varistor voltage are inferior in Example 1. Further, in the reference example (60 out of 100 molded bodies were cracked during the formation of the t-pole, the yield was poor and it was not practical).

1. As described above, according to the present invention, when a ceramic molded body is placed in a molding pod and being tested, a center having a support groove with a step-shaped cross section is provided in the molding pod, and the support F? f
When the plate-shaped ceramic molded bodies are placed on the skin and arranged and supported in an upright position, the recessed part of the outer periphery of the molded bodies is higher than the retracted part without coming into contact with the preaching puja or sefta.2 By supporting the ceramic electronic component with a support, deterioration and deformation of the characteristics can be prevented, the characteristics can be stabilized, and a high performance can be obtained.

[Brief explanation of drawings]

Figures 1 to 4 are the same as the conventional examples, and Figures 1 to 3 show the state in which the ceramic molded body is housed in the sheath. ] Figure, Figure 4a Figure 3 is a lit side view showing the resultant body which has been sintered and folded f' in an unformed state, Figures 5 and 6a Fig. 5 is a partially cutaway perspective view showing the state in which the varistor molded body is housed in the rx active sheath, Fig. 6 is a side view of the safeter used for the fifth factor, and Figs. 7A is a perspective view showing the sector, FIG. 8A is a perspective view showing the arrangement state, FIGS. 9 and 10 are perspective views showing the respective shapes of the safeter, and FIG. 11 is another example. Figure 12 shows the α road pressure-current characteristic curve, and the calculation of the number of α surge applications vs. the variation rate of the varistor's soil. (11) ------ Grade Saya + 14) (1B) (20) ------ Setta (15) (
19) (21)------Support groove with stepped slope in cross section (1
6L---- Varistor molded body holding device Marcon Electronics Co., Ltd. Fig. 1 Fig. 2 Fig. 3 Fig. 4 Fig. 5 Fig. 7 Fig. 9 Fig. 1 Whistle 9 Fig. 1O Fig.

Claims (2)

[Claims] (1) Theory ii! I will set up a sector in which I have collected the support for the first round of Sakaichi thank-you letters, and I will put a plate-shaped seven-legged body on the 87 support list! The 11 ridges are placed and the solder-shaped rod is dipped in lead, and the outside of the molded body is engraved with a bewitching surface. Sister Yo#) - Ayumanta, a ceramic electronic component whose N value is to support and connect with two gardens. (2) The method of bonding ceramic electronic components according to paragraph (1), in which the support is accommodated between the centers of the individual A and the C is maintained. (The yoke of 31 support was established at the center which lost 2 times in total.)