JPS58182436U - IC package for 3D mounting - Google Patents

IC package for 3D mounting

Info

Publication number
JPS58182436U
JPS58182436U JP7963782U JP7963782U JPS58182436U JP S58182436 U JPS58182436 U JP S58182436U JP 7963782 U JP7963782 U JP 7963782U JP 7963782 U JP7963782 U JP 7963782U JP S58182436 U JPS58182436 U JP S58182436U
Authority
JP
Japan
Prior art keywords
package
mounting
recorded
dimensional mounting
dimensionally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7963782U
Other languages
Japanese (ja)
Inventor
角田　眞治
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to JP7963782U priority Critical patent/JPS58182436U/en
Publication of JPS58182436U publication Critical patent/JPS58182436U/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ、　ｂ、　ｃは従来のＩＣパッケージの平面図
、正面図、側面図、第２図ａ、　　ｂ、　　ｃは本考案
のＩＣパッケージの平面図、正面図、側面図、−第３図
は本考案による立体実装の一実施例、第４図は本考案に
よる基板積層の立体実装の実施例、第５図は本考案の接
続用ピンの一実施例である。 １・・・ＩＣパッケージ、２．３・・・接続用ピン、４
・・・ソケット、５・・・基板。Figures 1 a, b, and c are a plan view, front view, and side view of a conventional IC package; Figures 2 a, b, and c are a plan view, front view, and side view of an IC package of the present invention; The figure shows an example of three-dimensional mounting according to the present invention, FIG. 4 shows an example of three-dimensional mounting of board stacking according to the present invention, and FIG. 5 shows an example of a connecting pin according to the present invention. 1...IC package, 2.3...Connection pin, 4
... Socket, 5... Board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一　、　ＩＣパッケージの上下２方向に接続用ピンをと
り出すことにより複数のＩＣパッケージを立体的に実装
できることを特徴とする３次元実装用ＩＣパッケージ。1. An IC package for three-dimensional mounting, characterized in that a plurality of IC packages can be mounted three-dimensionally by taking out connection pins in two directions, top and bottom of the IC package.
JP7963782U 1982-05-29 1982-05-29 IC package for 3D mounting Pending JPS58182436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7963782U JPS58182436U (en) 1982-05-29 1982-05-29 IC package for 3D mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7963782U JPS58182436U (en) 1982-05-29 1982-05-29 IC package for 3D mounting

Publications (1)

Publication Number Publication Date
JPS58182436U true JPS58182436U (en) 1983-12-05

Family

ID=30088815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7963782U Pending JPS58182436U (en) 1982-05-29 1982-05-29 IC package for 3D mounting

Country Status (1)

Country Link
JP (1) JPS58182436U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200559A (en) * 1984-03-26 1985-10-11 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60200559A (en) * 1984-03-26 1985-10-11 Hitachi Ltd Semiconductor device

Similar Documents

Publication Publication Date Title
JPS58182436U (en) IC package for 3D mounting
JPS6071146U (en) semiconductor equipment
JPS58115093U (en) Double structure socket for IC
JPH01127176U (en)
JPS6063975U (en) Lead plate
JPS59160647U (en) Block connection structure
JPS6078158U (en) hybrid integrated circuit board
JPS6013730U (en) Bypass capacitor for power supply
JPS6068058U (en) Corner packaging tool
JPS6127258U (en) semiconductor equipment
JPS6033446U (en) IC package
JPS5899788U (en) IC socket
JPS593817U (en) folding case
JPS5829982U (en) Container for transporting bicycle bells
JPS5936259U (en) Polygonal Pinch Tupkyaria
JPS6127249U (en) integrated circuit package
JPS58194114U (en) packaging box
JPS6027452U (en) integrated circuit packaging
JPS603806U (en) optical module
JPS58184849U (en) semiconductor equipment
JPS6312855U (en)
JPS6172865U (en)
JPS6328278U (en)
JPS58122456U (en) Case for hybrid integrated circuit
JPS6038217U (en) packaging box