JPS6176360A - Manufacture of electrode substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an electrode substrate, which is carried out to form a stable electrode on one surface of a synthetic resin substrate.

BACKGROUND ART Conventionally, VC manufacturing electrode substrates having transparent electrodes in the field of liquid crystal display devices and the like has been carried out by a method as shown in FIG.

That is, as shown in FIG. 5 il+ and +2+, a transparent electrically conductive film 2 is formed on a substrate 1 made of synthetic resin by vapor deposition, spacing, etc., and as shown in FIG. The portion where the transparent electrode 4 is to be formed is covered with a resist layer 3, and then, as shown in FIG. The resist layer 3 is selectively removed and the resist layer 3 is removed as shown in FIG. 5 (5) to produce an electrode substrate 5 having a transparent conductor 4 on the substrate 1.

, Problems to be Solved by the Invention In such a light beam technology, when a synthetic resin substrate is used as the substrate 1, the &
In addition, the heat resistance of the 8-component resin substrate 1 (e.g. dimensional stability, !iC heat deformation properties, etc.) is low.
The transparent isoelectric film 2 cannot withstand the temperature required to form a stable transparent isoelectric film 2 such as that used in display devices using glass substrates, so the transparent isoelectric film 2 is formed by vapor deposition or sputtering at a low ml. Therefore, the transparent electrode 4 with stable characteristics is
difficult to do.

Accordingly, the object of the present invention is to provide a method for manufacturing an electrode substrate, which is carried out to form a stable electrode on a substrate made of synthetic resin with low heat resistance.

Means for Solving the Problems The present invention involves attaching a reinforcing metal layer to one surface of a thin synthetic resin substrate, and forming a conductive film to serve as an electrode on the other surface of the J substrate. The method of manufacturing an electrode substrate is characterized in that the conductive film is selectively peeled off by an etching method to form an electrode.

Function According to the present invention, reinforcing metal Wt is attached to one surface of a thin film-like synthetic resin substrate, and a conductive film to be an electrode is formed on the other surface of the substrate. Synthetic resin substrates have a reinforcing metal layer that increases their resistance to aging, and this allows the electrodes to be formed on the other side of the substrate to be manufactured at temperatures higher than the temperature at which the substrate alone would degenerate. This makes it possible to form an electrode substrate with stable characteristics.

Embodiment FIG. 1 is a cross-sectional view showing the manufacturing process of an embodiment of the present invention. The electrode base &7 manufactured according to the present invention can be used, for example, in a so-called transmission type liquid crystal display device 8 as shown in FIG.
used for. In the liquid crystal display device 8, a pair of electrode substrates 7a, 7b or a space! The electrode substrates 7a and 7b are arranged with an interval between them via the transparent synthetic resin substrates 10a and 10b, respectively.
Transparent electrodes 12a, 1 formed on mutually opposing surfaces of b
2b. A liquid crystal 15 is provided between the electrode substrates 7a and 7b.
Display by the liquid crystal 15 is performed by selectively applying a voltage between the transparent electrodes 12a and 12b. In the following description, electrode substrates 7a, 7b,
The subscript a generally refers to the substrates 10a, 10b and the transparent electrodes 12a, 12b.

b is omitted.

Referring again to FIG. 1, a method for manufacturing such an electrode substrate 7 will be described. First, as shown in FIG. 1(1), a reinforcing metal layer 11 is attached to one surface 20 of a thin film-like substrate 10 made of synthetic resin. The thickness of the substrate 10 is, for example, 5
It is 0 to 100 μm & degree. The metal layer 11 is, for example, aluminum (Al), and is deposited by a method such as lamination, vapor deposition, or sputtering. When the metal layer 11 is attached to one surface 20 of the substrate 10o by a method such as vapor deposition or sputtering, the metal layer 11 is attached at a low temperature that does not cause deterioration of the substrate 10, although heat is applied to the substrate 10. can be labeled on the board 10. Next, as shown in FIG. 1(2), a transparent conductive film 13 to become a transparent electrode 12 is formed on the other ill[I21] of the substrate 10 by a method such as vapor deposition or sputtering. The transparent conductive film 13 is
For example, metals such as indium oxide. Furthermore, the first
As shown in Figure (3), a resist layer 14 that is not removed by the etching solution in the etching method is formed on the portion of the transparent conductive film 13 that is to become the transparent electrode 12, and the remaining transparent conductive layer other than the portion that is to become the transparent electrode 12 is removed. The membrane 13 is the first
As shown in Figure (4), selective peeling is performed by an etching method. At this time, the reinforcing metal layer 11 is simultaneously removed by etching. Finally, the transparent electrode 12 is formed on the surface 21 of the substrate 10 by peeling off the resist layer 14 as shown in FIG. 1(5). In this way, the electrode substrate 7 is manufactured. Note that the resist layer 14 can be peeled off by using a release solution.

It was stabilized on the surface 21 of the substrate 10 made of synthetic resin. In order to form the transparent electrode 12, K has a glazed surface on the surface 21 of the substrate 10.
When forming the transparent conductive film 13 by a method such as sputtering, it is necessary to use a higher temperature.

