JPS58182280A - Photo detector - Google Patents
Photo detectorInfo
- Publication number
- JPS58182280A JPS58182280A JP57064799A JP6479982A JPS58182280A JP S58182280 A JPS58182280 A JP S58182280A JP 57064799 A JP57064799 A JP 57064799A JP 6479982 A JP6479982 A JP 6479982A JP S58182280 A JPS58182280 A JP S58182280A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light
- film
- gate
- pyroelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】 から成る光検出器に関するものでるる。[Detailed description of the invention] This article concerns a photodetector consisting of:
周知のように従来ホットダイオードホトトランジスタな
ど種々の光検出器が提案,実用化されているがこの光検
出器は主に半導体材料を用いたものが多く、そのエネル
ギーギャップから制限される検出可能な波長に限界金有
し、使用上不便な場合がある。As is well known, various photodetectors such as hot diode phototransistors have been proposed and put into practical use, but most of these photodetectors are mainly made of semiconductor materials, and their detection capability is limited by their energy gap. It has a wavelength limit and may be inconvenient to use.
本発明は光検出感度の波長依存性が少く、又コストも従
来の光検出器に比較して低いものtP提供するものでる
る。以下図面によp本発明の詳細な説明する。The present invention provides a photodetector with less wavelength dependence and a lower cost than conventional photodetectors. The present invention will be explained in detail below with reference to the drawings.
本発明による光検出器は通常のMOS電界効果トランジ
スタの構造と類似しておシ、第1図に示す様な構造を有
する。パイレックスガラスなどの安価な透明基板11に
強誘電体材料などの自発分極を有する焦電体材料でるる
S電体12を付着させ、更にポリシリコン又はアモルフ
ァスシリコンなどの半導体厚III117,18.19
を設ける。該7リコン等の半導体7111111 7.
1 9Vi通常ノM。The photodetector according to the invention has a structure similar to that of a conventional MOS field effect transistor, as shown in FIG. An S electric body 12 made of a pyroelectric material having spontaneous polarization such as a ferroelectric material is attached to an inexpensive transparent substrate 11 such as Pyrex glass, and a semiconductor thickness III such as polysilicon or amorphous silicon is further applied.
will be established. Semiconductor 7111111 such as 7 recon 7.
1 9Vi normal no M.
S型電界効果トランジスタのソース,ドレインへ111
l/iサブストレートに相当するもので導電型は各々p
+. nでろ夛、nチャンネルトランジスタの例である
。16は光遮蔽膜でるる。14は通常のケート用シリコ
ン酸化属でめり、15はノース。111 to the source and drain of the S-type field effect transistor
It corresponds to the l/i substrate, and the conductivity type is p.
+. This is an example of an n-channel transistor. 16 is a light shielding film. 14 is a regular silicon oxide metal for Kate, and 15 is North.
ドレインを外部と電気的に接続する金属配線である。ま
fcJIl[電体12の少くとも片側に電極13を設け
て構成してるる。This is a metal wiring that electrically connects the drain to the outside. [Constructed by providing an electrode 13 on at least one side of the electric body 12.
次にこの光検出器を#I2図の様に電気的に接続する。Next, this photodetector is electrically connected as shown in diagram #I2.
第2図かられかるように通常のMO8電界効果トランジ
スタの浮遊ゲート構造と類似しており、ドレイン21は
第1図の半導体厚a19に相当1以下同僚にソース22
は半導体博ml 7.サプス) L/ −) 2
3 仁を半導体薄膜 18. ゲー ト 24 は
焦電体12.シリコン酸化膜14にゲート電極25は電
極13に相当する。ソース22.ドレイン21間にバイ
アス26を印加し負荷27を接続しておき、更に負荷2
7にあられれた信号を信号処理系28にて増幅するなど
して検出する。As can be seen from FIG. 2, it is similar to the floating gate structure of an ordinary MO8 field effect transistor, and the drain 21 is equivalent to the semiconductor thickness a19 in FIG.
Semiconductor Expo ml 7. Saps) L/-) 2
3. Semiconductor thin film 18. The gate 24 is a pyroelectric material 12. The gate electrode 25 on the silicon oxide film 14 corresponds to the electrode 13. Source 22. A bias 26 is applied between the drain 21 and a load 27 is connected, and then a load 27 is connected between the drains 21 and 21.
