JPS58184204A - Epoxy resin composition for sealing semiconductor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an epoxy resin composition for semiconductor encapsulation, in which a novolac-type epoxy resin is used as a stylish epoxy resin, a phenol novolac resin is used as a curing agent,
And an epoxy resin composition for semiconductor encapsulation, which is prepared by mixing polyester elastomer 1 and 0.05 to 10 S of silica powder in the composition as a filler, and an epoxy resin composition containing 60 to 90 μ of silica powder as all essential components in the composition. It is highly durable, heat resistant, water resistant, and has excellent crack resistance.

The epoxy IIJNI composition for semiconductors is a polyfunctional epoxy compound,
It is widely known that the essential components are 7 enols as a curing agent, silica powder as a filler, and a curing catalyst.

In recent years, semiconductor devices have become larger and more highly integrated, and when semiconductor devices are encapsulated with conventional epoxy resin compositions, heat cycle tests show that NIK cracks have occurred in the encapsulation and chips. A problem has arisen in which the fineness of the semiconductor component is reduced, such as the occurrence of cracks. This is a polyfunctional epoxy that has been developed from the viewpoint of heat resistance and water resistance, and is made of phenols and silica for semiconductor encapsulation.The cured product of the composition is very hard and flexible. This is caused by a lack of.

K, which imparts flexibility to epoxy tNMK, is added as a dainty imparting agent. Example, 871 (7
Rustic material 15 (2751 ('?4) reference)
etc? When added, the flammability of the epoxy flanks is slightly improved, but the heat resistance is greatly reduced, making it unsuitable for use as a semiconductor encapsulation resin that requires a high degree of reliability.

The present inventors added woodcutter's rubber component ta while conducting research on Kame-Ruma-Kai point, and found that Ruru's substance exhibiting a specific rubber-like elasticity specifically maintained the heat resistance of semiconductor encapsulating resin. However, the present invention was completed based on the discovery that the crack resistance was significantly improved.

The structure of the present invention will be explained below. The novolac type epoxy resin used in the present invention is generally known, and examples include phenol novolac epoxy mm and cresol novolac epoxy resin. As a semiconductor encapsulation resin that requires reliability, it has excellent water resistance and has an Evoki equivalent of 180
~250 cresol novolak type epoxy resins are preferred.

The phenol novolak resin used in the present invention is known as a curing agent for epoxy*, but from the viewpoint of fluidity and heat resistance, it is preferably one with a molecular weight of 400 to 2,000, and a free phenol. It is preferable that the content is 8 or less.

In the uninvented trap, the blending ratio of the novolac type epoxy resin and the phenol novolak resin is preferably 0.5 to L, S in terms of the ratio of hydroxyl groups to epoxy groups.

The silica powder used in the present invention is f# fused silica, which is a natural crystalline silica, and its content is 50 to 50% in the composition.
90% by weight, preferably 65 to 80% by weight. or,
The maximum particle size of silica powder is 20% due to ease of molding.
It is 0μ or less, preferably Fitsoμ or less. In addition, the average particle size is 1-60μ, especially 5-2
6μ is preferred, and other fillers such as carbon fiber, glass fiber, nitrogen boron, and alumina powder may be added depending on the purpose without impairing the reliability of the sealing material.

All of the Magne 7A powder may be used in combination.□ The polyester elastomer used in the present invention has a 75% Vd1.80 (3jp 11-19).

p88-41 (1979) and Japan Rubber Association Magazine VO
1,511jp, 779-796 (1978), a heterogeneous block consisting of a hard part (hard segment) and a soft part (soft segment) with a certain length is two-dimensional. It is a type of thermoplastic elastomer that is repeatedly connected to each other, and is a polymeric material that exhibits elasticity and quality like vulcanized rubber at room temperature, and can be plasticized and molded at high temperatures. It is produced by a polycondensation reaction of , aromatic dicarpo yv, and polyalkylene ether glycol, and has a hard segment of a polyester part and a soft segment of a polyether part in its molecular structure.

An example of the polyester elastomer used in the present invention is as shown in formula (1) below.
Xn) and 0 parts of polyether soft segment (molecular weight approximately 1166Xm).

Molecular weight H of the polyether elastomer)-r- used in the present invention
6,000-60,000, preferably Fito, ooo
~4o, ooo - rIh, b, and it is preferable that the molecular weight of the soft segment in the molecule is larger than the molecular weight of the hard segment.

Polyester elast! - content in the composition is 0.0
6-10% by weight, particularly preferably 0.1-6%. (1
It's a weight fight. If the content of the polyester elastomer in the composition is less than 0.05, the crack resistance as a semiconductor encapsulating material is poor.
The epoxy resin composition for semiconductor encapsulation of the present invention as described above may optionally contain a silane cutting agent. It is also possible to add mold release agents, pigments, and aspergillus.