The temperature is, for example, 1006C or higher, and the substrate 10
When is alone, this is the temperature at which heat-induced deformation is likely to occur. In the manufacturing method according to the present invention, one surface 2 of the substrate 10
Since the reinforcing metal layer 11 is formed on the substrate 0, the strength against temperature for forming a stable transparent electrode 12 is increased, and the formation of an airfoil shape in the substrate 10 is prevented. Therefore, since the transparent isoelectric film 13 can be formed on the substrate 10 by vapor deposition, sputtering, or other methods at a temperature that allows stable transparent electrode 12 to be formed, it is possible to form a highly accurate transparent electrode 12 on the substrate 10. becomes. Conventionally, the substrate 1 was made of synthetic paulownia resin.
In order to form the transparent electrode 12 on one side 20 of the substrate 10, the synthetic resin material used was limited due to the heat resistance of the substrate 10.
By adhering , the strength against heat can be increased, and this makes it possible to use a synthetic resin material, which has low heat resistance and has not been used in the past, as the substrate 10 .

FIG. 3 is a sectional view showing the manufacturing process of another embodiment of the present invention. Electrode substrate 7Cf manufactured according to this example
'i, wj4 It is used in a so-called reflective liquid crystal display device 8a as shown in FIG. That is, the reinforcing metal layer 11
The electrode substrate 7c can be used as a reflection plate of the liquid crystal display device 8a by leaving the conductive film 7c and the conductive film 13 together without being removed by etching. The method for this will be described below with reference to Figure @3. This embodiment is similar to the embodiment shown in FIG. 1, and corresponding parts are provided with the same reference numerals.

First, in the same way as the manufacturing process shown in FIG. Alternatively, the transparent isoelectric film 13 is formed by a method such as sputtering, and the transparent isoelectric film 13 is formed on the other side 21 of the substrate 10 by a method such as vapor deposition or sputtering. In the case of sputtering, it is effective to apply a coating process that imparts polarization properties.Next VC As shown in Figure 3 (3), a thin protective layer 16 made of synthetic resin is formed on the surface 22 of the metal layer 11. be done.

The protective layer 16fi is not removed by the etching solution used in the etching method. When forming the protection layer 16, a resist layer 14 that is not removed by the etching solution in the etching method is formed on the portion of the transparent isoelectric film 13 that will become the transparent electrode 12. Furthermore, as shown in FIG. 3(4), the remaining transparent isoelectric film 13 other than the portion that will become the transparent electrode 12 is selectively peeled off by etching. At this time, since the protective layer 16 is formed on the surface 22 of the metal layer 11, the metal layer 11 remains without being removed by the etching solution in the etching method. finally the third
As shown in Figure (5), the resist layer 14 and the protective layer 1
By removing 6, the electrode substrate 7c is manufactured.

The electrode substrate 7c manufactured in this way is, as shown in FIG. 4, the electrode substrate 7c of the liquid crystal display device 8 shown in FIG.
Used in place of b. In addition, the electrode substrate 7 shown in FIG.
ail'i, manufactured according to the embodiment shown in FIG. By leaving the metal layer 11 in this way, the so-called reflective liquid crystal display device shown in FIG.
8a is possible.

Although the retention layer 16 shown in FIG. 3 is made of synthetic resin, in still another embodiment of the present invention, the resist layer that is not removed by the etching solution in the etching method is protected by the third factor +3) and +4). It may also be formed as layer 16.

When forming the reinforcing metal layer 11 on one surface 20 of the substrate 10 by lamination, the characteristics of the liquid crystal display device 8 can be further improved by using an adhesive with good light penetration properties. It is possible to color the electrode substrate 7 by using a yellowish coloring agent, and by mixing an ultraviolet absorber with the adhesive, it is possible to color the liquid crystal display device 8! l
It is also possible to improve the u1 ultraviolet characteristics.

In the above embodiments, the electrode substrates 7a, 7b, 7cKI3V are used for the liquid crystal display devices 8, 8aK as shown in FIGS. 2 and 4, but the electrode substrate 7 according to the present invention is used for liquid crystal displays. It can be widely used not only for the device 8.8a but also for other electronic devices. 1
However, according to the spirit of the present invention, the substrate 10fl may not be transparent but may be light-shielding, and a light-shielding electrode may be provided instead of the transparent electrode 12.

Effects As described above, according to the present invention, even if the substrate is made of synthetic resin with poor heat resistance, the strength of the substrate can be reduced by attaching a reinforcing metal layer to one side of the substrate. This makes it possible to form a stable electrode on the other side of the substrate.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the manufacturing process of an embodiment of the present invention, FIG. 2 is a sectional view of a liquid crystal display device 8, and FIG. 3 is a Mc plane view showing the manufacturing process of another embodiment of the invention. FIG. 4 is a sectional view of the liquid crystal display device 8a, and the fifth factor is a sectional view showing the manufacturing process of the prior art. 1.10.10a, 10b-substrate, 2.13...transparent exclusive film, 3.14...resist layer, 4, 12° 12a
, 12b-transparent electrode, 7, 7a, 7b, 7C...electrode substrate, 11...metal layer agent Patent attorney Kei Nishi, part Figure 1, Figure 2, Figure 4, Figure 3

Claims (1)

[Claims] A reinforcing metal layer is attached to one surface of a thin synthetic resin substrate, a conductive film to be an electrode is formed on the other surface of the substrate, and the conductive film is etched. 1. A method for manufacturing an electrode substrate, comprising forming an electrode by selectively peeling the substrate.