JPS58186993A - 印刷配線板の製造方法 - Google Patents
印刷配線板の製造方法Info
- Publication number
- JPS58186993A JPS58186993A JP6905082A JP6905082A JPS58186993A JP S58186993 A JPS58186993 A JP S58186993A JP 6905082 A JP6905082 A JP 6905082A JP 6905082 A JP6905082 A JP 6905082A JP S58186993 A JPS58186993 A JP S58186993A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- grooves
- holes
- hole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 13
- 239000000758 substrate Substances 0.000 claims description 24
- 230000004913 activation Effects 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 1
- 238000001994 activation Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6905082A JPS58186993A (ja) | 1982-04-23 | 1982-04-23 | 印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6905082A JPS58186993A (ja) | 1982-04-23 | 1982-04-23 | 印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58186993A true JPS58186993A (ja) | 1983-11-01 |
| JPH03799B2 JPH03799B2 (enrdf_load_stackoverflow) | 1991-01-08 |
Family
ID=13391353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6905082A Granted JPS58186993A (ja) | 1982-04-23 | 1982-04-23 | 印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58186993A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63200519A (ja) * | 1987-02-17 | 1988-08-18 | 株式会社東芝 | セラミツクス基板へのピン電極の固定方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040465A (enrdf_load_stackoverflow) * | 1973-08-16 | 1975-04-14 | ||
| JPS5267998A (en) * | 1975-12-04 | 1977-06-06 | Fujitsu Ltd | Printing wiring method |
| JPS52151866A (en) * | 1976-04-22 | 1977-12-16 | Circuit Wise Inc | Circuit substrate and method of forming same |
| JPS566497A (en) * | 1979-06-27 | 1981-01-23 | Sumitomo Electric Industries | Method of manufacturing integrated circuit |
-
1982
- 1982-04-23 JP JP6905082A patent/JPS58186993A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040465A (enrdf_load_stackoverflow) * | 1973-08-16 | 1975-04-14 | ||
| JPS5267998A (en) * | 1975-12-04 | 1977-06-06 | Fujitsu Ltd | Printing wiring method |
| JPS52151866A (en) * | 1976-04-22 | 1977-12-16 | Circuit Wise Inc | Circuit substrate and method of forming same |
| JPS566497A (en) * | 1979-06-27 | 1981-01-23 | Sumitomo Electric Industries | Method of manufacturing integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63200519A (ja) * | 1987-02-17 | 1988-08-18 | 株式会社東芝 | セラミツクス基板へのピン電極の固定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03799B2 (enrdf_load_stackoverflow) | 1991-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4775611A (en) | Additive printed circuit boards with flat surface and indented primary wiring conductors | |
| US6689641B2 (en) | Wiring board and method of producing wiring board | |
| JPH035078B2 (enrdf_load_stackoverflow) | ||
| JPS58186993A (ja) | 印刷配線板の製造方法 | |
| JP4350922B2 (ja) | 両面可撓性回路基板の製造法 | |
| JPH08186373A (ja) | プリント配線板の製造方法 | |
| JPH04286389A (ja) | 回路基板の製造方法 | |
| US4835008A (en) | Process of forming breadboard interconnect structure having plated through-holes | |
| JP2617692B2 (ja) | 多層プリント配線板及びその製造方法 | |
| KR100601899B1 (ko) | 반도체 소자를 탑재하는 중공을 갖는 기판을 제조하는 방법 | |
| KR20070113706A (ko) | 리드선 없이 인쇄 회로 기판에 전해 금도금을 수행하는 방법 | |
| JPH10335786A (ja) | 高密度プリント配線基板の製造方法 | |
| CA1198524A (en) | Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same | |
| JP4147642B2 (ja) | プリント配線板の製造方法 | |
| JPH1197842A (ja) | プリント配線板の製造方法 | |
| JPS62156898A (ja) | スル−ホ−ルプリント配線板の製造方法 | |
| JPH02119298A (ja) | 半導体素子搭載用多層印刷配線板の製造方法 | |
| JPH05299836A (ja) | プリント配線板およびその製造方法 | |
| JPS6372189A (ja) | 回路板の製造方法 | |
| JP3729555B2 (ja) | プリント配線板 | |
| JP3817291B2 (ja) | プリント配線板 | |
| JP2015177018A (ja) | 配線板の製造方法 | |
| JPH09107170A (ja) | プリント配線板の製造方法 | |
| JPS613494A (ja) | プリント板製造方法 | |
| JPH08288644A (ja) | プリント基板の製造方法 |