JPS5848441A - Electron circuit device - Google Patents

Abstract

PURPOSE:To simplify the manufacturing process of the title device and to obtain a solid structure, excellent waterproof and humidity resistance properties for the device by a method wherein an IC chip is directly adhered on a conductor pattern using die-bonding and the like, and an IC electrode and the finger of the conductor pattern are coupled using a wire-bonding. CONSTITUTION:An IC chip 6 is die-bonded on the gold-plated layer 5 of the trapezoidal part 3 of the conductor pattern using an Au-Si eutectic material or a conductive bonding agent 8. Then, each electrode of the IC chip 6 and the finger part 2 of the conductor pattern corresponding to said electrode are wire- bonded using a gold or aluminum wire 7, and then a necessary electron circuit is formed on an insulating film 1 by attaching or forming a required electron circuit constituting element. Then, the processed insulating film 1 is folded back in the center part, and sealed by the same bonding agent 12 which was used on the peripheral region of the insulating film 1 or by performing thermal-press welding in such a manner that the electron circuit part will be enveloped.

Description

[Detailed Description of the Invention] The present invention is based on a hybrid IC! Related to child circuit devices.

Conventional 9 hybrid IC manufacturing technology is a manufacturing technique for electronic circuit devices that are used with a high degree of reliability in all kinds of harsh environments such as automobiles and motorcycles, including mechanical, chemical, physical, weather, and accidental environments. has not yet been fully developed. , , this is the first one! J1 is a rabbit that provides electronic circuits using hybrid ICE that can withstand such harsh environments, and the latest hybrid ICE manufacturing technology? Keru Noh! I:IL
For child assembly and mounting, the film carrier method is well known. This method is based on: (1) ability to conduct electrical tests after device assembly; There are also advantages such as being able to reduce the area occupied by the top. It is something. In this 9 method, there is usually a bang in the IC, tip electrode, and part.

(It is necessary to perform a process to remove the protrusions. Unfortunately, this process is not very compact, and therefore, ATTB has not been widely used.The present invention is an improvement on the film carrier method.1.
Conventional electronic circuit assembly techniques such as assembly techniques such as die assembly 9 and wire assembly are used as they are, and the difficult-to-process bump processing of the electrodes of IC chips is not used, making it suitable for use in harsh environments such as automobiles. We have succeeded in producing electronic circuit devices that are mechanically robust, weather resistant, water resistant, and moisture resistant for use in.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic circuit device according to the present invention and a manufacturing method thereof will be explained with reference to the drawings.

AT diagram! 2 and 3 are explanatory diagrams illustrating a method of manufacturing an electronic circuit device according to an example of the present invention. 1st
The figure is a plan view of an insulating film 1 for a carrier forming the main body of an electronic circuit device according to the present invention, and the insulating film 1 is a flexible polyimide film having a thickness of about 25 to ZQOμ! By forming a conductor pattern on one or both sides of the insulating film 10 using a conventional technique of forming a conductor pattern on a flexible printed circuit board, a desired conductor pattern, an IC electrode (finger part 2 to be connected, a base part 3 on which an IC chip is placed) are formed. ．Form the part 4 etc. that plays the role of electromagnetic shielding.Next, form the base part 3 with 4 turns of these conductors). The tip of the finger part 2 is plated with gold or expanded silver 5.

Next, FIG. 2 is a sectional view of the insulating film shown in FIG. 1, and the present invention will be further explained with reference to FIG. #r2. An IC chip 6t is glued onto the gold plating layer 5 of the base portion 3 of the conductor pattern using KAu-8i eutectic or conductive adhesive 8.

Next, each electrode of the IC chip 6 and the corresponding finger portion 2 of the conductor pattern are bonded using gold or aluminum wire 7, and necessary electronic circuit components are connected between the electrodes. Install or form 8R
A necessary electronic circuit is formed on the film 1. In addition, 9
is the adhesive for the conductor...'turn.

