JPS58178589A - Device for etching printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an etching device for bullet boards used in manufacturing printed boards for mounting electronic components. Due to the strong demand for packaging, printed board patterns are becoming increasingly sophisticated.

By the way, the pattern density of a bullet board is generally not uniform in each part, but in the conventional bullet board manufacturing process,
By immersing the entire printed board in the etching solution or spraying the etching solution uniformly onto the printed board, we ensure that each part is etched under the same conditions. Therefore, when the pattern is made finer, there are differences in the density density of each part of the pattern, in other words, differences in the blackened area ratio of each part of the pattern.As a result, parts that become over-etched knobs are generated, causing damage to the pattern. There is a problem that there is a high possibility of causing a disconnection accident or a defective finished pattern size, and that the island quality of the printed board deteriorates.

The present invention has been made with attention to such circumstances, and therefore, the etching surface of the bullet plate is virtually divided into a plurality of regions, and each region is subjected to etching under different conditions by passing a different etching solution supply route to each region. The object of the present invention is to provide an etching apparatus for a bullet plate which can solve the above-mentioned inconveniences by configuring one device so that liquids can be supplied to each device.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

A printed board holding mechanism 21 is used to position and hold the bullet board l, which is the entire area of 1111 m to be etched, virtually divided into a plurality of areas a, at a predetermined position.
It's straining. Specifically, the bullet plate holding mechanism 2 is a hardened structure so that a gripping member for gripping the bullet plate 1 can be raised and lowered by an actuator (not shown), and the bullet plate 1 is held by the gripping member. It is designed to be positioned at a predetermined position within the solution tank 8. In addition, a plurality of etching liquid supply paths 4 each having four terminal embankment ejection ports 4 are connected to each area a of the brit plate l in which each of the ejection ports 4a is positioned at a predetermined position. are placed facing each other. Specifically, each of the etching liquid supply paths 4 is made of a pipe material that penetrates one wall B& of the solution tank 8, and the starting end of each of these etching liquid supply paths 4 is blunt. , are connected to the etching liquid supply pot and the outlet r36a of the etching liquid supply pot 6 through the main path 5. That is, the etching liquid 7 sent out from the etching liquid supply pot 6 is sent through the main path 5 into each etching gauze supply path 4 . From the outlet 4a... to each corresponding area a... of the bullet plate 1...
lζ so that it is injected towards. Also, an etching liquid control means 8 is provided to separately control the amount of etching liquid supplied from each etching liquid supply path 4 to each of the areas a...l. Specifically, ○ indicates that the etching liquid control means 8 corresponds to the flow rate control valves 11 interposed in the middle of each of the etching liquid supply paths 4 and the respective area fields. Based on the antilog setting signal n...I, the crystal flow control valve 11
A flow rate control device 12 that separately controls the opening and closing of..., and a plurality of setting signals n... corresponding to the blackened area ratio i of each area a... are output to this flow rate control device 112. The flow rate setting device 18 is provided. In addition, the value of each setting signal n... for each area a... of the bullet board l...
- The blackened area ratio in each area is measured in advance, and each IC is determined based on the measured values. In other words, all of these things are fixed +! In... is set to a value such that an amount of etching liquid suitable for the pattern density of each area island can be supplied to each area a.... The method of measuring the blackened area ratio of each area a is as follows, for example. First, a pattern display pattern having the same pattern as the bullet plate l to be measured is created. And this pattern display teaching seven patterns I
When an electrical signal is converted using a TV or COD camera, etc., the electrical signal is converted into a black/white discrimination signal for each unit area using a binarization means (a digital signal indicating whether each unit area is black or white). (No. jI) Conversion is performed.Then, the black and white discrimination signals for all patterns are stored in the image memory with the address assigned, and the black and white discrimination of the unit area of the number of maples included in the specific evil castle a is performed. By extracting only the signal and performing arithmetic processing, the blackening area rate of the specific area a is calculated.By changing the designation of the area from time to time, the entire area a of the bullet board l... It is possible to know the blackening area rate for each color separately.The following processing regarding the black and white discrimination signal heat transferred from the binarization means can be performed using, for example, a normal microcomputer system. It can be done using

With such a configuration, the amount of etching liquid sprayed onto the printed board 11 to be etched is no longer uniform as in the conventional case.

In other words, an appropriate amount of etching liquid is supplied to each area M1 according to its blackened area ratio.

Therefore, etching progresses quickly in areas with a sparse pattern, while etching progresses slowly in areas with a dense pattern, so there is no inconvenience such as over-etched areas, and the finish is uniform and dimensional accuracy is achieved. It is possible to obtain a high-quality printed board with a high butter flow.

Note that the etching liquid control means is not limited to one that controls the amount of etching liquid, and for example, an etching liquid of +11 [f or PH corresponding to the blackened area ratio J of each area of the bullet plate is applied to each area. The concentration or r of the etching solution passing through each etching solution supply path is such that it can be supplied.
A configuration in which tt is controlled separately may also be used.

As explained below, the present invention virtually divides the etched surface of a printed circuit board into a plurality of regions, and applies an etching solution under different conditions to each region through a different etching solution supply path. The structure was designed so that the degree of etching progress in each area could be controlled individually according to the pattern density in each area, so over-etching could occur, resulting in wire breakage or poor finishing dimensions. It is possible to wipe out the inconvenience of causing problems, and the quality of bullet plates with particularly fine patterns can be greatly improved.
Accordingly, it is possible to provide a printed board etching apparatus that can perform etching.

[Brief explanation of drawings]

Figure W41 is a perspective view showing one embodiment of the present invention, and Figure 2 is a schematic front view showing a bullet plate in one embodiment. DESCRIPTION OF SYMBOLS 1... Printed board a... Zone 2... Bullet board holding mechanism 4... Etching liquid supply path 4a... Spout port 8... Etching liquid control means 1
1...Flow m11m valve 12...Flow rate control device 1F
...Flow rate setting device agent Patent attorney Hiroshi Akazawa

Claims (1)

[Claims] A printed board holding mechanism that positions and holds a printed board in a predetermined position, which virtually divides the entire surface of the surface to be etched into a plurality of areas, and a jetting port that faces each area of the held bullet board. a plurality of etching solution supply paths which are arranged in such a manner that the etching solution is injected from each of these jetting ports toward each of the areas, and an amount, concentration, or pH corresponding to the blackened area ratio of each area of the bullet plate
Etching solution control means for separately controlling the amount, concentration or pH of the etching solution passing through each of the etching solution supply paths so that the etching solution can be supplied to each area. Etching equipment for printed boards.