The specific ILvi will be explained below in Examples and Comparative Examples.Example 1 Cresol novolak type epoxy @ resin
CN220L, Sumitomo Chemical Co., Ltd. 1! After heating and mixing 87 parts of polyester elastomer (product name: Pelprene P-40H, manufactured by Toyobo Co., Ltd.) and dispersing the polyester elastomer in the epoxy resin, the polyester elastomer was cooled and crushed to obtain polyester elastomer modified epoxy 71111k.
(1) was obtained. This resin was mixed with other:□'::raw materials in the proportions shown in Table 1, heated and kneaded with hot rolls, and cooled to obtain a sealing material.Amount of polyester elastomer in this sealing material ti2.8 weight.

A test piece was made using this material and heated to 175°C.
The glass transition temperature was measured for the sample which had been subjected to Bostkie air for 5 hours. Father, molded into 40pin I C1 and aired in silicone oil at 150℃ 60
A heat cycle test was conducted in which the IC was immersed in liquid nitrogen for 60 seconds, and how many cycles did it take before cracks appeared on the surface of the IC's sealing resin? Examined. Furthermore, after molding, the post-aired test piece was subjected to humidification treatment for 100 hours in a steam pressure cooker at 121°C and 2 atm, and the volume resistivity was measured before and after this treatment. These results 1
Shown in the table. The crack resistance is very high when compared to the one that does not contain polyester elastomer (Comparative Example 8).
It has a low value and is a material that is resistant to thermal shock. or,
Glass transition -1 and volume resistivity are almost the same as those without polyester elastomer.

Example 2 Cresol novolak epoch resin (trade name, hi8
97 parts of CN220L (manufactured by Sumitomo Chemical Co., Ltd.) and part a of polyester elastomer (product name: Hytrel 4056, Devon IM) were heated and mixed, and the mixture was dispersed in polynisdel elastomer t epoxy resin, cooled, and crushed. And the polyester elastomer plexus epoxy side Wa (
Got a 2+. This resin is mixed with other raw materials in the proportions shown in the table below, and the polyester elastomer content is 0.
．． The various tests for the sealing material t*ye-0 with 54 layers were conducted in the same manner as in Example 1. This result is the first *
It was shown to. Polyester elastomer content is implemented fI
Although the crack resistance is less than 11, there is a significant difference in crack resistance compared to the product without polyester elastomer and the product with readability agent (Comparative Example 8.4), and is resistant to thermal shock. It is a material. Also glass transition temperature,
The volume resistivity is also equal to or higher than those.

Example 8 Cresol novolak epoxy tree jlk (product name; 1
8cN220L, manufactured by Sumitomo Chemical ■) Tell and 80 parts of polyester elastomer (product name: Hytrel 4066, manufactured by Depond) were heated and mixed to form a polyester elastomer! - is dispersed in epoxy resin, cooled and pulverized, polyester, and elastomer-modified epoxy resin (3
) was obtained. Using this tree Wj1, other raw materials were mixed in the proportions shown in the ta1 table to obtain a sealing material with a polyester elastomer content of 5.11% by weight. Various tests were carried out in the same manner as in Example 1. I did it.

The results are shown in Table 1. The crack resistance of this sealing material also showed a very high value, and no significant decrease in glass transition temperature t4 was observed.
cN! ! ! ! ! OL, manufactured by Sumitomo Chemical Industries) SOS and polyester elastomer (product name: PES-P vyP-40
H,) K Yobo 11ml 1l) 40 parts and mixed with heat,
After dispersing the polyester elastomer in the epoxy resin, it was cooled and pulverized to obtain a polyester elastomer-modified epoxy side fat (4). This resin was combined with other raw materials in the proportions shown in Table 1 to obtain a sealing material with a polyester elastomer content of 8.5111%.

The various tests were conducted in the same manner as in Example 1. The results are shown in Table 1. The crack resistance of this sealing material is also at a very high level, and the decrease in glass transition temperature is not so great.

Comparison? ! 11.2 In Example I, the amount of polyester elastomer used to adjust the polyester elastomer modified epoxy resin Mtl was adjusted to 0.1 part 799 and 9 parts (epoxy resin mold 11 and 50 parts/60 parts) to the epoxy resin. Polyester Ella... (Stomer-modified epoxy 1M resin (51, (6)) was obtained and used to prepare a test piece using a sealing material prepared in the same manner with the composition ratio shown in Table IK1. Table 1 shows the results of a similar test using the polyester elastomer.The amount of polyester elastomer in the sealing material was 0.061 parts or less (0.02 parts, Comparative Example 1), and the crack resistance was completely improved. However, when the amount of polyester elastomer exceeds 10% (12.0 parts, Comparative Example 2), the crack resistance improves, but the volume resistivity after steam pressure cooker treatment decreases. The object of the present invention is not satisfied due to the large decrease in .

