JPS5817716A - Manufacture for quartz oscillator - Google Patents
Manufacture for quartz oscillatorInfo
- Publication number
- JPS5817716A JPS5817716A JP11594681A JP11594681A JPS5817716A JP S5817716 A JPS5817716 A JP S5817716A JP 11594681 A JP11594681 A JP 11594681A JP 11594681 A JP11594681 A JP 11594681A JP S5817716 A JPS5817716 A JP S5817716A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- film
- metal layer
- crystal
- unnecessary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title claims abstract 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract 9
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 239000013078 crystal Substances 0.000 claims abstract description 40
- 238000005530 etching Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 16
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 8
- 229910052737 gold Inorganic materials 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract 3
- 239000000243 solution Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- DKNPRRRKHAEUMW-UHFFFAOYSA-N Iodine aqueous Chemical compound [K+].I[I-]I DKNPRRRKHAEUMW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Abstract
Description
【発明の詳細な説明】
本発明はフォトリソグラフィ技術により水晶振動子管製
造する場合水晶のサイドエツチングにより生じた不要金
属ａｔ除去する工程に係り、該不要金属膜を容易に除去
出来る小形水晶振動子の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a process of removing unnecessary metal at which is generated by side etching of crystal when manufacturing a crystal resonator tube by photolithography technology, and provides a small crystal resonator in which the unnecessary metal film can be easily removed. Relating to a manufacturing method.
薄板水晶板より水晶振動子を製造すゐ方法としてフォト
リソグラフィ技術による製造方法がある。As a method for manufacturing a crystal resonator from a thin crystal plate, there is a manufacturing method using photolithography technology.
この一般的な工Ｓｔ−第１因に示し、第２図に水晶板を
所要の形状にエツチングする場合水晶のサイドエツチン
グにより不要の金属膜を生じた状況を示す。This general process is shown in Fig. 2, and Fig. 2 shows a situation in which an unnecessary metal film is produced due to side etching of the crystal when etching a crystal plate into a desired shape.
図中１は薄板水晶膜、２は金属層、３はレジスト膜、４
は不要金属膜領竣會示す。In the figure, 1 is a thin crystal film, 2 is a metal layer, 3 is a resist film, and 4 is a thin crystal film.
indicates unnecessary metal film completion.
工程のｌｉ！に従っτｍ明すると
（１） （２）に示す如く薄板水晶板１の両面に金属
層２を蒸着等の手段により付着さす。Process li! Accordingly, when τm is determined, metal layers 2 are deposited on both sides of the thin crystal plate 1 by means such as vapor deposition, as shown in (1) and (2).
（１＠に示す如く金属ＪＩＩ２の上にレジスト＃３′ｆ
ｔ塗布する。(Resist #3'f on metal JII2 as shown in 1@)
Apply t.
Ｇｌ） （ｅ）Ｋ示す如くレジスト１Ｉ３ｔ−パター
易ングしこのレジスト膜３をマスクとして金属層２に選
択エツチング管施す。Gl) (e) As shown in K, a resist 1I3t is patterned and a selective etching tube is applied to the metal layer 2 using the resist film 3 as a mask.
（５）＠に示す如くレジスト１ＩＩ３ｆ：除去する。(5) As shown in @, resist 1II3f: removed.
これＫより上記金属層を電極とする小形水晶振動子が完
成する。From this K, a small crystal resonator using the metal layer as an electrode is completed.
しかしながら上記（４）の工程にシいて、特ＫＤＴカッ
ト及びＣＴカントの水晶をエツチングすると第２ＦＩ！
ＪＫ示す如く薄板水晶−１と密着しない不要金属膜４が
水晶のサイドエツチングにより生じる。However, in step (4) above, if you etch the special KDT cut and CT cant crystals, the 2nd FI!
As shown in JK, an unnecessary metal film 4 which does not come into close contact with the thin crystal crystal 1 is generated due to side etching of the crystal.
かかる不要金属膜４は、厚さ０．１（ｍｍ）のＣＴ−１
カツトの場合、約０．１ Ｓ （ｍｍ）＆ｃ％ｋ及び水
晶振動子としてのＱｔ低下させる。Such unnecessary metal film 4 is CT-1 with a thickness of 0.1 (mm).
