JPS58199381A - Manufacture of liquid crystal display element - Google Patents
Manufacture of liquid crystal display elementInfo
- Publication number
- JPS58199381A JPS58199381A JP8159482A JP8159482A JPS58199381A JP S58199381 A JPS58199381 A JP S58199381A JP 8159482 A JP8159482 A JP 8159482A JP 8159482 A JP8159482 A JP 8159482A JP S58199381 A JPS58199381 A JP S58199381A
- Authority
- JP
- Japan
- Prior art keywords
- film
- liquid crystal
- crystal display
- display element
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は液晶表示素子の製造方法に係り、製造装置並び
に製造工程が共に簡単で且つ貴金属の使用量の少い安価
な液晶表示素子を提供せんとすゐものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a liquid crystal display element, and an object of the present invention is to provide an inexpensive liquid crystal display element that has simple manufacturing equipment and manufacturing processes, and uses less precious metal. .
通常液晶表示素子に用いられる透明電極、配線部等の透
明導電薄膜は数十Q/ロ〜数百Ω/ロ程度の面積抵抗値
であり、特に幅のせまい配線部では、その両端間の抵抗
値Fi数百にΩと々る場合がある。Transparent conductive thin films such as transparent electrodes and wiring parts normally used in liquid crystal display elements have an area resistance value of several tens of Q/R to several hundred Ω/R, and especially in narrow wiring parts, the resistance between both ends The value Fi may reach several hundred Ω.
のドでは、抵抗値を下げるため金、銀等°の金属被膜を
使い目立たない程度の細い幅による配線が行われている
。In order to lower the resistance value, metal coatings such as gold and silver are used for wires with narrow widths that are not noticeable.
通常このようにガラス基板上に透明導電薄膜を形成する
場合、ニクロムを下地として蒸着し、その上をζ金や銀
等の貴金属を蒸着してエツチングする場合が多い。Normally, when forming a transparent conductive thin film on a glass substrate in this way, nichrome is often deposited as a base, and a noble metal such as ζ gold or silver is deposited on top of the base and then etched.
然し、高価な金や鋏の賞金lAt?ガラス基板上に全面
蒸着することは、貴金属の使用量が大であり、更に蒸着
装置自体は勿論のこと、その作業工程も複雑で、液晶セ
ルのコストアップの要因となっていた〇
本発明は上記従来の欠点を改良せんとするものであり、
金や銀等の有機貴金属を主成分とするペーストをスクリ
ーン印刷法によりガラス基板上に塗布し焼成することに
より、ガラス基板表面に直接会や銀の薄膜より成る透明
導電薄膜を形成したことを特徴とするものである。However, the prize of expensive gold and scissors is lAt? Full-surface vapor deposition on a glass substrate requires a large amount of precious metals, and the vapor deposition equipment itself as well as the work process are complicated, which increases the cost of liquid crystal cells. This is an attempt to improve the above conventional drawbacks,
It is characterized by forming a transparent conductive thin film consisting of a thin film of silver directly on the surface of the glass substrate by applying a paste containing organic noble metals such as gold or silver as the main component onto the glass substrate by screen printing method and baking it. That is.
以下、本発明の実施例について説明すると、先づソーダ
ガラス基板上にインジュームースズ透明器
導電膜を真空蒸着に形成し、その上にENGELH△
ARD社製A−3725金ペーストをスクリーン印刷法
により基板全面に印刷し、550°C220分間にて焼
成した。Hereinafter, an example of the present invention will be described. First, an Indume tin transparent conductive film is formed on a soda glass substrate by vacuum deposition, and then A-3725 gold paste manufactured by ENGELH△ARD is screen printed on it. was printed on the entire surface of the substrate, and baked at 550°C for 220 minutes.
これによシ膜圧4000オングストロームの金の被膜が
形成された。As a result, a gold film with a film thickness of 4000 angstroms was formed.
