JPS5817867A - Surface treatment method of plate having small hole and its device - Google Patents

Abstract

PURPOSE:To perform a uniform surface treatment to the surface and the inside surface of a small hole at a high speed, by making a treatment liquid flow at a high speed along the side of a plate having the small hole. CONSTITUTION:When a plate 8 is led into a treatment chamber 1a through a carrying device, a flow course 14 being narrow in width d2 is formed between a side 8a of the plate 8 and a wall surface 2a, which are between walls 2, 3 opposed at an interval d1 being narrow in width. When a plating liquid A is fed from a nozzle chamber 18, the plating liquid A becomes a high speed flow, flows to the upper end from the lower end of the plate 8 in the flow course 14, overflows the wall 3, and flows out into a collecting chamber 16. On the other hand, the plating liquid A fills a flow course 15, but since it flows in the flow course at a high speed, the inside of a small hole 22 of the plate 8 is converted to negative pressure, and the liquid is absorbed through the small hole 22 from the flow course 15 side. In this state, anodes 4, 5 and the plate 8 are converted to an anode and a cathode by electrification, and both sides 8a, 8b of the plate 8 and the inside surface of plural small holes 22 are plating-treated at a high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for surface treatment of a plate having a plurality of micropores in the porosity.

To the best of the present inventor's knowledge, there are not many methods and apparatuses for efficiently applying plating, etching, activation, degreasing, rust prevention, and other surface treatments to plates with small holes as objects to be treated. There are very few techniques for surface-treating not only the side surfaces but also the inner surfaces of small holes, such as techniques for copper-plating printed wiring boards. The inventor of the present invention has conducted various experiments focusing on these situations, and has found that when surface treatment is applied as described above, a high-velocity flow of treatment liquid is applied along the sides of the plate. Based on the knowledge that surface treatment can be carried out extremely efficiently, we propose the method and apparatus according to the present invention.

In the surface treatment method according to the present invention, first, a narrow processing chamber is prepared, and a "plate with small holes" as an object to be processed is guided into this processing chamber. There are nine plates depending on the surface treatment, such as printed wiring boards,
In the above and following explanations, the term "plate" refers to a wide range of objects to be processed, including plates, sheets, coils, strips, films, etc. Next, a narrow space between the side surface of such a plate and the wall surface of the processing chamber [for example, 2III11-50
The process is performed by flowing the processing liquid in a high-speed flow along one side of the plate from one end to the other at a distance of M.

The directionality of the processing liquid flowing along one side of the plate is not particularly limited, and as long as the processing liquid can be flowed from one end of the plate to the other end, the directionality, such as up and down, left and right, front and back, does not matter. At this time, the other side of the plate [other side] VC
If so, it is sufficient to flow a processing liquid at a speed slower than the above-mentioned high-speed flow, or simply to allow the processing liquid to exist.The processing liquid may be an appropriate surface treatment liquid depending on the content of the surface treatment, such as a copper plating solution. It is a matter of great debate that etching solutions for electrolytic and non-electrolytic etching, activating solutions, degreasing solutions, anti-corrosion solutions, and others should be selected.

In this way, the side surface of the plate serving as the object to be treated, particularly the side surface to which the high-speed flow has been applied, will be surface-treated at high speed. When the processing liquid is applied to the narrow space between one side of the plate and the wall of the processing chamber, the processing liquid is present on the other side of the plate (other side), or in addition to being simply present, the high-speed flow If the treatment is carried out at a slower speed, a speed difference will occur between the processing liquid on both sides of the plate, creating a negative pressure in each of the small holes of the plate, and the processing liquid will flow from the non-high-speed flow side to the high-speed flow side. As it is sucked in, a uniform surface treatment is applied not only to one or both side surfaces but also to the inner surface of the small hole.

Next, a surface treatment apparatus according to the present invention will be explained. This device is mainly composed of a processing chamber and a nozzle chamber. A narrow channel for processing liquid corresponding to the length of the plate is formed between the side surface and the corresponding wall surface.