In the case of a cut, the Qt as a crystal resonator is reduced by approximately 0.1 S (mm) &c%k.
この為従来扛し−ザ光ｌｌｌ郷を用いてこの不要金属膜
を手作業により敢除いていた。仁のため手間がかかる欠
点があった。For this reason, in the past, this unnecessary metal film was manually removed using a comb. It had the disadvantage that it was time-consuming because it was a jin.
本発明の目的は上記の欠点ｔなくするために不要金属膜
を容易に取除くことが出来るｑの高い小形水晶振動子の
製造方法の提供にある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a small crystal resonator with a high q, in which unnecessary metal films can be easily removed in order to eliminate the above-mentioned drawback t.
、本発明は上記の目的を達成するために、１、所定の厚
み１有する薄い水晶板の両面に金属層を形成する工程、
該金属層表面にレジスト膜を塗布しバターニングする工
程、該レジスト膜管マスクとして該金属層を選択エツチ
ングする工程、該レジスト膜および金属層管マスクとし
て水晶板をエツチングし、所定の水晶振動子形状を得る
工程、その後上記レジスト膜を残存させたｉｔ上記金属
膜の不１１部領域ｔエツチングする工程、１有すること
を特徴とする水晶振動子の製造方法。In order to achieve the above object, the present invention includes the following steps: 1. Forming metal layers on both sides of a thin crystal plate having a predetermined thickness 1;
A step of applying a resist film to the surface of the metal layer and buttering it, a step of selectively etching the metal layer as a tube mask of the resist film, etching a crystal plate as a mask of the resist film and the metal layer tube, and forming a predetermined crystal oscillator. 1. A method for manufacturing a crystal resonator, comprising the steps of: obtaining a shape; and then etching an incomplete region of the metal film with the resist film remaining.
乙 前記金属層が、水晶板表面に形成されたクロム、金
の２層構造から成り、該金属層の第１回目Ｏエッチング
工程では金、クロムのエツチングを順次別個に行ない、
該金属層の第２回目のエッチングエ和ではクロム、金の
エツチン゛グを順次別個に行なうことｔ−４１１１ｋと
する特許請求の範囲第１項記載の水晶振動子の製造方法
である。(B) The metal layer consists of a two-layer structure of chromium and gold formed on the surface of the crystal plate, and in the first O etching process of the metal layer, gold and chromium are etched separately in sequence,
The method of manufacturing a crystal resonator according to claim 1, wherein in the second etching process of the metal layer, etching of chromium and gold is carried out separately in sequence (t-4111k).
以下本発明の１実施例につき説明する。実施例として第
１１１１（Ａ）Ｋ示す工＠にて金属層２は最初に薄板水
晶板ｌと密着度のよいクロム會蒸着し次に金管蒸着する
０次に＠）Ｋ示す工程に−ｔレジスト膜３とし′″Ｃ框
ノボラック樹脂を使用する０次Ｋ（２）に示す工ｓＫ″
Ｃ沸酸會主成分としたエツチング′ｗｉに１水晶を所要
の形状にエツチングする場合水晶のサイドエツチングに
より生じた不要の金属膜４ｔ−龜除く方法とし″Ｃは、
最初に過塩素酸液によｐクロム管エツチングし、次によ
う素とよう化カリウムの混合液により金管エツチングす
る。Ｃの方゛法即ち不要金属膜のみを溶かす液にてエラ
５−’＞ｉすれば、多数の第２１１に示す状況の水晶を
同時に上記説明の液の中につけることで可能であるので
、容易に不用金属膜を取除くことが出来る。One embodiment of the present invention will be described below. As an example, in the process shown in No. 1111(A)K, the metal layer 2 is first vapor-deposited with chromium, which has good adhesion to the thin crystal plate l, and then is vapor-deposited with brass. Membrane 3 is 0-order K (2) using C frame novolac resin.
Etching using fluorocarbon acid as the main component 1 When etching a crystal into the desired shape, a method of removing unnecessary metal film 4t produced by side etching of the crystal is used.