このガラス基板上に0FPR−TYPE2ポジタイプフ
ォトレジスト(東京応化(株)製)tRcP−141,
ロールコータ−(大日本印刷(株)製)にて塗布し、乾
燥後、M−3LDマスクアライナ−(ミカサ(株)製)
にて、ホトマスクを重ね合わせて露光し、露光後金膜を
エツチングし、配線部、透明電極等の透明導電薄膜を形
成した。On this glass substrate, 0FPR-TYPE2 positive type photoresist (manufactured by Tokyo Ohka Co., Ltd.) tRcP-141,
Apply with a roll coater (manufactured by Dai Nippon Printing Co., Ltd.), and after drying, apply M-3LD mask aligner (manufactured by Mikasa Co., Ltd.)
After exposure, the gold film was etched to form transparent conductive thin films such as wiring portions and transparent electrodes.
次に、金からな石透明導電薄膜のガラス基板との密着強
度に万全を期すため前記ガラス基板の上にアルミ、シリ
コン、インジューム等の有機金属を主成分とするペース
トをスクリーン印刷法にて端子部を除くガラス基板の表
面全体に塗布し、550°C,15分焼成して、上記金
属の酸化物からなる透明絶縁膜にて全面を覆った。そし
て、5H6020シランカツプリング剤(東しシリコー
ン社製)を表面にコーティングした後、脱脂綿にてガラ
ス基板表面を強くこすっても、配線部を含む透明電極の
金の薄膜は全くはがれることはなかった。Next, in order to ensure the strength of the adhesion of the gold transparent conductive thin film to the glass substrate, a paste mainly composed of organic metals such as aluminum, silicon, and indium is applied onto the glass substrate using a screen printing method. The coating was applied to the entire surface of the glass substrate except for the terminal portions, and baked at 550° C. for 15 minutes to cover the entire surface with a transparent insulating film made of the above metal oxide. After coating the surface with 5H6020 silane coupling agent (manufactured by Toshi Silicone Co., Ltd.), even if the surface of the glass substrate was rubbed strongly with absorbent cotton, the thin gold film on the transparent electrode, including the wiring, did not come off at all. .
このガラス基板を用いてセル管組立て、液晶を注入し液
晶表示素子を作成したところ良好な配向が得られた。こ
のように比較的簡単な工1!により、金膜M1を用いた
ドツトマトリックスの液晶表示素子を製造することが出
来るようになった。When this glass substrate was used to assemble a cell tube and inject liquid crystal to create a liquid crystal display element, good alignment was obtained. This is a relatively easy process 1! As a result, it has become possible to manufacture a dot matrix liquid crystal display element using the gold film M1.
なお、前記の金属酸化物のコーティングの代pKポリア
ミック酸溶液(東しく株)調高純度トレニース)をN−
メチルピロリドンにて5倍に希釈し、ロールコータ−に
てガラス基板全面に塗布し150aC120分間乾燥後
、350@C、30分間の熱処理でポリアミック酸を架
橋重合させ、ポリイミツドの透明絶縁膜を形成し、脱脂
綿にてラビングしたが細幅の金膜の配線のはがれる事は
なかった。In addition, instead of the metal oxide coating mentioned above, a pK polyamic acid solution (Toshiku Co., Ltd. high purity trenice) was used as N-
It was diluted 5 times with methylpyrrolidone, applied to the entire surface of the glass substrate using a roll coater, dried at 150aC for 120 minutes, and heat-treated at 350@C for 30 minutes to cross-link and polymerize the polyamic acid to form a transparent insulating film of polyimide. Although I rubbed it with absorbent cotton, the narrow gold film wiring did not come off.
このガラス基板を用いてセルを組立て液晶を注入し液晶
表示素子を製造したところ良好な配向が得られた。When a cell was assembled using this glass substrate and liquid crystal was injected to produce a liquid crystal display element, good alignment was obtained.
上記実施例は透明絶縁膜である有機ポリマー被膜として
ポリイミツド被膜に例をとり説明したが、これに限定さ
れるものではな(、PVA’等の被膜も用いられる。Although the above embodiments have been explained using a polyimide film as an organic polymer film which is a transparent insulating film, the present invention is not limited to this (a film such as PVA' may also be used).