The nozzle chamber is configured to supply a uniform high-speed flow of processing liquid to a narrow flow path within the processing chamber.

Next, details of the present invention [apparatus] will be explained with reference to the drawings.

1 to 4 are diagrams showing one embodiment of the apparatus. In this embodiment, the processing chamber 1 is formed in a vertical shape, and the first
It includes a processing chamber 1a and a second processing chamber 1b. The first processing chamber 1a has a pair of narrow walls λ3 that face each other.The inside of the figure shows a narrow interval.The inside of the wall 2.3 has an anode 4.5 in the shape of a plate or menu. are provided and each anode 4.5 is connected to a rectifier 6.

A guide 7 is used for transporting and positioning the plate 8, and is formed approximately in the center of the processing chamber 1a and extending in the longitudinal direction. The processing chamber 1 is transferred to the plate 8 via the conveyance device 9.
It is intended to be guided into tL. In the illustrated example, the conveyance device 9 is composed of a chain conveyor 10 and a pair of hanging clips 12 via an insulating base 11, and suspends the plate 8 continuously or intermittently within the processing chamber 1a. It is intended to be transported to Reference numeral 13 is a carbon brush, wire brush, or the like, and the holding clip 12 is energized to turn the plate 8 into a cathode. Processing room 1
The side surface 8I of the plate 8 in the state where the plate 8 is guided into the inside a! A narrow flow path 14 for a processing liquid (hereinafter referred to as plating liquid) A corresponding to the length l of the plate 8 is formed between L and the side surface 8aK and the troublesome wall surface 2a. A second flow path 15 is formed between the side surface 8b of the plate 80 and the wall surface 3a.

16 is a recovery chamber for the processing liquid A, which is adjacent to the processing chamber 1a. A recovery pipe 17 is connected to a plating liquid tank (not shown).

A nozzle chamber 18 is integrally provided on the bottom side of the processing chamber 1a, and has a rectifying plate 19 provided inside thereof in the longitudinal direction, and a nozzle port 20 is connected to the narrow flow path 14 of the processing chamber 1a.
It is in communication with.

Reference numeral 23 denotes a locking device which allows the plate 8 to move forward and backward in the direction of travel within a range within which it does not come off the guide 7, and employs a cam 24, a sprocket 25, and other mechanical or electrical means. The direction of plate Bo locking may be any direction that intersects the axial direction of the small hole 22 of the plate 8, and is not limited to "back and forth" as described above, and the state of motion may also be reciprocating motion, circular motion, or elliptical motion. Those who have the same amount of money will be accepted in the recruitment process. This locking device 23 is used to give movement to the plate 8 to make the surface treatment around the small holes 220 uniform. For example, during copper plating, marks in the flow direction of the plating solution are left in the vicinity of the openings of the small holes 22. This prevents the occurrence of the so-called "sloppy phenomenon".

In the second processing chamber 1b, a narrow channel 21 is formed between the side surface 8b of the plate 80 and the wall surface 3a, and the other structure is almost symmetrical to the first processing chamber 1a. Identical or similar parts are indicated by the same reference numerals in the drawings, and explanation thereof will be omitted.

Next, the action will be explained.

When the plate 8 is guided into the processing chamber 1sL via the transport device 9, the plate 8 is positioned at the center of the processing chamber 1a by the guide 7, and as a result, the walls 2.3 facing each other at a narrow interval d. between the side surface 8a of the plate 8 and the wall surface 2
A narrow channel 14 is formed between a and a. When the plating solution A is supplied from the nozzle chamber 18, the plating solution becomes a high-speed flow and flows through the channel 14 from the lower end (one end) to the upper end (other end) K of the plate 8, overflowing the wall 3. It flows out into the recovery chamber 16. On the other hand, the plating solution A fills the 20th channel 15 as shown by arrow The plating liquid is sucked in from the second flow path 15 side through the small hole 22 as shown by arrow Y, and flows out to the flow path 14 side. Such a state sVc φ
By turning the anode 4.5 and the plate 8 into anodes and cathodes by energizing, the plating process on both sides 8 & 8b of the plate 80 as well as the inner surfaces of the plurality of small holes 22 is performed at an extremely high speed. I'll go.

