JPS58175802A - Thick film thermistor mounted on flexible substrate - Google Patents
Thick film thermistor mounted on flexible substrateInfo
- Publication number
- JPS58175802A JPS58175802A JP4426783A JP4426783A JPS58175802A JP S58175802 A JPS58175802 A JP S58175802A JP 4426783 A JP4426783 A JP 4426783A JP 4426783 A JP4426783 A JP 4426783A JP S58175802 A JPS58175802 A JP S58175802A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film thermistor
- flexible
- flexible substrate
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、熱可塑性可撓性樹脂板に、可撓性電気良導体
と共に厚膜サーミスタを取りつけ他の１枚の熱可塑性可
撓性樹脂板にて密封した厚膜サーミスタに関するもので
ある。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention provides a method of attaching a thick film thermistor together with a flexible electrical conductor to a flexible thermoplastic resin plate, and attaching a thick film thermistor to another flexible thermoplastic resin plate. The invention relates to a thick film thermistor that is hermetically sealed.
従来の厚膜サーミスタを第１図により説明する。 A conventional thick film thermistor will be explained with reference to FIG.
１は厚膜サーミスタでこの厚膜サーミスタの電極部４．
４′にリード線５、・５′が半田付され、このリード線
付サーミスタは樹脂注形用ケース３の中にセットされこ
の中に、樹脂２を注入し、厚膜サーミスタはモールドさ
れている。1 is a thick film thermistor, and the electrode part 4 of this thick film thermistor is a thick film thermistor.
Lead wires 5, 5' are soldered to 4', and this thermistor with lead wires is set in a resin casting case 3, resin 2 is injected into this, and the thick film thermistor is molded. .
この厚膜サーミスタは、耐湿性にすぐれているか、第４
図に示すごとく加工時間を多く要し、取りあつかいの困
難さもあり、製造コストが高い、加［時の破損不良が多
い、また形状が太き（なるため取付体積が大きいのでせ
まいところにセットしにくい等の欠点を有している。This thick film thermistor has excellent moisture resistance or
As shown in the figure, it requires a lot of processing time, is difficult to handle, has high manufacturing costs, is prone to breakage during processing, and has a thick shape (as a result, the mounting volume is large, so it cannot be installed in a narrow place. It has disadvantages such as being difficult to use.
本発明は、かかる欠点を改良するためになされたもので
ある。The present invention has been made to improve these drawbacks.
即ち厚膜サーミスタを可撓性な熱可塑性樹脂板に形成し
た２本の電気良導体先端に半田付し、その上部に他の熱
可塑性、可撓性樹脂板をかぶせ、この上下の板を加熱圧
着法、超音波圧着法にて圧着せしめることにより上記欠
点を改良せんとしたものである。In other words, a thick film thermistor is soldered to the tips of two good electrical conductors formed on a flexible thermoplastic resin plate, another thermoplastic, flexible resin plate is placed on top of the thick film thermistor, and the upper and lower plates are heat-pressed. This is an attempt to improve the above-mentioned drawbacks by crimping using an ultrasonic crimping method.
以下本発明の一実施例を第２図および第５図に基いて説
明する。An embodiment of the present invention will be described below with reference to FIGS. 2 and 5.
１１は厚膜サーミスタで、このサーミスタの電極部１３
．１３′を、塩ビ系の熱可塑性、可撓性樹脂板１２上に
形成した銅製の電気良導体１４．１４′先端に半田付し
て、この上に塩％系の熱可塑性、可撓性樹脂板１５をか
ぶせ、熱圧着法により、圧着した。この厚膜サーミスタ
は、従来の厚膜サーミスタに比較し、第５図のごとく作
業法が簡単で生産性は１００倍と向上し、加工時の不良
も大幅に減少できた。11 is a thick film thermistor, and the electrode part 13 of this thermistor
．． 13' is soldered to the tip of a copper electrical conductor 14 and 14' formed on a PVC-based thermoplastic, flexible resin board 12, and a salt-based thermoplastic, flexible resin board is placed on top of this. No. 15 was covered, and crimping was performed using a thermocompression bonding method. Compared to conventional thick film thermistors, this thick film thermistor is easier to work with, as shown in FIG. 5, productivity is 100 times higher, and defects during processing can be significantly reduced.
第６図に他の実施例を示す。これは実施例１と製作方法
は、まったく同じだが、サーミスタ部中央の熱可塑性、
可撓性板１７に穴１８をあけたものであ、る。このこと
により、熱感受性を増すと共に２つの電極間１９．１９
′間に水膜が連続して長時間形成されるのを防ぎ耐湿性
の向上をはかった。FIG. 6 shows another embodiment. The manufacturing method is exactly the same as in Example 1, but the thermoplastic material in the center of the thermistor part,
A hole 18 is made in a flexible plate 17. This increases the thermal sensitivity and increases the distance between the two electrodes.
