JPS58172838A - 電子回路内蔵型リレ− - Google Patents
電子回路内蔵型リレ−Info
- Publication number
- JPS58172838A JPS58172838A JP5430682A JP5430682A JPS58172838A JP S58172838 A JPS58172838 A JP S58172838A JP 5430682 A JP5430682 A JP 5430682A JP 5430682 A JP5430682 A JP 5430682A JP S58172838 A JPS58172838 A JP S58172838A
- Authority
- JP
- Japan
- Prior art keywords
- base
- wiring board
- printed wiring
- mechanical drive
- storage chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 5
- 239000000565 sealant Substances 0.000 claims description 5
- 240000005893 Pteridium aquilinum Species 0.000 claims 1
- 235000009936 Pteridium aquilinum Nutrition 0.000 claims 1
- 238000009429 electrical wiring Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5430682A JPS58172838A (ja) | 1982-03-31 | 1982-03-31 | 電子回路内蔵型リレ− |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5430682A JPS58172838A (ja) | 1982-03-31 | 1982-03-31 | 電子回路内蔵型リレ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58172838A true JPS58172838A (ja) | 1983-10-11 |
| JPH0129006B2 JPH0129006B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-07 |
Family
ID=12966881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5430682A Granted JPS58172838A (ja) | 1982-03-31 | 1982-03-31 | 電子回路内蔵型リレ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58172838A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166848U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1984-10-08 | 1986-05-08 | ||
| JPS64240U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1987-06-19 | 1989-01-05 | ||
| JPH0257533U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-09-28 | 1990-04-25 | ||
| JPH07169380A (ja) * | 1994-12-13 | 1995-07-04 | Tokai Rika Co Ltd | リレー装置 |
-
1982
- 1982-03-31 JP JP5430682A patent/JPS58172838A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166848U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1984-10-08 | 1986-05-08 | ||
| JPS64240U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1987-06-19 | 1989-01-05 | ||
| JPH0257533U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-09-28 | 1990-04-25 | ||
| JPH07169380A (ja) * | 1994-12-13 | 1995-07-04 | Tokai Rika Co Ltd | リレー装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129006B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-06-07 |