FIGS. 5 to 7 are views showing other embodiments of the present invention [apparatus]. In these embodiments, the processing chamber 1a,
Each of the processing chambers 30 formed in a vertical shape with respect to IbK is one
Both sides aa and ab of the plate 8 and the corresponding wall surface 2a are shown.
, 3ar & 15 are formed with narrow passages 31 and 32 for the plating liquid A corresponding to the length lVc of the plate 8, and a nozzle chamber 33 and a processing chamber that supply a uniform high-speed flow of the plating liquid A. 30, there is a flow path switching device 3 that guides the plating solution A to either or both of the flow paths 31 and 32.
4.35.36 is established. In the embodiment shown in FIG. 5, the flow path switching device 34 has a valve body 38 which is slidable by a pressure cylinder 37, and in the embodiment shown in FIG. The valve body 40 and, in the embodiment of FIG.
"Side wall attached element" are respectively shown. These flow path switching devices 34.3! x36 indicates both narrow channels 31.
32 alternately serve to direct a uniform, high-velocity flow of plating fluid, but can also serve to direct both into two narrow channels 31,32.

For other configurations, see the previous embodiment [Figures 1 to 4]
The same or similar parts are designated by the same reference numerals and repeated explanations will be omitted. In each of the embodiments shown in FIGS. 5 to 7, two rectifiers 41 and 42 are connected to the anodes 4 and 4, respectively.
5, a high current is applied to the anode 4 or 5 through which the plating solution A flows, and the anode 5 through which the plating solution A does not flow.
Or, it is summed so that a low current flows through 4.

A pair of recovery chambers 16tj are formed in the processing chamber 30.

Next, the effect will be explained. When the plate 8 is guided into the processing chamber 30 via the transport device 9 and is in good condition, the flow path switching device 34
．． 35 and 36 to open the flow path 31 and close the flow path 32, the plating liquid supplied from the nozzle chamber 33 becomes a high-speed flow and enters the flow path 31 from the lower end (one end) of the plate 8 to the upper end. (the other end), flows along the side surface 8aK of the plate 8, crosses the upper end of the plate 8, and a part of it enters the flow path 32, and both flow paths 31 and 32 are filled and a part of the flow reaches a good condition. 2.3 overflows and flows into the collection chamber 16.

At this time, as a result of the high-speed flow of plating solution A flowing in the flow path 31,
As in the previous embodiment, the plating liquid in the flow path 32 is sucked in, flows through the small hole 22 [arrow Y], and flows out to the flow path 4 side, and in this state, the anode 4.5 and When the plate 8 is energized and turned into an anode and a cathode, both sides 8'L%8b of the plate 8 are plated and the small holes 22 are formed.
The plating process on the inner surface of the plate is performed at extremely high speed.

FIGS. 8 to 11 are diagrams showing still other embodiments of the present invention [apparatus]. While the previous embodiments (FIGS. 8 to 1) have shown vertical devices, this embodiment shows a horizontal device.

In this surface treatment apparatus, the processing chamber 50 is the first processing chamber 50.
9 and 10.
As shown in the figure, both processing chambers 50a.

50b has a vertically symmetrical structure. Therefore, in the following, only the first processing chamber 50a will be mainly explained, and the second processing chamber 50b will be mainly explained.
I will only refer to it as necessary.