Comparative Example 8 Flexibility imparting agent for epoxy resin DER786 (Dov
After heating and kneading the raw materials mixed in the composition ratios shown in Table 1 with a hot roller, the raw materials were cooled and crushed to obtain a sealing material. Table 1 shows the results of a post-layering test conducted on this sealing material in the same manner as in Example 1. ・Has:: □11, Comparing with the material without the flexibility imparting agent (Comparative Example 8), the results are clear. Polyester elastomer improves crack resistance! The level is lower than when - is mixed, and the decrease in volume resistivity after steam pressure cooker treatment is large, and high reliability is required and it is insufficient as an L sealing material.

Comparative Example 4 Flexibility imparting agent for epoxy resin Epikote871
(manufactured by Shell), a sealing material was obtained in the same manner as in Comparative Example 8 using raw materials mixed at the composition ratio of the first coating. Using this sealing material, a test was conducted after trap formation in the same manner as in Example 1. tc results'f
r Shown in Table 1.

As in the case of Comparative Example 8, it is observed that the crack resistance of the plexus improves as the VC increases, but the volume resistivity decreases after steam pressure and treatment, that is, the water resistance worsens.

Comparative Example 5 Styrene-butadiene rubber (trade name: J8R160G
, E1 synthetic rubber manufactured in-house) Example 1 using 180 parts of t-
A rubber-modified epoxy resin (1) was obtained by preparing in the same manner as above.

Using this resin, other raw materials tS are prepared in the composition ratio shown in Table 1.
The test results were shown in Table 1 in the same manner as in Example 1.

Although the crack resistance was improved compared to the sample containing no modifier (Comparative Example 8), no improvement effect was observed in Examples 1 to 4 in which the polyester elastomer was modified.

Comparative Example 6 Ninitrile rubber (trade name: J8R220S, Japan Synthetic Rubber) was used instead of polyester elastomer in Example I.
Rubber-modified epoxy resin (2) was prepared in the same manner as in Example 111 using 18 parts of Rubber-modified epoxy resin (2). Table 1 shows the results of using this **1 and combining it with other raw materials at the composition ratios shown in Table 1. In this case as well, the crack resistance was improved when compared with the material containing no modifier (Comparative Example 8), but no improvement effect was observed in Examples 1-4 in which the polyester elastomer was modified.

Comparison @'1 In Example 1, bK ethylene rubylene rubber (trade name: J8REP11X,
Day! Using 18 parts of synthetic "AmwI", Kv14 was combined in the same manner as in Example 1 to obtain a rubber-modified epoxy resin (3). Using this resin, other raw materials were mixed in the composition ratios shown in Table 1. The results of the test after molding in the same manner as in Example 1 were as follows.
Shown in the table. In this case as well, similar to Comparative Example 5.6 in which styrene-butadiene rubber and nitrile rubber were used, no improvement in crack resistance was observed compared to the modified polyester elastomer tl.

Comparative Example 8 Table 1 shows the results of a molding test similar to Example 1 for a sealing material prepared with the composition shown in Table 1 without using a polyester elastomer, a fusibility-imparting agent, and rubber. Products that do not contain modifiers have poor crank resistance.

Procedural amendment (voluntary) 3rd year of 1981
On the 27th, Mr. Commissioner of the Japan Patent Office1, Indication of the case Patent Application No. 66035 of 1982 Title of the invention Epoxy resin composition for semiconductor encapsulation 1 Relationship with the case by the person making the amendment (I?? Patent Application Applicant of the amendment) The following amendments will be made to the "Detailed Description of the Invention" column of the subject specification and the "Detailed Description of the Invention" column of the description of contents of the amendment.

■ "Nitrogen boron" in the second line of page 5 is replaced with "boron nitride"
Correct to.

■ On the 6th line and 5th line from the bottom of page 6 (2 places)
Correct "molecular weight" to "amount".

■ Correct the 1-larger J in the 5th line from the bottom of the 6th page to ``more''.

■ In Table 1, between the rows ``carnauba wax (parts)'' and ``silica powder (parts),'' there is a Insert a row and paste Examples 1 to 4 of that row. Insert "2" as the value for each of Comparative Examples 1 to 8 (total of 12 findings"'1 18

Claims (1)

[Claims] Nohoranoku type epoxy 71148d as epoxy resin,
For semiconductor encapsulation, a phenol novolac resin is used as a curing agent, and a polyester elastomer t0, 05-101 is mixed with an epoxy resin composition in which 50-9θi11% silica powder is an essential component in the composition. Epoxy resin composition.