7 is amplified by a signal processing system 28 and detected.
又第1図に於いてhvにて示した様な入射光102は透
明基板11を透過し光吸収体11Gにて熱変換される。Further, incident light 102 as indicated by hv in FIG. 1 passes through the transparent substrate 11 and is thermally converted by the light absorber 11G.
このとき焦電体12の温度は、光入射のない場合に比較
し上昇する。周昶の様に焦電性材料の自発分極は温度に
よって変化するので、光入射により焦電体12の自発分
極はApsだけ変化する。?[極13が第2図のように
ソース22に短絡され接地電位に保たれていれば、焦電
体12のシリコン酸化膜14のゲート側には光入射の有
無により異った童の載荷があられれ、従ってシリコン酸
化膜14を介してサブストレート18のシリコン酸化膜
14との界面付近に最も強く電界の変化金もたらす。よ
ってソース22.ドレイン21の間の導電性は光入射の
有無により変化し、負荷27′fr流れる電流は変化す
る。以上の様に光検出器としての動作が説明される。At this time, the temperature of the pyroelectric body 12 increases compared to the case where no light is incident. Since the spontaneous polarization of a pyroelectric material changes depending on the temperature, as in the case of Shusho, the spontaneous polarization of the pyroelectric material 12 changes by Aps due to the incidence of light. ? [If the pole 13 is short-circuited to the source 22 and kept at ground potential as shown in FIG. Therefore, the electric field changes most strongly near the interface between the substrate 18 and the silicon oxide film 14 via the silicon oxide film 14. Therefore, source 22. The conductivity between the drains 21 changes depending on the presence or absence of light incidence, and the current flowing through the load 27'fr changes. The operation as a photodetector will be explained as above.
本発明に↓る光検出器は波長感度が赤外から可視の広い
範囲にわたり平担である長所を有する。The photodetector according to the present invention has the advantage that the wavelength sensitivity is flat over a wide range from infrared to visible light.
即ち本籍性は光吸収体110の吸収特性によってその波
長感度が決まるが、例えば良く知られたいわゆる全黒(
ゴールドブラック)と呼ばれる吸収体を用いたとき赤外
領域から可視光全搬にわたシ平担な吸収特性をもつ。全
黒はまた薄膜化できることもすでに良く知られておシ、
種々の用途に用いられている。以上の様に本発明による
光検出器は本質的には熱検出器であり、通常の半導体光
検出器の様な感度の波長依存性が少く有利でるる。That is, the wavelength sensitivity of the light absorber 110 is determined by the absorption characteristics of the light absorber 110.
When using an absorber called Gold Black, it has flat absorption characteristics from the infrared region to the entire visible light spectrum. It is already well known that all black can also be made into a thin film.
It is used for various purposes. As described above, the photodetector according to the present invention is essentially a thermal detector, and is advantageous in that its sensitivity is less dependent on wavelength, unlike ordinary semiconductor photodetectors.
更に熱検出器としては、マイクロ秒程度の応答速度をも
つ光検出器でめることはすでに焦電検出器の一般的な特
性をもつことは良く知られて&シ、本発明による光検出
器の場合も例外ではない同本発明に用いる光検出器の焦
電体12の材料としては艮く知られている様にチタン1
m!i!鉛(p b T ios )。Furthermore, as a heat detector, it is well known that a photodetector with a response speed on the order of microseconds has the general characteristics of a pyroelectric detector. This case is no exception.As is well known, titanium 1 is used as the material for the pyroelectric material 12 of the photodetector used in the present invention.
m! i! Lead (pbTios).
タンタル酸リチウム(”aos ) e 億rlRミグ
リシン(適材TGSと呼ばれる。)など数多くのものが
あり、これらは例えば高周波スパッタ法、蒸着法などに
より薄膜化し、原電体として良質のものが得られる。ま
た半導体薄膜17,18.19に関しては化学的気相成
長法などによシデモルファスシリコン、カドミウム七V
ンなどを容易に形成できる技術レベルにある。他にシリ
コン酸化1I114あるいは金属配線15なども現今の
シリコン集積回路技術などを駆使すれば、いずれも困殖
なく形成でさるものであることは言うまでもない。There are many materials such as lithium tantalate (AOS) and RMI-glycine (referred to as TGS), which can be made into thin films by high-frequency sputtering, vapor deposition, etc., and can be made into high-quality raw materials. Semiconductor thin films 17, 18, and 19 are made of sidemorphous silicon, cadmium 7V, etc. by chemical vapor deposition, etc.