The first processing chamber 50a has a bottom plate 51 and a top plate 5 as a pair of walls.
2 are faced to each other with a narrow interval d, and mesh-like anodes 53 and 54 are stretched inside each bottom plate 51 and top plate 52. These anodes 53, 54 are connected to a rectifier (not shown). Reference numerals 55 and 56 designate a pair of guides, in which a plate 58 having a small hole 5T as an object to be processed is placed in its groove.
'' One end and the other end are slidable to position the support ψ. One of the guides 55 is disposed intermittently along the inner surface of the partition wall 59, and as will be described later, the processing liquid flows through the gap 60 of the guide 55 from the bottom to the top as shown by the arrow in the figure. That's how it is. The conveyance of the plate 58 depends on the combination of the drive and idle roller groups 61, and the pass line 62 [11th
(see figure)], the plate 58 is conveyed to the first processing chamber 50a and the second processing chamber 50b. Tao No. 11
As shown, a portion of the roller group 61 is connected to a rectifier (not shown) to cathode the plate 58 and is adapted to act as a cathode. When the plate 58 is guided into the first processing chamber 5Qa, there is a narrow space between the lower surface 58a of the plate 58 and the bottom plate 51 for the processing solution A (hereinafter referred to as plating solution). A lower channel 63 with a distance d2 is formed, and a narrow upper channel 64 is formed between the upper surface 58b of the plate 58 and the top plate 52. Similar nozzle chambers 65 are connected to the lower flow path 63K of the first processing chamber 50a and the upper flow path 64 of the second processing chamber 50b, and the plating liquid is rectified and flowed at high speed. I'm trying to spray it. 66 is a collection chamber for plating solution A, which overflows compartment $59, collects plating solution A, and returns plating solution A to a plating tank (not shown).

The plate 58 can be freely locked in the plating solution A using a locking device (not shown).

Next, the effect will be explained. The plate 58 is the first processing chamber 5Oa
When the plating liquid A is guided by the guide 55 and each roller group 61 in a high-speed flow from the nozzle chamber 65 into the narrow flow path 63 on the lower side, the plating liquid A is applied to the mart plate 5B. It flows along the lower surface 58a from one end to the other end of the lower surface 58a, and a part of it flows into the upper channel 64 and fills it, but the plating solution A flows at high speed in the lower channel 58a. As a result, a negative pressure is generated by the plating liquid flowing in the upper channel 64 through each small hole 57 of the plate 58, as shown by the arrows in FIGS. 9 and 10. The plate 58 is sucked into the plating solution flow in the plating chamber 63, and not only the lower surface 59a of the plate 58 but also the inner surface of each small hole 57 is plated at a high speed.Then, the plate 58 reaches the second processing chamber 50b. If so, not only the upper surface 58b of the plate 58 but also the inner surface of the small hole 57 is plated.

FIG. 12 shows yet another embodiment of the horizontal device. In the embodiments shown in FIGS. 8 to 11, the processing chamber 50 is the first processing chamber 50a.
and a second processing chamber 50b, and plating the lower and upper surfaces of the plate 58 was sequentially performed in separate processing chambers, but in this embodiment, one processing chamber 67 is provided with a flow path switching device 68. A pressure cylinder 69 and a valve 70 are provided, which are alternately plated. Therefore, according to this embodiment, by switching the valve 70, the plating solution A is applied at high speed to the lower narrow channel 71 or the upper narrow channel 72, and the lower surface 58a1 of the plate 58 is side 5
8b are alternately plated, and the inner surfaces of the small holes 51 are also plated in the same manner as in the previous embodiment. ) The other configurations and operations are substantially the same as those of the embodiment shown in FIGS. 8 to 11, so redundant explanation will be omitted.

In the above description, plating treatment has been used as an example, but the present invention is of course not limited to this and can be similarly applied to other surface treatments.