First, the p-chromium tube is etched with a perchloric acid solution, and then the brass tube is etched with a mixed solution of iodine and potassium iodide. By using method C, that is, using a solution that dissolves only the unnecessary metal film, it is possible to do so by simultaneously soaking a large number of crystals in the situation shown in No. 211 in the solution described above. Unnecessary metal film can be easily removed.
以上説明した如く本発明によれば、水晶を所要の大きさ
にエツチングする場合水晶のサイドエツチングにより生
じた不要の金属膜を不要の金属膜のみｔ溶かす液にてエ
ツチングすることにより容易Ｋｌ！除くことが出来、Ｑ
の高い小形の水晶振動子が容易ＫＪｌ造出来る効果があ
る。As explained above, according to the present invention, when etching a crystal to a desired size, an unnecessary metal film produced by side etching of the crystal is easily etched with a solution that dissolves only the unnecessary metal film. Can be removed, Q
This has the effect that a small crystal resonator with high KJl can be easily manufactured.
第１図はフォトリソグラフイタ技術により水晶を製造す
る工程説明図、＃ｌ！２図は水晶上所要の太き＠にエツ
チングする場合水晶のサイドエツチングにより不要の金
属膜倉生じた状況を示す図でめる・
゛図中１は薄板水晶板、２は金属膜、３はレジスト膜、
４は不要金属膜領域を示す・
第１図
第２図Figure 1 is an explanatory diagram of the process of manufacturing crystal using photolithography technology, #l! Figure 2 shows the situation where unnecessary metal film is formed due to side etching of the crystal when etching to the required thickness on the crystal. In the figure, 1 is a thin crystal plate, 2 is a metal film, and 3 is a metal film. resist film,
4 indicates unnecessary metal film area・Figure 1Figure 2
Claims (1)
成する工程、該金属表面にレジスト膜を塗布しパターニ
ングする工程、該レジスト膜をマスクとして皺金属層を
選択エツチングする工程、該レジスト膜および金属層を
マスクとして水晶板ｔエツチングし、所定の水晶振動子
形状を得る工程、その後上記レジスト膜管残存させたま
ま上記金属層の不１’部領域管エツチングする工程、１
有することを特徴とする水晶振動子の製造方法。 ２、前記金属層が、水晶板表面に形成されたり党ム、金
の２層構造から成夛、紋金属層の＃！１回目のエツチン
グ工程では金、クロムのエツチングを順次別個に行ない
、該金属層の第２回目。 エツチング工程ではクロム、金のエツチングを順次別個
に行なう仁とを特徴とする特許請求〇範範囲第１項記載
の水晶振動子の製造方法。[Claims]! , a step of forming a metal layer on both sides of a thin quartz plate having a predetermined thickness, a step of applying and patterning a resist film on the surface of the metal, a step of selectively etching the wrinkled metal layer using the resist film as a mask, and a step of selectively etching the wrinkled metal layer, the resist film. and a step of etching a quartz crystal plate using the metal layer as a mask to obtain a predetermined crystal resonator shape, and a step of etching the uneven region of the metal layer while leaving the resist film tube.
A method for manufacturing a crystal resonator, comprising: 2. The metal layer is formed on the surface of the crystal plate, consists of a two-layer structure of gold, and has a patterned metal layer. In the first etching process, gold and chromium are etched separately in sequence, and in the second etching process, the metal layer is etched separately. The method for manufacturing a crystal resonator according to claim 1, wherein the etching step includes etching chromium and gold separately in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11594681A JPS5817716A (en) | 1981-07-24 | 1981-07-24 | Manufacture for quartz oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11594681A JPS5817716A (en) | 1981-07-24 | 1981-07-24 | Manufacture for quartz oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5817716A true JPS5817716A (en) | 1983-02-02 |
Family
ID=14675076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11594681A Pending JPS5817716A (en) | 1981-07-24 | 1981-07-24 | Manufacture for quartz oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5817716A (en) |
-
1981
- 1981-07-24 JP JP11594681A patent/JPS5817716A/en active Pending
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