The technology level is such that it is possible to easily form a mold, etc. It goes without saying that silicon oxide 1I 114 and metal wiring 15 can also be formed without any difficulty by making full use of current silicon integrated circuit technology.
同本発明の*画例に係る光検出器の構造はMO8型電界
効果トランジスタの例であるが、本例に限定されるもの
ではなく、他の電界効果トランジスタにも適用される。Although the structure of the photodetector according to the *illustration example of the present invention is an example of an MO8 field effect transistor, it is not limited to this example and can be applied to other field effect transistors.
以上の如く本発明は無電体材料と主にIIE界効、米ト
ランジスタとを組合わせたρ価な、かつ彼パ長感匿依存
性の少い光検出器として有効である。As described above, the present invention is effective as a photodetector which combines a non-electric material, mainly an IIE field effect, and a rice transistor, and which has a high ρ value and has little dependence on hepato length sensitivity.
第1図は本発明の実施例に係る光検出器の断面図、第2
図は第1図の光検出器の電気的結線図。
11・・・透明基板
12・・・焦電体
13・・・電極
14・・・シリコン酸化膜
16・・・光遮蔽婁
17、18.19−・・半導体NBN
110−・・光吸収体FIG. 1 is a sectional view of a photodetector according to an embodiment of the present invention, and FIG.
The figure is an electrical wiring diagram of the photodetector shown in FIG. 1. 11... Transparent substrate 12... Pyroelectric body 13... Electrode 14... Silicon oxide film 16... Light shielding layer 17, 18.19-... Semiconductor NBN 110-... Light absorber
Claims (1)
スタ構造全盲することを特許とする光検出器。 (2)′亀界効釆トランジスタtasniiトランジス
タであること全特徴とする特許請求の軛128第1項記
載の光検出器。[Claims] (A photodetector patented as having a totally blind field effect transistor structure in which a 11g conductive material is provided in the gate portion. (2) All features of being a 'Turtle field effect transistor TASNII transistor. A photodetector according to claim 128.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57064799A JPS58182280A (en) | 1982-04-20 | 1982-04-20 | Photo detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57064799A JPS58182280A (en) | 1982-04-20 | 1982-04-20 | Photo detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58182280A true JPS58182280A (en) | 1983-10-25 |
Family
ID=13268644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57064799A Pending JPS58182280A (en) | 1982-04-20 | 1982-04-20 | Photo detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58182280A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182624A (en) * | 1990-08-08 | 1993-01-26 | Minnesota Mining And Manufacturing Company | Solid state electromagnetic radiation detector fet array |
US5273910A (en) * | 1990-08-08 | 1993-12-28 | Minnesota Mining And Manufacturing Company | Method of making a solid state electromagnetic radiation detector |
CN109786498A (en) * | 2018-12-10 | 2019-05-21 | 华南理工大学 | A kind of infrared detector cell and preparation method thereof based on two-dimensional semiconductor material |
-
1982
- 1982-04-20 JP JP57064799A patent/JPS58182280A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182624A (en) * | 1990-08-08 | 1993-01-26 | Minnesota Mining And Manufacturing Company | Solid state electromagnetic radiation detector fet array |
US5235195A (en) * | 1990-08-08 | 1993-08-10 | Minnesota Mining And Manufacturing Company | Solid state electromagnetic radiation detector with planarization layer |
US5273910A (en) * | 1990-08-08 | 1993-12-28 | Minnesota Mining And Manufacturing Company | Method of making a solid state electromagnetic radiation detector |
CN109786498A (en) * | 2018-12-10 | 2019-05-21 | 华南理工大学 | A kind of infrared detector cell and preparation method thereof based on two-dimensional semiconductor material |
CN109786498B (en) * | 2018-12-10 | 2021-04-06 | 华南理工大学 | Infrared detection element based on two-dimensional semiconductor material and preparation method thereof |
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