As explained above, according to the present invention, the structure is such that a plate having small holes as a processing object is introduced into a processing chamber,
In the narrow space between the side surface of the plate and the wall of the processing chamber, a high-speed processing liquid is flowed along one side of the plate from one end to the other to treat the inner surface of the small holes.
[First invention] Also, a pair of walls are made narrow and face each other, and a plate having a small hole as an object to be treated can be freely positioned between them, and a length of the plate is arranged between a side surface of the plate and a wall surface corresponding to this side surface. The present invention is equipped with a processing chamber that forms a narrow flow path for processing liquid corresponding to the processing temperature, and a nozzle chamber that supplies a uniform high-speed flow of processing liquid to the narrow flow path within the processing chamber. It is possible to efficiently apply plating, etching, anti-corrosion, and other intended surface treatments at high speed to both sides of a plate having small holes as the object to be treated, and to uniformly apply high-etching to the inner surfaces of multiple small holes in the plate. In addition to speedy and efficient surface treatment, by moving the plate through a rocking device, the surface treatment around the small hole can be made uniform, and for example, during copper plating processing, it is possible to make the surface treatment around the small hole uniform. Even if it is possible to prevent the ``sloppy phenomenon'' that is easy to occur, the effects that can be obtained are enormous.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a main part of a vertical device showing an embodiment of the present invention, and FIGS. 2, 3, and 4 are respectively indicated by arrows 1-1 in FIG.
5, 6 and 7 are sectional views corresponding to FIG. 2 showing other embodiments of the vertical device, respectively; FIG. 8 is a perspective view of a broken main part of a horizontal device showing another embodiment, and FIGS. 9, 10, and 11 show arrows [--
12 is a sectional view corresponding to FIG. 9 showing another embodiment of the horizontal device. 1.30.50.67... Processing chamber 1a, soa... First processing chamber 1b%50
b ... Second processing chamber 2.3 28. Walls 2a, 3a... Wall surface d... Narrow spacing between walls 4.5.53
．． 54... Anode 6.41.42...
・ Rectifier 7.55.56 ... Guide 8.5B ... Plate 9 as the object to be processed ... Conveying device!・・・ Length of plate
... Processing liquid 16.66 ... Recovery chamber

Claims (6)

[Claims] (1) A plate with small holes as an object to be processed is guided into a processing chamber, and a high-speed flow is applied along one side of the plate from one end to the other in a narrow space between the side surface of the plate and the wall of the processing chamber. A method for surface treatment of a plate having small holes, in which the inner surfaces of the small holes are also surface-treated by flowing a treatment liquid applied thereto. (2) A method for surface treatment of a plate having small holes as set forth in claim 1, wherein a high-speed treatment liquid is alternately flowed onto one side of the plate. (3) A pair of narrow walls are made to face each other, and a plate having a small hole as an object to be processed can be freely positioned between them, and the length of the plate is set between a side surface of the plate and a wall surface corresponding to this side surface. Surface treatment of a plate having small holes, which includes a processing chamber that forms a narrow flow path for a corresponding processing liquid, and a nozzle chamber that supplies a uniform high-speed flow of the processing liquid to the narrow flow path within the processing chamber. Device. (4) The processing chamber includes a first processing chamber that forms a narrow flow path for the processing liquid between one side of the plate and a wall corresponding to this one side, and a first processing chamber that forms a narrow flow path for the processing liquid between one side of the plate and a wall corresponding to this one side. A surface treatment apparatus for a plate having small holes as set forth in claim S, comprising a second treatment chamber forming a narrow flow path for a treatment liquid between the second treatment chamber and a wall surface corresponding to the side surface. (5) The processing chamber forms narrow flow paths for the processing liquid between both sides of the plate and the corresponding wall surfaces, and a uniform high-speed flow of the processing liquid is alternately flowed into both narrow flow paths. 4. The surface treatment device for a plate having small holes according to claim 3, further comprising a flow path switching device for guiding the pores. (6) Surface treatment of a plate having small holes according to any one of claims 5 to 5, wherein the processing chamber is provided with anodes on each of a pair of walls and means for making the plate a cathode. Device.