JPS58213456A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58213456A
JPS58213456A JP57095917A JP9591782A JPS58213456A JP S58213456 A JPS58213456 A JP S58213456A JP 57095917 A JP57095917 A JP 57095917A JP 9591782 A JP9591782 A JP 9591782A JP S58213456 A JPS58213456 A JP S58213456A
Authority
JP
Japan
Prior art keywords
output
conductive
input
pair
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57095917A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327859B2 (enFirst
Inventor
Osamu Shiozaki
修 塩崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57095917A priority Critical patent/JPS58213456A/ja
Publication of JPS58213456A publication Critical patent/JPS58213456A/ja
Publication of JPS6327859B2 publication Critical patent/JPS6327859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements

Landscapes

  • Amplifiers (AREA)
JP57095917A 1982-06-04 1982-06-04 半導体装置 Granted JPS58213456A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57095917A JPS58213456A (ja) 1982-06-04 1982-06-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57095917A JPS58213456A (ja) 1982-06-04 1982-06-04 半導体装置

Publications (2)

Publication Number Publication Date
JPS58213456A true JPS58213456A (ja) 1983-12-12
JPS6327859B2 JPS6327859B2 (enFirst) 1988-06-06

Family

ID=14150624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57095917A Granted JPS58213456A (ja) 1982-06-04 1982-06-04 半導体装置

Country Status (1)

Country Link
JP (1) JPS58213456A (enFirst)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984065A (en) * 1989-01-11 1991-01-08 Kabushiki Kaisha Toshiba Hybrid resin-sealed semiconductor device
EP0598563A3 (en) * 1992-11-18 1995-05-17 Fuji Electric Co Ltd Semiconductor conversion device.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56104146U (enFirst) * 1980-01-08 1981-08-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56104146U (enFirst) * 1980-01-08 1981-08-14

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984065A (en) * 1989-01-11 1991-01-08 Kabushiki Kaisha Toshiba Hybrid resin-sealed semiconductor device
EP0598563A3 (en) * 1992-11-18 1995-05-17 Fuji Electric Co Ltd Semiconductor conversion device.
EP0713251A3 (en) * 1992-11-18 1996-08-14 Fuji Electric Co Ltd Semiconductor conversion device
US5576575A (en) * 1992-11-18 1996-11-19 Fuji Electric Co., Ltd. Semiconductor conversion device

Also Published As

Publication number Publication date
JPS6327859B2 (enFirst) 1988-06-06

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