The aim was to improve moisture resistance by preventing a water film from forming continuously over a long period of time.
他の実施例として、実施例１の半田付を電気導伝性接着
剤におきかえたものも製作したが、良好な結果を得た。As another example, one was manufactured in which the soldering of Example 1 was replaced with an electrically conductive adhesive, and good results were obtained.
以上説明した如く本発明によれば、生産性にすぐれ、不
良の少ない、小さく取り扱いやすい厚膜サーミスタを提
供することができる。As explained above, according to the present invention, it is possible to provide a thick film thermistor that is small and easy to handle, which has excellent productivity and few defects.
第１図は従来の厚膜サーミスタ正面図、第２図は本発明
厚膜サーミスタの正面図、第３図：ま本発明厚膜サーミ
スタの断面図、第４図は従来の厚膜サーミスタの製造法
を説明する図、第５図は本発明厚膜サーミスタの製造法
を示す図、第６図は本発明厚膜サーミスタの第２図と異
なる実施例を示す図である。
１・・・厚膜サーミスタ本体、２・・・注形樹脂、３・
・・注形ケース、４．４′・・・サーミスタ電極部、５
．５′・・・リード線、１１・・・厚膜サーミスタ本体
、１２・・・塩ビ系熱可塑性可撓性樹脂板、１３．１３
′・・・厚膜サーミスタ電極部、１４．１４′・・・可
撓性銅製電気良導体、１５・・・塩ビ系熱可塑性可撓性
樹脂板、１７・・・塩ビ系熱可塑性可撓性樹脂板、１８
・・・穴、１９．１９′・・・厚膜サーミスタ電極、２
０・・・厚膜サーミスタ本体、２１．２１′・・・可撓
性銅製電気良導体。
ｆＪ＋の め２ω 第３図峯４１！ｌ
や５０Fig. 1 is a front view of a conventional thick film thermistor, Fig. 2 is a front view of the thick film thermistor of the present invention, Fig. 3 is a sectional view of the thick film thermistor of the present invention, and Fig. 4 is a conventional thick film thermistor manufactured. FIG. 5 is a diagram illustrating the manufacturing method of the thick film thermistor of the present invention, and FIG. 6 is a diagram showing a different embodiment from FIG. 2 of the thick film thermistor of the present invention. 1... Thick film thermistor body, 2... Molding resin, 3...
...Casting case, 4.4'...Thermistor electrode part, 5
．． 5'... Lead wire, 11... Thick film thermistor body, 12... PVC thermoplastic flexible resin plate, 13.13
' Thick film thermistor electrode part, 14.14' Flexible copper electrical conductor, 15 PVC thermoplastic flexible resin plate, 17 PVC thermoplastic flexible resin Board, 18
...hole, 19.19'...thick film thermistor electrode, 2
0... Thick film thermistor body, 21.21'... Flexible copper electrical conductor. fJ+ no Me2ω Figure 3 Mine 41! l
Ya 50
Claims (1)
形成させた、熱可塑性可撓性樹脂板（１２）に厚膜サー
ミスタ（１１）をのせ、その電極部（１３）を、電気良
導体（１４）と半田付し、この上に熱可塑性可撓性板（
１５）を加熱圧着したことを特徴とする可撓性基板に取
りつけた圧膜サーミスタ。 ２、電気良導体（１４）と、厚膜サーミスタの電極部（
１３）を導伝性接着剤にて接合した特許請求の範囲第１
項記載の可撓性基板に取りつけた厚膜サーミスタ。 ３、熱可塑性可撓性板（１２）に、サーミスタ部記載の
可撓性基板に取りつけた厚膜サーミスタ。[Claims] 1. A thick film thermistor (11) is placed on a thermoplastic flexible resin plate (12) on which a flexible electrical conductor (14) made of a prepared alloy is formed in advance, and its electrode portion ( 13) is soldered to a good electrical conductor (14), and a thermoplastic flexible plate (
15) A pressure film thermistor attached to a flexible substrate characterized by heat-compression bonding. 2. Good electrical conductor (14) and thick film thermistor electrode part (
13) is bonded with a conductive adhesive.
A thick film thermistor attached to a flexible substrate as described in Section 1. 3. A thick film thermistor attached to the flexible substrate described in the thermistor section on the thermoplastic flexible plate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4426783A JPS58175802A (en) | 1983-03-18 | 1983-03-18 | Thick film thermistor mounted on flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4426783A JPS58175802A (en) | 1983-03-18 | 1983-03-18 | Thick film thermistor mounted on flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58175802A true JPS58175802A (en) | 1983-10-15 |
Family
ID=12686735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4426783A Pending JPS58175802A (en) | 1983-03-18 | 1983-03-18 | Thick film thermistor mounted on flexible substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175802A (en) |
-
1983
- 1983-03-18 JP JP4426783A patent/JPS58175802A/en active Pending
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