JPS58185757A - 無電解めつき浴の再生方法 - Google Patents
無電解めつき浴の再生方法Info
- Publication number
- JPS58185757A JPS58185757A JP6736482A JP6736482A JPS58185757A JP S58185757 A JPS58185757 A JP S58185757A JP 6736482 A JP6736482 A JP 6736482A JP 6736482 A JP6736482 A JP 6736482A JP S58185757 A JPS58185757 A JP S58185757A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- exchange membrane
- bath
- complexing agent
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007772 electroless plating Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 title description 13
- 230000001172 regenerating effect Effects 0.000 title description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000010949 copper Substances 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 238000007747 plating Methods 0.000 claims abstract description 35
- 239000008139 complexing agent Substances 0.000 claims abstract description 25
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 14
- 239000003014 ion exchange membrane Substances 0.000 claims abstract description 10
- 239000012528 membrane Substances 0.000 claims abstract description 8
- 238000005341 cation exchange Methods 0.000 claims abstract description 7
- 230000007935 neutral effect Effects 0.000 claims abstract description 7
- 239000003011 anion exchange membrane Substances 0.000 claims abstract description 5
- 230000002378 acidificating effect Effects 0.000 claims abstract description 3
- 239000000243 solution Substances 0.000 claims description 17
- 238000011084 recovery Methods 0.000 claims description 7
- 239000008151 electrolyte solution Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000004064 recycling Methods 0.000 claims description 2
- 239000006227 byproduct Substances 0.000 abstract description 6
- 238000009825 accumulation Methods 0.000 abstract description 3
- 150000004699 copper complex Chemical class 0.000 abstract description 3
- 238000005868 electrolysis reaction Methods 0.000 abstract description 3
- 239000003792 electrolyte Substances 0.000 abstract 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- 239000007788 liquid Substances 0.000 description 17
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 238000001556 precipitation Methods 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 7
- -1 hydroxide ions Chemical class 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000012749 thinning agent Substances 0.000 description 6
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000001784 detoxification Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 101100234244 Arabidopsis thaliana KDTA gene Proteins 0.000 description 1
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- 206010008631 Cholera Diseases 0.000 description 1
- 208000006558 Dental Calculus Diseases 0.000 description 1
- 235000019738 Limestone Nutrition 0.000 description 1
- 239000004280 Sodium formate Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003010 cation ion exchange membrane Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 239000006028 limestone Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000012716 precipitator Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 1
- 235000019254 sodium formate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 235000019801 trisodium phosphate Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6736482A JPS58185757A (ja) | 1982-04-23 | 1982-04-23 | 無電解めつき浴の再生方法 |
| US06/372,133 US4425205A (en) | 1982-03-13 | 1982-04-27 | Process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath |
| DE8282400798T DE3272286D1 (en) | 1982-03-13 | 1982-04-30 | A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath |
| EP82400798A EP0088852B1 (en) | 1982-03-13 | 1982-04-30 | A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath |
| GB08212818A GB2117003B (en) | 1982-03-13 | 1982-05-04 | Apparatus and process for electroless plating bath regeneration |
| CA000418017A CA1220759A (en) | 1982-03-13 | 1982-12-17 | Regeneration of plating bath by acidification and treatment of recovered chelating agent in membrane cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6736482A JPS58185757A (ja) | 1982-04-23 | 1982-04-23 | 無電解めつき浴の再生方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58185757A true JPS58185757A (ja) | 1983-10-29 |
| JPS634634B2 JPS634634B2 (enExample) | 1988-01-29 |
Family
ID=13342877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6736482A Granted JPS58185757A (ja) | 1982-03-13 | 1982-04-23 | 無電解めつき浴の再生方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58185757A (enExample) |
-
1982
- 1982-04-23 JP JP6736482A patent/JPS58185757A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS634634B2 (enExample) | 1988-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1220759A (en) | Regeneration of plating bath by acidification and treatment of recovered chelating agent in membrane cell | |
| US5478448A (en) | Process and apparatus for regenerating an aqueous solution containing metal ions and sulfuric acid | |
| US4933051A (en) | Cyanide-free copper plating process | |
| JPH10317154A (ja) | 錫メッキ用溶液の再生方法およびその装置 | |
| US4435258A (en) | Method and apparatus for the recovery of palladium from spent electroless catalytic baths | |
| KR101797516B1 (ko) | 도금액으로부터 불순물의 제거방법 | |
| US6444112B1 (en) | Manufacturing method of electrodeposited copper foil | |
| US4906340A (en) | Process for electroplating metals | |
| JPH0416549B2 (enExample) | ||
| US3406108A (en) | Regeneration of spent ammonium persulfate etching solutions | |
| US4734175A (en) | Process for regenerating an electroless copper plating bath | |
| JPS58185757A (ja) | 無電解めつき浴の再生方法 | |
| KR100545664B1 (ko) | 기판의 구리 도금 방법 | |
| JP3254580B2 (ja) | エッチング廃液の処理方法及びエッチング廃液処理装置 | |
| US4416745A (en) | Process for recovering nickel from spent electroless nickel plating solutions | |
| US4302319A (en) | Continuous electrolytic treatment of circulating washings in the plating process and an apparatus therefor | |
| JPH06272096A (ja) | シアン化物を有していない銅メッキ浴の精製 | |
| KR870001547B1 (ko) | 무전해 도금욕 재생방법 및 그 재생장치 | |
| JP3468650B2 (ja) | 無電解ニッケルめっき方法 | |
| JPS599159A (ja) | 無電解めつき浴の濃度調整方法およびそれに使用する装置 | |
| CN114032558B (zh) | 一种从化学镀镍废液中电解制取NiP微米颗粒的方法 | |
| JPH07286279A (ja) | 無電解めっき方法 | |
| JP3339386B2 (ja) | 無電解めっき浴の処理方法 | |
| US4238314A (en) | Continuous electrolytic treatment of circulating washings in the plating process and an apparatus therefor | |
| CN1242095C (zh) | 无电解镀液的再生方法 |