JPS58184753A - 複合半導体装置の製造方法 - Google Patents

複合半導体装置の製造方法

Info

Publication number
JPS58184753A
JPS58184753A JP57068412A JP6841282A JPS58184753A JP S58184753 A JPS58184753 A JP S58184753A JP 57068412 A JP57068412 A JP 57068412A JP 6841282 A JP6841282 A JP 6841282A JP S58184753 A JPS58184753 A JP S58184753A
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor device
elements
functional element
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57068412A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0234465B2 (enExample
Inventor
Shoji Takishima
滝島　昭二
Tomoyuki Sato
佐藤　友之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faurecia Clarion Electronics Co Ltd
Original Assignee
Clarion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clarion Co Ltd filed Critical Clarion Co Ltd
Priority to JP57068412A priority Critical patent/JPS58184753A/ja
Publication of JPS58184753A publication Critical patent/JPS58184753A/ja
Publication of JPH0234465B2 publication Critical patent/JPH0234465B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W70/093—
    • H10W70/099—
    • H10W70/60—
    • H10W72/073—
    • H10W72/874—
    • H10W90/10—
    • H10W90/734—
    • H10W90/736—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP57068412A 1982-04-23 1982-04-23 複合半導体装置の製造方法 Granted JPS58184753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57068412A JPS58184753A (ja) 1982-04-23 1982-04-23 複合半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57068412A JPS58184753A (ja) 1982-04-23 1982-04-23 複合半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58184753A true JPS58184753A (ja) 1983-10-28
JPH0234465B2 JPH0234465B2 (enExample) 1990-08-03

Family

ID=13372929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57068412A Granted JPS58184753A (ja) 1982-04-23 1982-04-23 複合半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58184753A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142943A (ja) * 1984-08-06 1986-03-01 Clarion Co Ltd 複合半導体装置の製造方法
JPS63120481A (ja) * 1986-11-10 1988-05-24 Matsushita Electric Ind Co Ltd 薄膜ハイブリツドｉｃ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115553A (en) * 1980-02-18 1981-09-10 Fujitsu Ltd Method of mounting integrated circuit
JPS5943826A (ja) * 1982-09-04 1984-03-12 Sumitomo Metal Ind Ltd 高靭性電縫鋼管の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56115553A (en) * 1980-02-18 1981-09-10 Fujitsu Ltd Method of mounting integrated circuit
JPS5943826A (ja) * 1982-09-04 1984-03-12 Sumitomo Metal Ind Ltd 高靭性電縫鋼管の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142943A (ja) * 1984-08-06 1986-03-01 Clarion Co Ltd 複合半導体装置の製造方法
JPS63120481A (ja) * 1986-11-10 1988-05-24 Matsushita Electric Ind Co Ltd 薄膜ハイブリツドｉｃ

Also Published As

Publication number Publication date
JPH0234465B2 (enExample) 1990-08-03

Similar Documents

Publication Publication Date Title
US3952404A (en) Beam lead formation method
JPS62227300A (ja) 電気音響変換器
JPH08288786A (ja) 弾性表面波装置
JPS58172008A (ja) 圧電振動子の構造及びその製造方法
US4843035A (en) Method for connecting elements of a circuit device
JPS58184753A (ja) 複合半導体装置の製造方法
JPH0730362A (ja) 弾性表面波装置
JPS5895862A (ja) 積層構造半導体装置
JPH04150512A (ja) 表面弾性波素子
JPS63146699A (ja) ２次元アレイトランスデユ−サの製造方法
JPH0410649A (ja) ３次元実装用半導体基板の製造方法
JPS63212299A (ja) 超音波探触子とその製造方法
JPS5825254A (ja) 半導体装置およびその製法
JPH025329B2 (enExample)
JPS6142943A (ja) 複合半導体装置の製造方法
JPH0411440Y2 (enExample)
JPS6122660A (ja) 半導体装置
JPH041560B2 (enExample)
JPS5821432B2 (ja) ハンドウタイソウチ
JPS61194852A (ja) 半導体装置
JPH04135400A (ja) 超音波探触子
JPS58161354A (ja) 半導体装置
JP2001244787A (ja) 弾性表面波装置及びその製造方法
JPS60127762A (ja) 半導体装置とその製造方法
JPS6243170A (ja) 高周波用半導体装置