JPS58189530U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58189530U JPS58189530U JP8649382U JP8649382U JPS58189530U JP S58189530 U JPS58189530 U JP S58189530U JP 8649382 U JP8649382 U JP 8649382U JP 8649382 U JP8649382 U JP 8649382U JP S58189530 U JPS58189530 U JP S58189530U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring board
- printed wiring
- slit
- guard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は半導体ウェーハ測定装置の正面図。第2図は本
考案のパーソナリティ・ボードの部分分解図。第3図は
本考案のパーソナリティ・ボードの部分平面図および断
面図。
201:上部基板、205:下部基板、202:信号用
パターン、204ニスリツト、203゜206=ガード
用パターン、212:突出部。FIG. 1 is a front view of a semiconductor wafer measuring device. Figure 2 is a partially exploded view of the personality board of the present invention. FIG. 3 is a partial plan view and a sectional view of the personality board of the present invention. 201: Upper substrate, 205: Lower substrate, 202: Signal pattern, 204 Nislit, 203°206=Guard pattern, 212: Projection.
Claims (1)
、前記第1の基板上に設けられた信号用パターンと、前
記第1の基板の表部、裏部および前記スリットの縁部に
連続して設けられた第1のガード用パターンと、絶縁体
によって形成された第2の基板上に設けられ前記第1の
ガード用パターンに接する第2のガード用パターンとか
ら成り、前記信号用パターンを前記第1の基板の縁部、
前記スリットおよび前記第1、第2のガード用パターン
によって囲ったことを特徴とするプリント配線基板。A first substrate having a slit and formed of an insulator, a signal pattern provided on the first substrate, and a signal pattern continuous to the front and back sides of the first substrate and the edge of the slit. a second guard pattern provided on a second substrate formed of an insulator and in contact with the first guard pattern; an edge of the first substrate,
A printed wiring board, characterized in that the slit is surrounded by the first and second guard patterns.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8649382U JPS58189530U (en) | 1982-06-10 | 1982-06-10 | printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8649382U JPS58189530U (en) | 1982-06-10 | 1982-06-10 | printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58189530U true JPS58189530U (en) | 1983-12-16 |
JPH0334907Y2 JPH0334907Y2 (en) | 1991-07-24 |
Family
ID=30095289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8649382U Granted JPS58189530U (en) | 1982-06-10 | 1982-06-10 | printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58189530U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350034A (en) * | 1986-08-20 | 1988-03-02 | Tokyo Electron Ltd | Prober device |
EP0305076A2 (en) * | 1987-08-18 | 1989-03-01 | Hewlett-Packard Company | Personality board |
JP2015206763A (en) * | 2014-04-23 | 2015-11-19 | バイオセンサー株式会社 | Measuring device and measuring method |
-
1982
- 1982-06-10 JP JP8649382U patent/JPS58189530U/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6350034A (en) * | 1986-08-20 | 1988-03-02 | Tokyo Electron Ltd | Prober device |
EP0305076A2 (en) * | 1987-08-18 | 1989-03-01 | Hewlett-Packard Company | Personality board |
EP0305076A3 (en) * | 1987-08-18 | 1989-03-15 | Hewlett-Packard Company | Personality board |
JP2015206763A (en) * | 2014-04-23 | 2015-11-19 | バイオセンサー株式会社 | Measuring device and measuring method |
Also Published As
Publication number | Publication date |
---|---|
JPH0334907Y2 (en) | 1991-07-24 |
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