叙上の様に、本発明は、透明導電薄膜の形成に際し、ス
クリーン印刷法により有機貴金属を主成分とするペース
トを塗布し、焼成すればよい為、従来の蒸着法に比し貴
金属の使用量が少くてすむと共に作業性が良く、従って
午の基板を以て組立てた液晶表示素子のコストダウンが
可能であり、また、細幅の配線部も金の薄膜で形成すゐ
ことにより電気抵抗は小さく出来るので、複雑Δマトリ
ックス配線(可能である静穏々の効果を有する。As mentioned above, in the present invention, when forming a transparent conductive thin film, a paste containing an organic noble metal as a main component is applied by screen printing method and then baked, so the amount of precious metal used is reduced compared to the conventional vapor deposition method. It requires less metal and is easy to work with, so it is possible to reduce the cost of liquid crystal display elements assembled using metal substrates, and the electrical resistance can be reduced by forming narrow wiring parts with thin gold films. So complex Δ matrix wiring is possible (with calm effect).
更に、予めスクリーン印刷法にて形成された透明導電薄
膜上を金属酸化物或は有機ポリマー被膜等の透明絶縁膜
で被覆すれば、透明導電薄膜を確実に保護し、剥離等の
危具は皆無となる効果を併用する。Furthermore, if the transparent conductive thin film formed in advance by screen printing is coated with a transparent insulating film such as a metal oxide or organic polymer film, the transparent conductive thin film will be reliably protected and there will be no risks such as peeling. Use the following effects together.
Claims (1)
基板上に印刷後焼成して貴金属薄膜を形成し、骸貴金属
薄膜をホトエツチング等の方法により所望形状の透明導
電薄膜を形成し、更に該透明導電薄膜を覆って透明絶縁
膜を形成することを特徴とす2液晶表示素子の製造方法
。 (i)前記透明絶縁mが、有機金属を主成分とするペー
ストを印刷焼成して得られる金属酸化物被膜であること
を特徴とする特詐饋求の範@1第(0項の液晶表示素子
の製造方法。 (3)前記透明絶縁膜が、ポリイミド郷の有機ポリマー
被膜であることを特徴とする特詐詞求の範囲第(1)項
の液晶表示素子の製造方法。[Scope of Claims] (1) Paste yi whose main component is an organic noble metal - A thin noble metal film is formed by printing and baking on a glass substrate, and a transparent conductive thin film in a desired shape is formed by photo-etching or other methods on the bare precious metal thin film. A method for manufacturing a two-liquid crystal display element, comprising: forming a transparent conductive thin film, and further forming a transparent insulating film to cover the transparent conductive thin film. (i) The transparent insulation m is a metal oxide film obtained by printing and firing a paste containing an organic metal as a main component. (3) The method for manufacturing a liquid crystal display element according to item (1), wherein the transparent insulating film is an organic polymer film made of polyimide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57081594A JPH0612384B2 (en) | 1982-05-17 | 1982-05-17 | Liquid crystal display element manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57081594A JPH0612384B2 (en) | 1982-05-17 | 1982-05-17 | Liquid crystal display element manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58199381A true JPS58199381A (en) | 1983-11-19 |
JPH0612384B2 JPH0612384B2 (en) | 1994-02-16 |
Family
ID=13750638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57081594A Expired - Lifetime JPH0612384B2 (en) | 1982-05-17 | 1982-05-17 | Liquid crystal display element manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0612384B2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54112658A (en) * | 1978-02-22 | 1979-09-03 | Seiko Epson Corp | Liquid crystal display panel and production of the same |
JPS5521141A (en) * | 1978-08-01 | 1980-02-15 | Tokyo Shibaura Electric Co | Method of forming conductor pattern of thick film circuit board |
-
1982
- 1982-05-17 JP JP57081594A patent/JPH0612384B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54112658A (en) * | 1978-02-22 | 1979-09-03 | Seiko Epson Corp | Liquid crystal display panel and production of the same |
JPS5521141A (en) * | 1978-08-01 | 1980-02-15 | Tokyo Shibaura Electric Co | Method of forming conductor pattern of thick film circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPH0612384B2 (en) | 1994-02-16 |
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