Next, the processed insulating film 1 is folded 9 times in the center, and thermocompression bonding 2 is carried out using adhesive 12 applied around the periphery of the insulating film 1 so as to wrap around the electronic circuit part.
It is sealed as shown in FIG. An electromagnetic shield 4 is formed on the right half of the insulating film 1, so that the electronic circuit portion can be electromagnetically shielded. Note that when folding the insulating film, another insulating film 10, an insulating foam sheet, a silicone resin, or the like is interposed so that the electromagnetic shield 4 does not touch the IC electrodes or the like. In particular, if electromagnetic shielding is not required, seal with just an insulating film.

The electronic circuit device sealed with the insulating film 1 thus produced is mounted on an insulating substrate 15 as shown in FIG. That is, the electrode portion of the electronic circuit device and the corresponding conductor wiring portion 14 provided in advance on the insulating substrate 15 are connected through the hole 11 provided in the insulating film 1.
・Join with soldering 13. FIG. 3 shows a cross-sectional view of an embodiment of an electronic circuit device according to the present invention. Note that 16' is an element such as a resistor.

In the above explanation, the bonding between the insulating film 1 and the substrate 15 is carried out through holes 1 provided in the insulating film 1 as shown in FIG.
1, but in addition to this, as shown in Fig. 4, fingers 2' were formed on the back side of the conductor in correspondence with the electrode finger 2, and a hole 11 was formed in a part of both fingers. Through-hole plating is performed to connect conductors,
It is also possible to connect the lower conductor arm turn and the conductor arrangement eaves 14 formed on the substrate 15.

According to the present invention, there is no need for a pipe-processed tube at the electrode part of the IC chip in the film carry Y method, and the IC chip is directly bonded onto the conductor pattern using a die-end or the like.
Since the C electrode, the conductor pattern finger, and the T wire are bonded together, the manufacturing process is simplified and the process of molding the IC part with resin in the conventional film carrier method is no longer necessary. The work of incorporating the formed optical IC into another electronic circuit is also no longer necessary. Furthermore, according to the present invention, an electronic circuit is formed on the insulating film for the carrier, and this insulating film is also used for sealing, so the work process is shortened and the structure is robust, waterproof and waterproof. It has become possible to provide electronic circuits with superior structures at low cost.

[Brief explanation of the drawing]

The figures relate to the present invention; FIG. 1 is a plan view showing an example of an insulating film on which a conductive pattern is formed; FIG. 2 is a cross-sectional view thereof;
FIG. 3 is a sectional view of an example of an electronic circuit device, and FIG. t7g4 is a sectional view of an embodiment using through holes. In the drawing, 1 is an insulating film, 2 is a part of the finger for the electrode of the IC chip, 2' is the finger ξP in the through hole, 3 is the base part for the IC chip, 4 is the conductor/arm turn for electromagnetic shielding, and 5 is the part of the finger for the electrode of the IC chip. plating layer, 6 is an IC chip, 6' is an electronic circuit component, 7 is a wire, 8 is an adhesive for bonding, 9 is an adhesive for a conductive pattern, 10 is another insulating film, 11 is an insulating film 19 holes, 12 is a sealing adhesive, 14 is a conductor wiring portion of a substrate 15, and 15 is an insulating substrate. Patent Applicant: Sumitomo Electric Industries, Ltd. Representative Patent Attorney: Shibu Mitsuishi (and 1 other person) Figure 1 Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) Form an insulating film or conductor pattern on one or both sides of the conductor pattern, adhere the IC chip on the conductor pattern, and connect the electrode points of the IC chip to the corresponding part of the conductor pattern and all the wires. Connect the wires and attach the necessary electronic circuit components to form the electronic circuit 9. Fold back the -2 part of the insulation film base and attach the periphery of the insulation film 1 m apart, and the front electronic circuit part will be formed. An electronic circuit device that is sealed. (2) An electronic circuit device according to claim 1, characterized in that a shielding or conductor I-turn is formed on the folded portion of the insulating film. ,
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